Abstract: A semiconductor light emitting device includes a substrate, a first semiconductor light emitting element and a second semiconductor light emitting element. A first semiconductor light emitting element is provided on the substrate and includes a first layer having a first conductivity type, a first light emitting layer, and a second layer having a second conductivity type. A second semiconductor light emitting element is provided on the substrate and includes a third layer having a second conductivity type, a second light emitting layer, and a fourth layer having a first conductivity type. The first layer and the third layer are electrically connected. A peak emission wavelength of light emitted from the first light emitting layer and a peak emission wavelength of light emitted from the second light emitting layer are substantially same.

Abstract: A light-emitting device includes a first lead frame, a light-emitting element fixed to the first lead frame, and a second lead frame electrically connected via a metal wire to the light-emitting element. In addition, the light-emitting device includes a resin that covers the first lead frame, the light-emitting element, and the second lead frame, and functions as a transmission medium for light emitted from the light-emitting element. The resin has a side surface which is perpendicular to the face to which the light-emitting element has been fixed, and an upper surface. The resin surfaces are configured so that the angle of incidence of a portion of the light emitted from the light-emitting element to the side surfaces is larger than a critical angle needed for total reflection of the light incident on the side surfaces.

Abstract: A light-emitting device includes a first lead frame, a light-emitting element fixed to the first lead frame, and a second lead frame electrically connected via a metal wire to the light-emitting element. In addition, the light-emitting device includes a resin that covers the first lead frame, the light-emitting element, and the second lead frame, and functions as a transmission medium for light emitted from the light-emitting element. The resin has a side surface which is perpendicular to the face to which the light-emitting element has been fixed, and an upper surface. The resin surfaces are configured so that the angle of incidence of a portion of the light emitted from the light-emitting element to the side surfaces is larger than a critical angle needed for total reflection of the light incident on the side surfaces.