Abstract: Provided is a coating film that can more reliably exhibit an excellent water repellency and an excellent oil repellency. This water- and oil-repellent coating film is a coating film formed on a surface of a material in order to impart water repellency and oil repellency, wherein (1) the coating film contains a metal oxide-containing composite particle; (2) the composite particle contains a) a metal oxide particle and b) a covering layer that contains a polyfluoroalkyl methacrylate resin and is formed on the surface of the metal oxide particle; and (3) a value obtained by dividing the fluorine content (weight %) of the composite particle by a surface area (m2/g) of the metal oxide particle is 0.025 to 0.180.

Abstract: Provided is a coating film that can more reliably exhibit an excellent water repellency and an excellent oil repellency. This water- and oil-repellent coating film is a coating film formed on a surface of a material in order to impart water repellency and oil repellency, wherein (1) the coating film contains a metal oxide-containing composite particle; (2) the composite particle contains a) a metal oxide particle and b) a covering layer that contains a polyfluoroalkyl methacrylate resin and is formed on the surface of the metal oxide particle; and (3) a value obtained by dividing the fluorine content (weight %) of the composite particle by a surface area (m2/g) of the metal oxide particle is 0.025 to 0.180.

Abstract: A high concentration silica slurry can be used for polishing of substrates, such as semiconductor materials. The slurry contains a silica powder dispersed in an solvent. The silica slurry has a silica concentration of more than 50% by weight and a viscosity of less than 1000 mPa·s, wherein the silica powder has a ratio DL/DT of less than 1.3, wherein DL is an average particle size of the silica powder measured by a laser diffraction particle size distribution method and DT is an average primary particle size of the silica powder measured by a TEM photography observation, and wherein the silica powder has an average primary particle size of from 0.08 ?m to 0.8 ?m.

Abstract: A high concentration silica slurry can be used for polishing of substrates, such as semiconductor materials. The slurry contains a silica powder dispersed in an solvent. The silica slurry has a silica concentration of more than 50% by weight and a viscosity of less than 1000 mPa·s, wherein the silica powder has a ratio DL/DT of less than 1.3, wherein DL is an average particle size of the silica powder measured by a laser diffraction particle size distribution method and DT is an average primary particle size of the silica powder measured by a TEM photography observation, and wherein the silica powder has an average primary particle size of from 0.08 &mgr;m to 0.8 &mgr;m.

Abstract: Regarding the metal oxide fine powder, which is used as the additive of a powder material and is hydrophobic treated on the surface, the peak of the particle size distribution of the agglomerated particle is made to be less than the same level of average size of the powder material, so that said powder has high dispersibility in the powder material. When this metal oxide fine powder is used as the external additive, such as the toner for the electronic photograph, the standup of the electrostatic charge, the image quality, and the cleaning characteristic are improved remarkably.

Abstract: Regarding the metal oxide fine powder, which is used as the additive of a powder material and is hydrophobic treated on the surface, the peak of the particle size distribution of the agglomerated particle is made to be less than the same level of average size of the powder material, so that said powder has high dispersibility in the powder material. When this metal oxide fine powder is used as the external additive, such as the toner for the, electronic photograph, the standup of the electrostatic charge, the image quality, and the cleaning characteristic are improved remarkably.