Abstract: During traveling of a vehicle body, a vehicle is provided with a vehicular static eliminator including a self-discharge static eliminating device that is attached to an outer surface of a lid of a fuse box mounted to a front compartment with a front grill, and a coversheet overlapped with an external surface of the self-discharge static eliminating device, in which the fuse box is disposed close to a hood and the coversheet includes Japanese paper.

Abstract: A vehicle includes a cover member provided in a trunk compartment of a vehicle body, and a flannel cloth arranged between an outer surface of the cover member and a rear floor panel. The flannel cloth is arranged so as to cover an entire region of the rear floor panel that faces the outer surface of the cover member.

Abstract: A notch-cut semiconductor wafer whose notch has its both corners entirely chamfered, and an apparatus and method for chamfering the notch as such, which employs a positioning device for positioning the wafer such that the notch of the wafer points in a predetermined direction; a conveyor device for conveying the wafer to a chamfering position; a holding device for holding the wafer to bring the wafer to arbitrary places; an abrasive wheel having an edge which is shaped like the notch; a driving device for driving the abrasive wheel; and a mechanism for controlling moving at least one of the two items consisting of the abrasive wheel and the semiconductor wafer, to arbitrary places.

Abstract: A notch-cut semiconductor wafer whose notch has its both corners entirely chamfered, and an apparatus and method for chamfering the notch as such, which employs a positioning device for positioning the wafer such that the notch of the wafer points in a predetermined direction; a conveyor device for conveying the wafer to a chamfering position; a holding device for holding the wafer to bring the wafer to arbitrary places; an abrasive wheel having an edge which is shaped like the notch; a driving device for driving the abrasive wheel; and a mechanism for controllingly moving at least one of the two items consisting of the abrasive wheel and the semiconductor wafer, to arbitrary places.