Patents by Inventor Toshio SASAO

Toshio SASAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WIRING BOARD
    Publication number: 20240049384
    Abstract: A wiring board is disclosed. The wiring board includes a substrate including a first element, a diffusion layer in contact with the substrate and including a first metal element, and a first metal film in contact with the diffusion layer and including a second metal element. The diffusion layer has at least a region including the first element and the first metal element and a region including the first metal element and the second metal element. A concentration of the second metal element in the diffusion layer may decrease as it approaches the substrate in a depth direction. A concentration of the first element in the diffusion layer may decrease as it approaches the first metal film in the depth direction.
    Type: Application
    Filed: October 19, 2023
    Publication date: February 8, 2024
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Hiroki FURUSHOU, Atsuko CHIGIRA, Toshio SASAO, Hiroshi MAWATARI
  • WIRING BOARD AND MANUFACTURING METHOD OF THE WIRING BOARD
    Publication number: 20200404781
    Abstract: A wiring board is disclosed. The wiring board includes a substrate including a first element, a diffusion layer in contact with the substrate and including a first metal element, and a first metal film in contact with the diffusion layer and including a second metal element. The diffusion layer has at least a region including the first element and the first metal element and a region including the first metal element and the second metal element. A concentration of the second metal element in the diffusion layer may decrease as it approaches the substrate in a depth direction. A concentration of the first element in the diffusion layer may decrease as it approaches the first metal film in the depth direction.
    Type: Application
    Filed: September 3, 2020
    Publication date: December 24, 2020
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Hiroki FURUSHOU, Atsuko CHIGIRA, Toshio SASAO, Hiroshi MAWATARI