Patents by Inventor Toshio Terouchi

Toshio Terouchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metalization structure and manufacturing method thereof
    Patent number: 5868949
    Abstract: A metalization structure having a first conductor layer on the surface of an underlying layer and, further, a second conductor layer connected conductively with the first conductor layer in which a polyimide insulative film of low thermal expansion coefficient is present between at least an end of a pattern of the second conductor layer and the first conductor layer, for stably obtaining a metalization structure of high reliability and free from the worry of peeling of the conductor portion from a substrate or occurrence of cracking to the underlying layer.
    Type: Grant
    Filed: November 14, 1995
    Date of Patent: February 9, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Hideo Sotokawa, Masashi Nishiki, Eiji Matsuzaki, Hidetaka Shigi, Toshio Terouchi, Mamoru Ogihara, Haruhiko Matsuyama, Minoru Tanaka