Patents by Inventor Toshio Nosaka

Toshio Nosaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and an electronic device with the semiconductor devices mounted thereon
    Patent number: 5266834
    Abstract: A package is provided for achieving higher packing density and higher circuit integration of memories, in particular, a structure is provided having a plurality of thin, surface mount packages which are stacked up. Each of the laminated packages includes a semiconductor pellet, leads fixed to the front surface of the pellet, a radiating plate fixed to the rear surface of the same, and a resin mold member. To achieve a stabilized laminated structure, the mold member is shaped into a convex form on the front side of the pellet and into a concave form on the rear side of the same, so that the concave portion of one package can engage with the convex portion of another package.
    Type: Grant
    Filed: July 21, 1992
    Date of Patent: November 30, 1993
    Assignees: Hitachi Ltd., Hitachi VSLI Engineering Corp.
    Inventors: Kunihiko Nishi, Michio Tanimoto, Toshihiro Yasuhara, Katsuhiro Tabata, Yasuhiro Yoshikawa, Isao Akima, Souichi Kunito, Toshio Nosaka, Hideaki Nakamura