Patents by Inventor Toshio Takizawa

Toshio Takizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220162476
    Abstract: A polishing liquid containing: abrasive grains; a first nitrogen-containing compound; a second nitrogen-containing compound; and water, in which the first nitrogen-containing compound contains at least one selected from the group consisting of (I) a compound having an aromatic ring containing one nitrogen atom in the ring and a hydroxyl group, (II) a compound having an aromatic ring containing one nitrogen atom in the ring and a functional group containing a nitrogen atom, (III) a compound having a 6-membered ring containing two nitrogen atoms in the ring, (IV) a compound having a benzene ring and a ring containing a nitrogen atom in the ring, and (V) a compound having a benzene ring to which two or more functional groups containing a nitrogen atom are bonded, and an HLB value of the second nitrogen-containing compound is 7 or more.
    Type: Application
    Filed: April 2, 2019
    Publication date: May 26, 2022
    Inventors: Masayuki HANANO, Hisato TAKAHASHI, Toshio TAKIZAWA
  • Publication number: 20220119680
    Abstract: Letting a particle diameter be Dx (?m) when a cumulative particle volume cumulated from the small particle diameter side reaches x (%) of the total particle volume in a particle size distribution obtained regarding cerium oxide included in a polishing liquid using a laser diffraction/scattering method, D5 is 1 ?m or less, and a difference between D95 and D5 is 3 ?m or more.
    Type: Application
    Filed: December 30, 2021
    Publication date: April 21, 2022
    Inventor: Toshio TAKIZAWA
  • Patent number: 11214713
    Abstract: Letting a particle diameter be Dx (?m) when a cumulative particle volume cumulated from the small particle diameter side reaches x (%) of the total particle volume in a particle size distribution obtained regarding cerium oxide included in a polishing liquid using a laser diffraction/scattering method, D5 is 1 ?m or less, and a difference between D95 and D5 is 3 ?m or more.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: January 4, 2022
    Assignee: HOYA CORPORATION
    Inventor: Toshio Takizawa
  • Publication number: 20210327464
    Abstract: A magnetic-disk substrate has an average value of squares of inclinations that is 0.0025 or less, and a frequency at which squares of inclinations are 0.004 or more is 15% or less, in a case where samples of inclinations on a main surface are obtained at intervals of 10 nm. The main surface is configured to receive at least a magnetic recording layer thereon. The magnetic-disk substrate includes an outer circumferential end portion and an inner circumferential end portion, and the outer circumferential end portion and the inner circumferential end portion have chamfered portions.
    Type: Application
    Filed: June 30, 2021
    Publication date: October 21, 2021
    Applicants: HOYA CORPORATION, HOYA GLASS DISK VIETNAM II LTD.
    Inventors: Masanobu ITAYA, Kinobu OSAKABE, Toshio TAKIZAWA
  • Patent number: 11081134
    Abstract: A hard disk drive includes a magnetic-disk substrate in which an average value of squares of inclinations is 0.0025 or less and a frequency at which squares of inclinations are 0.004 or more is 15% or less, in a case where samples of inclinations on a main surface are obtained at intervals of 10 nm.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: August 3, 2021
    Assignees: HOYA CORPORATION, HOYA GLASS DISK VIETNAM II LTD.
    Inventors: Masanobu Itaya, Kinobu Osakabe, Toshio Takizawa
  • Publication number: 20200299544
    Abstract: Provided is a CMP polishing liquid used for removing a part of an insulating portion of a base substrate, which includes a substrate, a stopper provided on one surface of the substrate, and the insulating portion provided on a surface of the stopper opposite to the substrate, by CMP to expose the stopper, the polishing liquid containing: abrasive grains containing cerium; a nonionic water-soluble compound A; a polymer compound B having at least one selected from the group consisting of carboxylic acid groups and carboxylate groups; a basic pH adjusting agent which is optionally contained; and water, in which a content of the basic pH adjusting agent is less than 1.3×10?2 mol/kg based on the total mass of the polishing liquid.
    Type: Application
    Filed: August 14, 2017
    Publication date: September 24, 2020
    Inventors: Masayuki HANANO, Toshio TAKIZAWA
  • Publication number: 20200283659
    Abstract: A polishing liquid containing: abrasive grains containing at least one selected from the group consisting of cerium oxide and silicon oxide; a nitrogen-containing compound; and water, in which the nitrogen-containing compound contains at least one selected from the group consisting of (I) a compound having an aromatic ring containing one nitrogen atom in the ring and a hydroxyl group, (II) a compound having an aromatic ring containing one nitrogen atom in the ring and a functional group containing a nitrogen atom, (III) a compound having a 6-membered ring containing two nitrogen atoms in the ring, (IV) a compound having a benzene ring and a ring containing a nitrogen atom in the ring, and (V) a compound having a benzene ring to which two or more functional groups containing a nitrogen atom are bonded.
    Type: Application
    Filed: October 1, 2018
    Publication date: September 10, 2020
    Inventors: Hisato TAKAHASHI, Masayuki HANANO, Toshio TAKIZAWA
  • Publication number: 20200208015
    Abstract: Letting a particle diameter be Dx (?m) when a cumulative particle volume cumulated from the small particle diameter side reaches x(%) of the total particle volume in a particle size distribution obtained regarding cerium oxide included in a polishing liquid using a laser diffraction/scattering method, D5 is 1 ?m or less, and a difference between D95 and D5 is 3 ?m or more.
    Type: Application
    Filed: October 31, 2018
    Publication date: July 2, 2020
    Inventor: Toshio TAKIZAWA
  • Patent number: 10607647
    Abstract: A magnetic disk substrate having a flat main surface, an end face, and a chamfered face formed between the main surface and the end face. The substrate has an offset portion, present on the main surface within a range of 92.0 to 97.0% in a radial direction from a center of the substrate. A distance from the center of the substrate to the end face of the substrate in a radial direction is 100%, the offset portion being raised or lowered with respect to a virtual straight line connecting two points on the main surface, set at positions of 92.0% and 97.0%. A maximum distance from the virtual straight line to the offset portion in a direction perpendicular to the virtual straight line is a “maximum offset value.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: March 31, 2020
    Assignees: HOYA CORPORATION, HOYA LAMPHUN LTD.
    Inventors: Toshio Takizawa, Kraisorn Phandon, Kenichi Nishimori
  • Publication number: 20190228801
    Abstract: A hard disk drive includes a magnetic-disk substrate in which an average value of squares of inclinations is 0.0025 or less and a frequency at which squares of inclinations are 0.004 or more is 15% or less, in a case where samples of inclinations on a main surface are obtained at intervals of 10 nm.
    Type: Application
    Filed: March 28, 2019
    Publication date: July 25, 2019
    Inventors: Masanobu ITAYA, Kinobu OSAKABE, Toshio TAKIZAWA
  • Patent number: 10283156
    Abstract: A magnetic-disk glass substrate of the present invention has an average value of squares of inclinations of 0.0025 or less and a frequency at which squares of inclinations are 0.004 or more of 15% or less, in a case where samples of inclinations on a main surface are obtained at intervals of 10 nm.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: May 7, 2019
    Assignees: HOYA CORPORATION, HOYA GLASS DISK VIETNAM II LTD.
    Inventors: Masanobu Itaya, Kinobu Osakabe, Toshio Takizawa
  • Patent number: 10155886
    Abstract: A polishing liquid for CMP, comprising: an abrasive grain including a cerium-based compound; a 4-pyrone-based compound; a polymer compound having an aromatic ring and a polyoxyalkylene chain; a cationic polymer; and water.
    Type: Grant
    Filed: April 28, 2014
    Date of Patent: December 18, 2018
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Munehiro Oota, Toshio Takizawa, Hisataka Minami, Toshiaki Akutsu, Tomohiro Iwano
  • Publication number: 20170270956
    Abstract: A magnetic disk substrate having a flat main surface, an end face, and a chamfered face formed between the main surface and the end face. The substrate has an offset portion, present on the main surface within a range of 92.0 to 97.0% in a radial direction from a center of the substrate. A distance from the center of the substrate to the end face of the substrate in a radial direction is 100%, the offset portion being raised or lowered with respect to a virtual straight line connecting two points on the main surface, set at positions of 92.0% and 97.0%. A maximum distance from the virtual straight line to the offset portion in a direction perpendicular to the virtual straight line is a “maximum offset value.
    Type: Application
    Filed: June 1, 2017
    Publication date: September 21, 2017
    Applicants: HOYA CORPORATION, HOYA GLASS DISK (Thailand) LTD.
    Inventors: Toshio TAKIZAWA, Kraisorn PHANDON, Kenichi NISHIMORI
  • Patent number: 9697861
    Abstract: A magnetic disk substrate having a flat main surface, an end face, and a chamfered face formed between the main surface and the end face. The substrate has an offset portion, present on the main surface within a range of 92.0 to 97.0% in a radial direction from a center of the substrate. A distance from the center of the substrate to the end face of the substrate in a radial direction is 100%, the offset portion being raised or lowered with respect to a virtual straight line connecting two points on the main surface, set at positions of 92.0% and 97.0%. A maximum distance from the virtual straight line to the offset portion in a direction perpendicular to the virtual straight line is a “maximum offset value.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: July 4, 2017
    Assignees: HOYA CORPORATION, HOYA GLASS DISK (Thailand) LTD.
    Inventors: Toshio Takizawa, Kraisorn Phandon, Kenichi Nishimori
  • Publication number: 20170186459
    Abstract: A magnetic-disk glass substrate of the present invention has an average value of squares of inclinations of 0.0025 or less and a frequency at which squares of inclinations are 0.004 or more of 15% or less, in a case where samples of inclinations on a main surface are obtained at intervals of 10 nm.
    Type: Application
    Filed: January 9, 2017
    Publication date: June 29, 2017
    Applicants: HOYA CORPORATION, HOYA GLASS DISK VIETNAM II LTD.
    Inventors: Masanobu ITAYA, Kinobu OSAKABE, Toshio TAKIZAWA
  • Publication number: 20170133237
    Abstract: Provided is a polishing liquid including cerium oxide particles, an organic acid A, a polymer compound B having a carboxyl acid group or a carboxylate group, and water, wherein the organic acid A has at least one group selected from the group consisting of —COOM group, -Ph-OM group, —SO3M group and —PO3M2 group, pKa of the organic acid A is less than 9, a content of the organic acid A is 0.001 to 1 mass % with respect to the total mass of the polishing liquid, and a content of the polymer compound B is 0.01 to 0.50 mass % with respect to the total mass of the polishing liquid, and pH is in the range of 4.0 to 7.0.
    Type: Application
    Filed: December 1, 2016
    Publication date: May 11, 2017
    Inventors: Munehiro Oota, Takaaki Tanaka, Toshio Takizawa, Shigeru Yoshikawa, Takaaki Matsumoto, Takahiro Yoshikawa, Takashi Shinoda
  • Patent number: 9564166
    Abstract: A magnetic-disk glass substrate of the present invention has an average value of squares of inclinations of 0.0025 or less and a frequency at which squares of inclinations are 0.004 or more of 15% or less, in a case where samples of inclinations on a main surface are obtained at intervals of 10 nm.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: February 7, 2017
    Assignees: HOYA CORPORATION, HOYA GLASS DISK VIETNAM II LTD.
    Inventors: Masanobu Itaya, Kinobu Osakabe, Toshio Takizawa
  • Patent number: 9564337
    Abstract: Provided is a polishing liquid including cerium oxide particles, an organic acid A, a polymer compound B having a carboxyl acid group or a carboxylate group, and water, wherein the organic acid A has at least one group selected from the group consisting of —COOM group, -Ph-OM group, —SO3M group and —PO3M2 group, pKa of the organic acid A is less than 9, a content of the organic acid A is 0.001 to 1 mass % with respect to the total mass of the polishing liquid, and a content of the polymer compound B is 0.01 to 0.50 mass % with respect to the total mass of the polishing liquid, and pH is in the range of 4.0 to 7.0.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: February 7, 2017
    Assignee: HITACHI CHEMICAL CO., LTD.
    Inventors: Munehiro Oota, Takaaki Tanaka, Toshio Takizawa, Shigeru Yoshikawa, Takaaki Matsumoto, Takahiro Yoshikawa, Takashi Shinoda
  • Publication number: 20160137881
    Abstract: A polishing liquid for CMP, comprising: an abrasive grain including a cerium-based compound; a 4-pyrone-based compound; a polymer compound having an aromatic ring and a polyoxyalkylene chain; a cationic polymer; and water.
    Type: Application
    Filed: April 28, 2014
    Publication date: May 19, 2016
    Inventors: Munehiro OOTA, Toshio TAKIZAWA, Hisataka MINAMI, Toshiaki AKUTSU, Tomohiro IWANO
  • Publication number: 20150340054
    Abstract: A magnetic disk substrate having a flat main surface, an end face, and a chamfered face formed between the main surface and the end face. The substrate has an offset portion, present on the main surface within a range of 92.0 to 97.0% in a radial direction from a center of the substrate. A distance from the center of the substrate to the end face of the substrate in a radial direction is 100%, the offset portion being raised or lowered with respect to a virtual straight line connecting two points on the main surface, set at positions of 92.0% and 97.0%. A maximum distance from the virtual straight line to the offset portion in a direction perpendicular to the virtual straight line is a “maximum offset value.
    Type: Application
    Filed: August 5, 2015
    Publication date: November 26, 2015
    Applicants: HOYA CORPORATION, HOYA GLASS DISK (Thailand) LTD.
    Inventors: Toshio TAKIZAWA, Kraisorn PHANDON, Kenichi NISHIMORI