Patents by Inventor Toshio Tooyama

Toshio Tooyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6719144
    Abstract: When a printed board is soldered by a dipping method, a great deal of dross is generated on a jet solder tank. The dross is a mixture of melted solder and oxide. A worker takes out the dross from the jet solder tank, and throws it away. Thus, a large amount of the solder is consumed. The present invention relates to a separating device for separating oxide and solder from dross. A container (21) is provided with a heater (22). A cover (24) is set over the container (21) to be freely attachable or detachable, and further a non-oxidizing gas supplying opening (28) is made in the cover (24) or the container (21). A stirring spatula (25) for stirring the surface of a melted solder (23) put into the container (21) is set near the surface of the melted solder (23).
    Type: Grant
    Filed: February 16, 2001
    Date of Patent: April 13, 2004
    Assignees: Sony Corporation, Senju Metal Industry Co., Ltd.
    Inventors: Toshio Tooyama, Kenichi Tomitsuka, Shohei Mawatari, Tomotake Kagaya, Eihiko Muramatsu
  • Publication number: 20020005376
    Abstract: When a printed board is soldered by a dipping method, a great deal of dross is generated on a jet solder tank. The dross is a mixture of melted solder and oxide. A worker takes out the dross from the jet solder tank, and throws it away. Thus, a large amount of the solder is consumed. The present invention relates to a separating device for separating oxide and solder from dross. A container (21) is provided with a heater (22). A cover (24) is set over the container (21) to be freely attachable or detachable, and further a non-oxidizing gas supplying opening (28) is made in the cover (24) or the container (21). A stirring spatula (25) for stirring the surface of a melted solder (23) put into the container (21) is set near the surface of the melted solder (23).
    Type: Application
    Filed: February 16, 2001
    Publication date: January 17, 2002
    Inventors: Toshio Tooyama, Kenichi Tomitsuka, Shohei Mawatari, Tomotake Kagaya, Eihiko Muramatsu