Patents by Inventor Toshio Tetsuya

Toshio Tetsuya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 4954870
    Abstract: Semiconductor device in which a semiconductor chip is fixed to a lead frame by Sn-Cu alloy solder with a first metal layer interposed between the chip and the solder. The first metal layer is formed at a thickness ranging from 2000 .ANG. to 3 .mu.m, and made of a metal selected from Ti, Cr, V, Zr, Nb and an alloy containing at least one of these metals. A second metal layer made of Ni, Co or an alloy containing at least one of these metals may be interposed at a thickness smaller than that of the first metal between the first metal layer and the solder.
    Type: Grant
    Filed: December 5, 1985
    Date of Patent: September 4, 1990
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Momoko Takemura, Michihiko Inaba, Toshio Tetsuya, Mitsuo Kobayashi