Abstract: A vehicle is positively charged with static electricity due to an external factor. The vehicle includes a battery, a static eliminator sheet, and a holding member. The battery includes at least one cell, an electrolyte, a resin case, and negative and positive terminals. The resin case accommodates the components and electrolyte of each cell. The negative terminal is grounded to the vehicle body. The positive terminal is supplied with electric power from a charger. The static eliminator sheet is made of a material on a positive side of a triboelectric series with respect to a material of the resin case. The holding member holds the static eliminator sheet and the resin case in contact with each other. The holding member holds the battery at a predetermined location of the vehicle body in a state where the resin case and the static eliminator sheet are slidable due to vehicle body vibrations.

Abstract: Disclosed is a flat cable formed by braiding ultra-high molecular weight polyethylene fibers, in which degree of the fibers' close contact in a condition where no tensile force is applied is elevated compared with conventional ones. The cable is a flat cable formed by braiding ultra-high molecular weight polyethylene fibers, the area of whose cross section under a load of no tensile stress is not more than 110% of the cross section area under a load of a tensile stress of 22.7 N/mm2.

Abstract: A tape made of polyester fibers is disclosed which, though a flexible tape, is not easily elongated when it is pulled. The tape is a tape which is produced by braiding polyester fibers into a tape and then subjecting it to drawing, and whose maximum Young's modulus measured on a stress-elongation curve produced as it is pulled until its elongation reaches 5% of its initial length is not less than 2 GPa.

Abstract: According to this invention, there is provided a multilevel wiring substrate comprising, a base substrate having first and second surface and including first and second areas, said first area including first and second level conductive layers insulated from each other, a plurality of first vertical conductive layers electrically connected to said first level conductive layer so as to provide first end portions exposed to said first surface, and a plurality of second vertical conductive layers electrically connected to said second level conductive layer so as to provide second end portions exposed to said first surface, said first and second end portions being alternately arranged in row and column directions, and said second area including third and fourth conductive layers.

Abstract: A variable displacement swash plate type compressor is suitable for use as a refrigerant compressor for automobile air conditioner. The compressor includes pistons, an oscillating member for driving the piston, a rotating member for oscillating the oscillating member, a plate member for imparting a rotational force to the rotating member, and a main shaft connected to the plate member. A member, having a spherical or cylindrical surface portion and a flat surface portion, is provided between the rotating member and the plate member in such a manner that it is slidably in contact with both of the rotating member and the plate member. Also, movement of the oscillating member is defined by contact of the oscillating member with a stationary member. Consequently, it is possible to provide a variable displacement swash plate type compressor which assures reliable capacity control at a high-speed rotation and which vibrates and wears less.

Abstract: A semiconductor integrated circuit device comprising a plurality of semiconductor packaging substrates arranged parallel to one another, a plurality of semiconductor integrated circuits mounted on each of the semiconductor packaging substrates, a circuit for electrically connecting the semiconductor integrated circuits, an optical signal transmitting circuit, electrically connected to the semiconductor integrated circuits, for converting an electric signal input by the semiconductor integrated circuits to an optical signal and outputting it to another semiconductor packaging substrate, and an optical signal receiving circuit, electrically connected to the semiconductor integrated circuits, for receiving the optical signal output from the semiconductor packaging substrate, converting the optical signal to an electric signal, and outputting the electric signal to the semiconductor integrated circuits.

Abstract: A tape-automated bonding substrate or TAB substrate used for mounting a gallium arsenide IC chip having external connection terminals including signal input and output terminals thereon is shown. Conductive thin-film wiring lines are formed on an insulative thin-film layer. These thin-film wiring lines include feed-through type signal input wiring lines to be connected to the input terminals of the chip. Each feed-through type signal input wiring line has an inner lead to which a corresponding signal input terminal of the chip is directly connected, a terminal pad for receiving a high-speed input signal, and a terminal pad to which an impedance-matching resistor is to be connected. The feed-through type signal input wiring lines have a composite line structure of micro-strip signal transmission and co-planar signal transmission line structures.

Abstract: A variable-displacement compressor includes a wobble member for driving a pistons, and a rotation member for wobbling the wobbling member, a first support portion for supporting a wobbling member in such a manner that the angle of wobbling of the wobbling member is variable, and a second support portion for supporting said rotation member in such a manner that the angle of tilt of said rotation member relative to a main shaft is variable. With this construction, unbalanced inertia forces can be reduced greatly, thereby providing the variable-displacement compressor which produces less vibrations and noises.

Abstract: A semiconductor integrated circuit device including first and second transmission leads formed on both sides of a resin film on which a semiconductor integrated circuit chip is mounted. These leads are connected at portions immediately close to the high-speed input terminals of the chip by through-hole leads. This chip-to-lead configuration according to the present invention is significantly effective for a GaAs logic integrated circuit or the like that processes high-speed input signals.

Abstract: There is disclosed a mounting structure for a semiconductor integrated circuit device or IC device having signal transmission terminals, which has an insulative substrate on which the IC device is mounted, a conductive signal transmission wiring line formed on the substrate and electrically connected to a selected one of the signal transmission terminals of the IC device, and an insulative resin layer formed on the substrate to at least partially cover the signal transmission wiring line. The insulative resin layer functions to change and set the impedance of the signal transmission wiring line to a desired impedance value. The insulative resin layer is formed to have a selected thickness such that the characteristic impedance of the wiring line, which tends to fluctuate in the wiring line etching formation process, can be adjusted and set towards a destination characteristic impedance.

Abstract: The semiconductor integrated circuit device of high speed operation can be obtained by adopting the feed-through termination system and by making the wiring pattern in that case as being of construction folded in the direction of thickness of the supporting circuit substrate, without increasing the housing density of the outer lead. In addition, since matching resistor is mounted on the external wall of the substrate, the manufacturing process is also simple without the making the outside dimensions of the substrate large.

Abstract: A semiconductor integrated circuit device has a package base and a cavity formed with a ground electrode layer thereon. A semiconductor integrated circuit chip is providing on the ground electrode layer. De-coupling capacitors are providing on the surface of the cavity. A ground metal plate and outer leads are formed on the surface of the bottom of the package base. A metal connector is providing through the package base to connect electrically and thermally, the ground electode layer and the ground metal plate.

Abstract: A variable displacement compressor comprises a housing forming a crank chamber, a shaft, expansible chambers including pistons, a swash plate connected to the shaft so as to be smoothly changeable in inclination against the shaft and driven to rotate, a wobble plate rotatable on the swash plate, a rotation preventing mechanism including a shoe member slidable in an axial direction, and a pressure control valve which is provided in a refrigerant passage from a suction port of the compressor to the expansible chamber to control the pressure of refrigerant to be sucked responsive to the suction pressure and both to the suction pressure and to the discharge pressure when the discharge pressure is high. The refrigerant passage has a sharply bent portion for separating lubrication oil from a refrigerant flowing therein and communicates with the crank chamber to discharge blow-by gas therefrom.

Abstract: A circuit board comprises a substrate made of a semi-insulating or insulating material, an insulating layer formed on the substrate and having a lower dielectric constant than the dielectric constant of the substrate, and a plurality of wiring conductors formed at predetermined intervals on the insulating layer. The insulating layer has a thickness determined according to the distance between adjacent wiring conductors and equal to 0.5 to 2.5 times the distance noted above, for the purpose of reducing cross-talk noise.

Abstract: In a swash plate type compressor, a partition plate member is located in a high pressure chamber of the compressor housing and divides the high pressure chamber into a plurality of small rooms which are communicated in series through a hole formed on the partition member. Each small room in the high pressure chamber and the partition member hole serves to reduce the resonant sound among the noise in a car or the like where the compressor is utilized.

Abstract: An elastic surface wave device comprises an X-cut LiTaO.sub.3 substrate whose thickness satisfies the expression ##STR1## WHERE N: 1, 3, 5 . . . (ODD NUMBER)F.sub.l : a minimum frequency (MHz) of a filter pass bandF.sub.u : a maximum frequency (MHz) of a filter pass bandD: a thickness (mm) of the LiTaO.sub.3 substrate and transducers provided on one surface of the substrate.