Abstract: A polyvinyl chloride-based adhesive tape or sheet has a base material layer formed to include 10 to 40 parts by weight of plasticizing agent(s) in relation to 100 parts by weight of a polyvinyl chloride-based resin and an adhesive layer on one surface of the base material layer, the plasticizing agent includes at least one type of plasticizing agent having an SP value of at least 9.0.

Abstract: Provided is a laminate including a thermoplastic resin layer and a substrate, which has superior transparency, is resistant to “warping”, and is advantageous for the encapsulation and surface protection of opto-electronic devices. The laminate includes a substrate; a thermoplastic resin layer having a thickness of more than 200 ?m and less than or equal to 500 ?m; and a pressure-sensitive adhesive layer lying between the substrate and thermoplastic resin layer and bonding them to each other, in which the thermoplastic resin layer has a 180-degree peel strength of 1.0 N/25 mm or more with respect to the pressure-sensitive adhesive layer at 23° C. The laminate preferably has a total luminous transmittance of 80% or more.

Abstract: The present invention provides a substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, which is to be stuck to a front surface of a semiconductor wafer in grinding a back surface of the semiconductor wafer, the pressure-sensitive adhesive sheet consisting of a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is formed of a UV-curable pressure-sensitive adhesive containing a polymer composed mainly of an acrylic monomer polymerizable compound, the pressure-sensitive adhesive force of a surface of the pressure-sensitive adhesive layer to be stuck to the front surface of the semiconductor wafer is larger than the pressure-sensitive adhesive force of the opposite surface thereof, and the pressure-sensitive adhesive layer has an initial elastic modulus of from 0.01 MPa to 500 MPa.

Abstract: The present invention provides a manufacturing method for efficiently and stably forming a pattern on a thin-film substrate. The method for manufacturing the thin-film substrate includes: stacking the thin-film substrate, a tackiness/adhesive agent for temporary fixing and a hard substrate in this order; fixing the thin-film substrate on the hard substrate through the tackiness/adhesive agent; then forming the pattern; and subsequently peeling the thin-film substrate at an interface between the thin-film substrate and the tackiness/adhesive agent.

Abstract: The present invention provides a manufacturing method for efficiently and stably forming a pattern on a thin-film substrate. A thin-film substrate, a tackiness adhesive sheet for thin-film substrate fixing, and a hard substrate are laminated in this order and a porous base material functioning as a core material of the tackiness adhesive sheet for thin-film substrate fixing has bore holes. Therefore, even if preliminary heating and drying is not applied, air bubbles are not generated between the thin-film substrate and the tackiness adhesive sheet for fixing during pattern formation on the thin-film substrate. This makes it possible to stably and efficiently form a pattern.

Abstract: Laminate for nonaqueous battery having moderate adhesion in which a nonaqueous electrolytic solution is sealed capable of improving the suitability of electrodes packed into a battery case without reduction in battery output and preventing a short circuit between the electrodes caused by the penetration of a burr or the like on an electrode plate through a separator and capable of suppressing reduction of adhesion in nonaqueous electrolytic solution and suppressing the deterioration of the nonaqueous electrolytic solution and having such a cohesive strength that when it is used in the form of a tape, a pressure-sensitive adhesive layer does not squeeze out of a base material layer and formed of at least two layers: a base material layer (A) containing a polyolefin-based thermoplastic resin; (B) containing an ?-olefin-based thermoplastic resin in the stated order.

Abstract: An adhesive sheet for processing of a semiconductor wafer has an adhesive layer disposed on at least one surface of a base substrate, the adhesive layer includes a base polymer, a plasticizer and a surfactant, an SP value of the plasticizer and the surfactant satisfies the relationship: 0.9?(the plasticizer SP value)/(the surfactant SP value)?1.0. The present invention has the object of providing an adhesive sheet for processing of a semiconductor wafer that exhibits superior storage stability under a range of environments, and that prevents contamination of the adherend after use.

Abstract: The present invention relates to a pressure-sensitive adhesive tape for a battery, containing: a substrate; and a pressure-sensitive adhesive layer laminated on at least one surface of the substrate, in which the pressure-sensitive adhesive layer contains a rubber component in the content of 70 wt % or more, and the rubber component has a weight average molecular weight of 300,000 to 5,000,000, and in which the pressure-sensitive adhesive layer is laminated at an inner portion of 0.5 mm or more from both edges of the substrate, with a thickness of 1 to 25 ?m.

Abstract: The present invention relates to a method of semiconductor wafer back processing, which includes applying a radiation-curable pressure-sensitive adhesive sheet comprising a base film and a pressure-sensitive adhesive layer disposed on one side of the base film to a front side of a semiconductor wafer, the front side of the semiconductor wafer having recesses and protrusions; grinding the back side of the semiconductor wafer in such a state that the radiation-curable pressure-sensitive adhesive sheet is adherent to the front side of the semiconductor; and irradiating the pressure-sensitive adhesive sheet with a radiation to thereby cure the pressure-sensitive adhesive layer, followed by subjecting said ground back side of the semiconductor wafer to a surface treatment; and a radiation-curable pressure-sensitive adhesive sheet for use in the method of semiconductor wafer back processing.

Abstract: An adhesive tape or sheet comprises an adhesive layer which contains 0.3 to 10 parts by weight of an polyether polyol compound, and 0.005 to 2 parts by weight of at least one alkali metal salt for 100 parts by weight of an acrylic adhesive which is formed with a copolymer of methyl acrylate monomer, ethyl acrylate monomer, or methyl acrylate monomer and ethyl acrylate monomer, acrylate monomer, and 2-ethylhexyl acrylate monomer.

Abstract: An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer is formed using a multifunctional acrylate oligomer and/or monomer having a double bond, and is blended so as to result in 1 double bond per total average molecular weight of 225 to 8000 as determined on the basis of the weight average molecular weight of the multifunctional acrylate oligomer and/or monomer.

Abstract: A re-peelable adhesive sheet for grinding a semiconductor wafer comprises: a base film, and an adhesive layer laminated on the base film, the re-peelable adhesive sheet has a modulus of elasticity of at least 103 MPa, and a heating shrinkage factor of 1% or less, after heating for 10 minutes to 60° C., and the adhesive layer is set to a thickness at which the maximum point stress is 200 g/cm or less, at a pressing amount of 30 ?m from the adhesive layer side in a three-point bend test. The present invention can provide a re-peelable adhesive sheet that can reduce wafer warping, cracking, and edge chipping, that can improve the adhesive force in relation to temperature variations and/or reduce contamination of the adherend when re-peeling, and that can facilitate film re-peel.

Abstract: The present invention provides a substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, which is to be stuck to a front surface of a semiconductor wafer in grinding a back surface of the semiconductor wafer, the pressure-sensitive adhesive sheet consisting of a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is formed of a UV-curable pressure-sensitive adhesive containing a polymer composed mainly of an acrylic monomer polymerizable compound, the pressure-sensitive adhesive force of a surface of the pressure-sensitive adhesive layer to be stuck to the front surface of the semiconductor wafer is larger than the pressure-sensitive adhesive force of the opposite surface thereof, and the pressure-sensitive adhesive layer has an initial elastic modulus of from 0.01 MPa to 500 MPa.

Abstract: The present invention relates to a pressure-sensitive adhesive sheet for processing a semiconductor wafer or semiconductor substrate, which includes a base material and a pressure-sensitive adhesive layer which is polymerizable and curable by an energy ray, the pressure-sensitive adhesive layer being disposed on a surface of the base material, in which the pressure-sensitive adhesive layer includes a base polymer, a multifunctional acrylate-based oligomer which has an energy-ray polymerizable carbon-carbon double bond and has a molecular weight of 1000 to 2500, and a multifunctional acrylate-based compound which has an energy-ray polymerizable carbon-carbon double bond and has a molecular weight of 200 to 700. The pressure-sensitive adhesive sheet of the invention is excellent in follow-up properties to a minute unevenness with a depth of about 0.

Abstract: An object of the present invention is to provide a stable adhesive sheet in which the disappearance of the laser-printings prevents almost entirely, without leaving adhesive residue whatsoever during the cut of the substrate. An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer has a thickness of 7 to 15 ?m.

Abstract: The present invention provides a method of grinding a back side of a semiconductor wafer, which includes applying an adhesive sheet including a substrate and an adhesive layer formed on one side of the substrate to a front side of a semiconductor wafer to provisionally fix the semiconductor wafer to the adhesive sheet, followed by grinding the back side of the semiconductor wafer, in which the adhesive layer contains 100 parts by weight of a base polymer for radiation-curable adhesives, 0.02 to 10 parts by weight of a phosphoric ester compound having an alkyl group having 10 or more carbon atoms, and more than 10 parts by weight but 200 parts by weight or less of at least one polyfunctional acrylate oligomer and/or monomer having one or more carbon-carbon double bonds, the polyfunctional acrylate oligomer and/or monomer having a weight-average molecular weight per carbon-carbon double bond of 250 to 6,500.

Abstract: An object of the present invention is to provide an adhesive sheet which, through improvement in the permeability of liquids originating in a liquid stream during water jet laser dicing, allows chips, IC components, or the like to be detached, prevents machining precision from being compromised such as by chipping or the scattering of chips and the like, and allows extremely thin semiconductor wafers or materials to be processed. The adhesive sheet for water jet laser dicing of the present invention comprises an adhesive layer laminated on a base film, the base film made of mesh fiber.

Abstract: An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer is formed using a multifunctional acrylate oligomer and/or monomer having a double bond, and is blended so as to result in 1 double bond per total average molecular weight of 225 to 8000 as determined on the basis of the weight average molecular weight of the multifunctional acrylate oligomer and/or monomer.

Abstract: The present invention relates to a pressure-sensitive adhesive sheet for processing, which includes a substrate; a pressure-sensitive adhesive layer containing a radiation-polymerizable compound; and an interlayer containing an acrylic polymer having a glass transition temperature of 20° C. or higher as a main component, the interlayer being disposed between the substrate and the pressure-sensitive adhesive layer. The pressure-sensitive adhesive sheet of the invention is excellent in pressure-sensitive adhesive properties, releasability, and expansibility.

Abstract: The present invention provides an adhesive sheet for water jet laser dicing, comprising an adhesive layer laminated on a base film, wherein the base film is composed of mesh formed by a fiber. According to the adhesive sheet for water jet laser dicing in the present invention, a film composed of mesh is used as the base film to ensure that the perforation size and opening area are relatively larger than in nonwoven fabric and perforated sheets, thus making it possible to maintain stable permeability to liquids originating in the liquid stream during water jet laser dicing and to provide an adhesive sheet that allows extremely thin semiconductor wafers or materials to be processed while preventing die fly-off or defects such as cracking and chipping in IC components, chips, or the like.