Patents by Inventor Toshio Sanukiya

Toshio Sanukiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Powder compression molding method and apparatus and dry cell
    Patent number: 6827567
    Abstract: Powder mixture is supplied into a die under a state that a center pin is located lower than the top surface of the die, after which the center pin is lifted up to a given molding position where an annular molding space is defined between the center pin and the die. The powder mixture is then compressed from upper and lower sides with an upper plunger and a lower plunger to form a pellet. The center pin and the lower plunger are simultaneously lifted up to remove the pellet out of the die.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: December 7, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Minoru Kouda, Shigeharu Hattori, Saburo Nakatsuka, Hiroshi Takebayashi, Toshio Sanukiya
  • Powder compression molding method for producing cathode pellets for dry cells
    Patent number: 6558594
    Abstract: Powder mixture is supplied into a die under a state that a center pin is located lower than the top surface of the die, after which the center pin is lifted up to a given molding position where an annular molding space is defined between the center pin and the die. The powder mixture is then compressed from upper and lower sides with an upper plunger and a lower plunger to form a pellet. The center pin and the lower plunger are simultaneously lifted up to remove the pellet out of the die.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: May 6, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Minoru Kouda, Shigeharu Hattori, Saburo Nakatsuka, Hiroshi Takebayashi, Toshio Sanukiya
  • Powder compression molding method and apparatus and dry cell
    Publication number: 20010006265
    Abstract: Powder mixture is supplied into a die under a state that a center pin is located lower than the top surface of the die, after which the center pin is lifted up to a given molding position where an annular molding space is defined between the center pin and the die. The powder mixture is then compressed from upper and lower sides with an upper plunger and a lower plunger to form a pellet. The center pin and the lower plunger are simultaneously lifted up to remove the pellet out of the die.
    Type: Application
    Filed: January 25, 2001
    Publication date: July 5, 2001
    Inventors: Minoru Kouda, Shigeharu Hattori, Saburo Nakatsuka, Hiroshi Takebayashi, Toshio Sanukiya
  • Powder compression molding method and apparatus for producing cathode pellets for dry cells
    Publication number: 20010004137
    Abstract: Powder mixture is supplied into a die under a state that a center pin is located lower than the top surface of the die, after which the center pin is lifted up to a given molding position where an annular molding space is defined between the center pin and the die. The powder mixture is then compressed from upper and lower sides with an upper plunger and a lower plunger to form a pellet. The center pin and the lower plunger are simultaneously lifted up to remove the pellet out of the die.
    Type: Application
    Filed: January 25, 2001
    Publication date: June 21, 2001
    Inventors: Minoru Kouda, Shigeharu Hattori, Saburo Nakatsuka, Hiroshi Takebayashi, Toshio Sanukiya
  • Method and apparatus for putting cells into a box
    Patent number: 5673540
    Abstract: A method and apparatus for putting small, slender, cylindrical cells in a box in an aligned row. By using the force of a magnet, multiple cells are suspended from the lower side of a conveyor belt, and are aligned and held in this position. By releasing the magnetic force, the cells drop, so that large numbers of cells, in a suspended and aligned state, can be simultaneously put into a cell container waiting below.
    Type: Grant
    Filed: September 3, 1996
    Date of Patent: October 7, 1997
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshio Sanukiya, Minoru Kouda, Ichiro Murata