Patents by Inventor Toshio Sugaya
Toshio Sugaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11545814Abstract: A disclosed semiconductor laser module includes a semiconductor laser device; a waveguide optical function device that has an incidence end on which laser light emitted from the semiconductor laser device is incident and that guides the incident light; and a protrusion that is provided on an extension line of a light path of the laser light emitted from the semiconductor laser device, the extension line extending beyond the incidence end.Type: GrantFiled: June 18, 2019Date of Patent: January 3, 2023Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Maiko Ariga, Yusuke Inaba, Kazuki Yamaoka, Toshio Sugaya
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Patent number: 10869395Abstract: A flexible substrate has an insulating base member and a conductive layer that is formed on the base member and includes an electrical connecting portion fixed to a component and electrically connected to the component, and the flexible substrate includes: a main portion on which the electrical connecting portion is formed; and a protruding portion provided so as to protrude from a portion of the main portion in which the electrical connecting portion is formed, wherein the main portion is bent along a first bending line extending in a first direction, and wherein the protruding portion can be bent along a second bending line extending in a second direction intersecting the first direction and is adapted to reduce stress occurring at the electrical connecting portion by the protruding portion being bent along the second bending line.Type: GrantFiled: August 4, 2017Date of Patent: December 15, 2020Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Etsuji Katayama, Jun Miyokawa, Maiko Ariga, Toshio Sugaya
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Patent number: 10558063Abstract: An optical module includes an optical element configured to be driven at a high frequency, a circuit board arranged at a height different from a height of the optical element, and a wiring sub-mount including a wiring electrically connecting the optical element and the circuit board, the wiring being such that a height of a connection surface of one end portion of the wiring and a height of a connection surface of another end portion of the wiring are different from each other.Type: GrantFiled: July 29, 2016Date of Patent: February 11, 2020Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Toshio Sugaya, Maiko Ariga
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Publication number: 20190312414Abstract: A disclosed semiconductor laser module includes a semiconductor laser device; a waveguide optical function device that has an incidence end on which laser light emitted from the semiconductor laser device is incident and that guides the incident light; and a protrusion that is provided on an extension line of a light path of the laser light emitted from the semiconductor laser device, the extension line extending beyond the incidence end.Type: ApplicationFiled: June 18, 2019Publication date: October 10, 2019Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Maiko Ariga, Yusuke Inaba, Kazuki Yamaoka, Toshio Sugaya
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Publication number: 20170336584Abstract: A flexible substrate includes: an insulating base member; a plurality of lands formed aligned in a plurality of lines in a first direction on the base member; and a plurality of wirings formed on the base member, extending in a second direction intersecting the first direction, and connected to the plurality of lands on each line of the plurality of lines, wherein the plurality of wirings include a wiring extending between the lands aligned in the first direction, and wherein each of the plurality of lands has a planar shape longer in the second direction.Type: ApplicationFiled: August 10, 2017Publication date: November 23, 2017Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Maiko ARIGA, Etsuji KATAYAMA, Toshio SUGAYA
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Publication number: 20170339793Abstract: A flexible substrate has an insulating base member and a conductive layer that is formed on the base member and includes an electrical connecting portion fixed to a component and electrically connected to the component, and the flexible substrate includes: a main portion on which the electrical connecting portion is formed; and a protruding portion provided so as to protrude from a portion of the main portion in which the electrical connecting portion is formed, wherein the main portion is bent along a first bending line extending in a first direction, and wherein the protruding portion can be bent along a second bending line extending in a second direction intersecting the first direction and is adapted to reduce stress occurring at the electrical connecting portion by the protruding portion being bent along the second bending line.Type: ApplicationFiled: August 4, 2017Publication date: November 23, 2017Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Etsuji Katayama, Jun Miyokawa, Maiko Ariga, Toshio Sugaya
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Publication number: 20160334651Abstract: An optical module includes an optical element configured to be driven at a high frequency, a circuit board arranged at a height different from a height of the optical element, and a wiring sub-mount including a wiring electrically connecting the optical element and the circuit board, the wiring being such that a height of a connection surface of one end portion of the wiring and a height of a connection surface of another end portion of the wiring are different from each other.Type: ApplicationFiled: July 29, 2016Publication date: November 17, 2016Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Toshio SUGAYA, Maiko ARIGA
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Patent number: 9466942Abstract: An optical element module includes a casing having a bottom plate, a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion, a support member mounted on the temperature-adjusting unit in the casing, and a semiconductor laser element being mounted on the support member and outputting a laser light to a forward side. The upper layer portion of the temperature-adjusting unit projects at a backward side of the semiconductor laser element relative to the lower layer portion.Type: GrantFiled: December 9, 2014Date of Patent: October 11, 2016Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Tetsuya Matsuyama, Maiko Ariga, Toshio Sugaya, Toshio Kimura
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Publication number: 20150098480Abstract: An optical element module includes a casing having a bottom plate, a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion, a support member mounted on the temperature-adjusting unit in the casing, and a semiconductor laser element being mounted on the support member and outputting a laser light to a forward side. The upper layer portion of the temperature-adjusting unit projects at a backward side of the semiconductor laser element relative to the lower layer portion.Type: ApplicationFiled: December 9, 2014Publication date: April 9, 2015Applicant: FURUKAWA ELECTRIC CO., LTDInventors: Tetsuya MATSUYAMA, Maiko Ariga, Toshio Sugaya, Toshio Kimura
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Publication number: 20120127715Abstract: [Objective] To prevent change in a direction of an optical axis of a split light within a plane parallel to a surface on which the beam splitter is installed. [Means] A laser module including a laser light source that emits a laser light and a beam splitter that splits a portion of the laser light emitted from the laser light source. The beam splitter includes a first reflective surface and a second reflective surface that are parallel to each other. The first reflective surface transmits a first portion of the laser light and reflects a second portion of the laser light to the second reflective surface. The second reflective surface receives the second portion of the laser light from the first reflective surface and reflects received laser light in a direction parallel to the laser light emitted from the laser light source.Type: ApplicationFiled: May 6, 2011Publication date: May 24, 2012Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Maiko Ariga, Toshio Sugaya, Toshio Kimura