Patents by Inventor Toshio Mizowaki

Toshio Mizowaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Rosin-modified product, flux composition, liquid flux, flux cored solder and solder paste
    Patent number: 11794288
    Abstract: A rosin-modified product being a reactant of a rosin or a rosin derivative and an alkanolamine represented by a following Formula (1) NH3-n—(R—OH)n(n?3); or??(1) being produced by a reaction of a rosin or a rosin derivative, an organic acid and an alkanolamine.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: October 24, 2023
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventor: Toshio Mizowaki
  • ROSIN-MODIFIED PRODUCT, FLUX COMPOSITION, LIQUID FLUX, FLUX CORED SOLDER AND SOLDER PASTE
    Publication number: 20210101232
    Abstract: A rosin-modified product being a reactant of a rosin or a rosin derivative and an alkanolamine represented by a following Formula (1) NH3-n—(R—OH)n(n?3); or??(1) being produced by a reaction of a rosin or a rosin derivative, an organic acid and an alkanolamine.
    Type: Application
    Filed: September 11, 2020
    Publication date: April 8, 2021
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventor: Toshio Mizowaki
  • Electrically conductive adhesive agent, joined body, and joint
    Patent number: 10650939
    Abstract: This invention has an object to provide an electrically conductive adhesive agent which enables a thermosetting resin to cure in a short time. It contains electrically conductive metallic powder including Sn, the thermosetting resin; an acid-anhydride-based hardening agent and an organic acid. The electrically conductive metallic powder and the organic acid are reacted during a heating process to produce an organic acid metal salt which is used as hardening accelerator. It enables thermosetting resin to cure in a short time, for example, a time equivalent to a time that is required for the general reflow process.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: May 12, 2020
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Toshio Mizowaki, Yoshinori Takagi
  • Electrically Conductive Adhesive Agent, Joined Body, and Joint
    Publication number: 20160194525
    Abstract: This invention has an object to provide an electrically conductive adhesive agent which enables a thermosetting resin to cure in a short time. It contains electrically conductive metallic powder including Sn, the thermosetting resin; an acid-anhydride-based hardening agent and an organic acid. The electrically conductive metallic powder and the organic acid are reacted during a heating process to produce an organic acid metal salt which is used as hardening accelerator. It enables thermosetting resin to cure in a short time, for example, a time equivalent to a time that is required for the general reflow process.
    Type: Application
    Filed: April 15, 2014
    Publication date: July 7, 2016
    Inventors: Toshio Mizowaki, Yoshinori Takagi
  • Electrically Conductive Joining Agent and Solder Joint
    Publication number: 20160194526
    Abstract: This invention has an object to provide an electrically conductive joining agent which enables a thermosetting resin to cure in a short time. It contains electrically conductive metallic powder including Sn of 40% or more, thermosetting resin, an acid-anhydride-based hardening agent and an organic acid. The electrically conductive metallic powder and the organic acid are reacted during a heating process to produce an organic acid metal salt which is used as hardening accelerator. It enables thermosetting resin to cure in a short time, for example, a time equivalent to a time that is required for the general reflow process.
    Type: Application
    Filed: April 15, 2014
    Publication date: July 7, 2016
    Inventors: Toshio Mizowaki, Yoshinori Takagi