Patents by Inventor Toshio Toyama

Toshio Toyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060162764
    Abstract: In a lead to be welded through solder to a pass-bar of a solar battery cell, a plurality of through holes having corners in the lateral direction of the lead are formed along its longitudinal direction. Consequently, when the lead is disposed on a pass-bar of a solar battery cell and heated, the lead and the solar battery cell are subjected to thermal expansion. In such case, due to expansion of the lead, stress acts intensively on the corner tip of each through hole. The intensive stress creates a plastic region in the vicinity of the corner tip. Therefore, when the lead is welded to a pass-bar of a solar battery cell and cooled, the lead is inhibited from contracting by the amount equivalent to the amount of expansion caused by heating due to creation of the plastic region, and bending and thermal stress that acts on the solar battery cell is mitigated.
    Type: Application
    Filed: December 20, 2005
    Publication date: July 27, 2006
    Applicant: TOYOMA MACHINERIES CO., LTD.
    Inventor: Toshio Toyama
  • Patent number: 6964093
    Abstract: An electronics packaging system (1) including a printer (3), a placing unit (4) and a reflow unit (5), wherein a printed wiring board (2) is carried while being kept in an upright position. The printed wiring board (2) has solder printed on all the lands thereof at the same time, the electronic parts (10) are all placed on the lands at the same time, and the electronic parts (10) are all soldered to the lands at the same time. Thus, the system (1) can be designed more compact, and the electronic parts packaged in a shorter time.
    Type: Grant
    Filed: April 26, 2001
    Date of Patent: November 15, 2005
    Assignee: Sony Corporation
    Inventors: Kazuhisa Mochida, Katsumi Togasaki, Katsumi Morita, Yusuke Masutani, Hiroji Kameda, Noboru Sekiguchi, Minoru Shimada, Toshio Toyama, Akihiro Koga, Mitsuo Inoue, Kazuhiro Abe, Tetsuya Yonemoto, Kenji Ishihara, Syunji Aoki, Fumio Matsumoto, Takanori Arai, Hisashi Naoshima
  • Publication number: 20020133937
    Abstract: In an electronics packaging system (1) including a printer (3), placing unit (4) and reflow unit (5), a printed wiring board (2) is carried while being kept in upright position. The printed wiring board (2) has solder printed on lands thereof at the same time, electronic parts (10) placed on the lands at the same time, and the electronic parts (10) solder to the lands at the same time. Thus, the system (1) can be designed more compact, and package electronic parts in a shorter time.
    Type: Application
    Filed: April 12, 2002
    Publication date: September 26, 2002
    Inventors: Kazuhisa Mochida, Katsumi Togasaki, Katsumi Morita, Yusuke Masutani, Hiroji Kameda, Noboru Sekiguchi, Minoru Shimada, Toshio Toyama, Akihiro Koga, Mitsuo Inoue, Kazuhiro Abe, Tetsuya Yonemoto, Kenji Ishihara, Syunji Aoki, Fumio Matsumoto, Takanori Arai, Hisashi Naoshima
  • Patent number: 5671471
    Abstract: A separating pawl is attached to a fixed portion around a rotatable member, and a separating end of the separating pawl extends from a fixed end of the separating pawl onto a circumferential surface of the rotatable member. A portion between the separating end and the fixed end of the separating pawl forms a convex arch in the same direction as that of the rotatable member. A pressing plate is attached to the fixed portion around the rotatable member, and is brought in contact with the convex side of the separating pawl so that the separating end of the separating pawl comes in contact with the rotatable member to press the separating pawl for performing a sheet separating operation.
    Type: Grant
    Filed: October 23, 1996
    Date of Patent: September 23, 1997
    Assignees: Minolta Co., Ltd., Toyama Machineries Co., Ltd.
    Inventors: Naoki Mizuno, Toshio Sakata, Toshio Toyama
  • Patent number: 4847465
    Abstract: A reflow soldering apparatus for soldering parts which are temporarily fixed on a substrate by using cream solder. The apparatus includes a hot gas blower provided with a number of holes for blowing hot gas through the holes. The apparatus also includes a substrate moving mechanism for moving the substrate along the hot gas blower at a distance therefrom to expose the substrate to hot gas blown through the holes, thereby reflowing the cream solder.
    Type: Grant
    Filed: September 2, 1986
    Date of Patent: July 11, 1989
    Assignee: Sony Corporation
    Inventors: Toshio Toyama, Kazuya Kato, Tadamasa Tanaka, Masashi Yajima, Harutaka Hayasaka, Toru Arai, Hitoshi Terada