Patents by Inventor Toshio Tsuchiya

Toshio Tsuchiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190270123
    Abstract: A cleaning method for cleaning a frame unit including an affixed object, a tape affixed to an undersurface of the affixed object, and an annular frame to which an outer peripheral portion of the tape is affixed, the cleaning method including: an affixed object cleaning step of cleaning the affixed object by jetting a cleaning liquid from a cleaning nozzle while moving the cleaning nozzle in a reciprocating manner along a path extending from above one end of an outer peripheral edge of the affixed object to above another end of the outer peripheral edge of the affixed object; and a frame cleaning step of cleaning the frame by jetting the cleaning liquid from the cleaning nozzle to the frame.
    Type: Application
    Filed: February 25, 2019
    Publication date: September 5, 2019
    Inventors: Yukito AKUTAGAWA, Toshio TSUCHIYA, Kentaro SHIRAGA
  • Patent number: 10211076
    Abstract: Disclosed herein is a wafer processing method for removing an annular reinforcing portion from a wafer having a device area, the annular reinforcing portion being formed around the device area. The wafer processing method includes the steps of supporting the wafer through an adhesive tape to an annular frame, forming a mark corresponding to a notch at a position radially inside a boundary portion between the annular reinforcing portion and the device area, cutting the boundary portion together with the adhesive tape to thereby separate the annular reinforcing portion from the device area, and moving the annular reinforcing portion supported through the adhesive tape to the annular frame away from a holding table to thereby remove the annular reinforcing portion from the wafer.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: February 19, 2019
    Assignee: DISCO CORPORATION
    Inventors: Toshio Tsuchiya, Hitoshi Hoshino
  • Publication number: 20170301571
    Abstract: Disclosed herein is a wafer processing method for removing an annular reinforcing portion from a wafer having a device area, the annular reinforcing portion being formed around the device area. The wafer processing method includes the steps of supporting the wafer through an adhesive tape to an annular frame, forming a mark corresponding to a notch at a position radially inside a boundary portion between the annular reinforcing portion and the device area, cutting the boundary portion together with the adhesive tape to thereby separate the annular reinforcing portion from the device area, and moving the annular reinforcing portion supported through the adhesive tape to the annular frame away from a holding table to thereby remove the annular reinforcing portion from the wafer.
    Type: Application
    Filed: April 11, 2017
    Publication date: October 19, 2017
    Inventors: Toshio Tsuchiya, Hitoshi Hoshino
  • Patent number: 7601616
    Abstract: A wafer laser processing method for forming grooves along streets by applying a pulse laser beam along the streets for sectioning a plurality of devices of a wafer having the plurality of devices which are composed of a laminate consisting of an insulating film and a functional film, on the front surface of a substrate, wherein the pulse laser beam is set to have a repetition frequency of 150 kHz to 100 MHz and an energy per unit length of 5 to 25 J/m.
    Type: Grant
    Filed: July 19, 2007
    Date of Patent: October 13, 2009
    Assignee: Disco Corporation
    Inventors: Hiroshi Morikazu, Ryugo Oba, Yukio Morishige, Toshio Tsuchiya, Koji Yamaguchi
  • Patent number: 7473866
    Abstract: A laser processing apparatus comprising a chuck table, laser beam irradiation means for irradiating a workpiece held on the chuck table with a laser beam, and processing feed means for processing-feeding the chuck table and the laser beam irradiation means relative to each other. The laser beam irradiation means includes first laser beam irradiation means for throwing a first pulsed laser beam having a wavelength in the intermediate-infrared radiation region, and second laser beam irradiation means for throwing a second pulsed laser beam having a wavelength in the ultraviolet radiation region. The first laser beam irradiation means and the second laser beam irradiation means are set such that at least a part, in the processing feed direction, of the focus spot of the second pulsed laser beam overlaps the focus spot of the first pulsed laser beam.
    Type: Grant
    Filed: July 11, 2006
    Date of Patent: January 6, 2009
    Assignee: Disco Corporation
    Inventors: Yukio Morishige, Hiroshi Morikazu, Toshio Tsuchiya, Koichi Takeyama
  • Patent number: 7408129
    Abstract: A laser beam processing machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser beam to the workpiece held on the chuck table, the laser beam application means comprising a laser beam oscillation means for oscillating a laser beam and a condenser for converging the laser beam oscillated by the laser beam oscillation means, wherein the condenser comprises a first cylindrical lens unit having a first cylindrical lens, a second cylindrical lens unit having a second cylindrical lens which is positioned such that its converging direction becomes perpendicular to the converging direction of the first cylindrical lens, and an interval adjustment mechanism for adjusting the interval between the first cylindrical lens unit and the second cylindrical lens unit.
    Type: Grant
    Filed: November 6, 2006
    Date of Patent: August 5, 2008
    Assignee: Disco Corporation
    Inventors: Hiroshi Morikazu, Toshio Tsuchiya, Tomoaki Endo, Koichi Takeyama
  • Patent number: 7399682
    Abstract: A wafer processing method for carrying out processing by applying a laser beam along streets formed on a wafer, comprising a step of applying a laser beam at an incident angle of a predetermined inclination angle to the normal line of a processing surface of the wafer while the wafer is processing-fed along a street from one end to the other end on the side of the laser beam application at an acute angle to the processing surface of the wafer.
    Type: Grant
    Filed: June 8, 2005
    Date of Patent: July 15, 2008
    Assignee: Disco Corporation
    Inventors: Toshiyuki Yoshikawa, Toshio Tsuchiya
  • Publication number: 20080115891
    Abstract: A laser beam machining system includes: a chuck table for holding a wafer; a laser beam irradiation unit for irradiating the wafer held by a chuck table with a laser beam; a machining feeding unit for machining feed of the chuck table; and an indexing feeding unit for indexing feed of the chuck table, wherein the system further includes etching unit for etching the wafer having undergone laser beam machining, and a feeding unit for feeding the laser beam machined wafer held on the chuck table to the etching unit.
    Type: Application
    Filed: November 20, 2007
    Publication date: May 22, 2008
    Applicant: Disco Corporation
    Inventors: Masanori Yoshida, Satoshi Genda, Toshio Tsuchiya
  • Publication number: 20080020548
    Abstract: A wafer laser processing method for forming grooves along streets by applying a pulse laser beam along the streets for sectioning a plurality of devices of a wafer having the plurality of devices which are composed of a laminate consisting of an insulating film and a functional film, on the front surface of a substrate, wherein the pulse laser beam is set to have a repetition frequency of 150 kHz to 100 MHz and an energy per unit length of 5 to 25 J/m.
    Type: Application
    Filed: July 19, 2007
    Publication date: January 24, 2008
    Inventors: Hiroshi Morikazu, Ryugo Oba, Yukio Morishige, Toshio Tsuchiya, Koji Yamaguchi
  • Publication number: 20080011725
    Abstract: A laser beam processing machine comprising a chuck table, a laser beam application means for applying a laser beam to a workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction, wherein the laser beam application means comprises a first laser beam oscillation means for oscillating a first pulse laser beam having a wavelength ranging from a visible range to a near infrared range, a second laser beam oscillation means for oscillating a second pulse laser beam having a wavelength of an ultraviolet range, a delay means for delaying the timing of oscillating the second pulse laser beam a predetermined time after the timing of oscillating the first pulse laser beam and a common condenser for converging the first pulse laser beam and the second pulse laser beam.
    Type: Application
    Filed: July 11, 2007
    Publication date: January 17, 2008
    Inventors: Toshio Tsuchiya, Hiroshi Morikazu
  • Publication number: 20070109526
    Abstract: A laser beam processing machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser beam to the workpiece held on the chuck table, the laser beam application means comprising a laser beam oscillation means for oscillating a laser beam and a condenser for converging the laser beam oscillated by the laser beam oscillation means, wherein the condenser comprises a first cylindrical lens unit having a first cylindrical lens, a second cylindrical lens unit having a second cylindrical lens which is positioned such that its converging direction becomes perpendicular to the converging direction of the first cylindrical lens, and an interval adjustment mechanism for adjusting the interval between the first cylindrical lens unit and the second cylindrical lens unit.
    Type: Application
    Filed: November 6, 2006
    Publication date: May 17, 2007
    Inventors: Hiroshi Morikazu, Toshio Tsuchiya, Tomoaki Endo, Koichi Takeyama
  • Publication number: 20070023691
    Abstract: A laser processing apparatus comprising a chuck table, laser beam irradiation means for irradiating a workpiece held on the chuck table with a laser beam, and processing feed means for processing-feeding the chuck table and the laser beam irradiation means relative to each other. The laser beam irradiation means includes first laser beam irradiation means for throwing a first pulsed laser beam having a wavelength in the intermediate-infrared radiation region, and second laser beam irradiation means for throwing a second pulsed laser beam having a wavelength in the ultraviolet radiation region. The first laser beam irradiation means and the second laser beam irradiation means are set such that at least a part, in the processing feed direction, of the focus spot of the second pulsed laser beam overlaps the focus spot of the first pulsed laser beam.
    Type: Application
    Filed: July 11, 2006
    Publication date: February 1, 2007
    Inventors: Yukio Morishige, Hiroshi Morikazu, Toshio Tsuchiya, Koichi Takeyama
  • Patent number: 7092187
    Abstract: The present invention provides a magnetic recording and reproducing apparatus, a magnetic recording and reproducing method, and a thin film magnetic head that enable a good contact between elements and a recording medium with a reduced track pitch even if the number of head channels is increased, thereby realizing high recording density and high transfer rate. At least one multitrack write head having N (N is an integer of 2 or more) write elements arranged along a track width direction in an integral fashion and at least one multitrack read head having L (L is an integer equal to or more than N) read elements arranged along the track width direction in an integral fashion are formed on the rotary drum. The multitrack write head writes signals to a group of N tracks aligned parallel on the magnetic tape during one rotation of the rotary drum, and the multitrack read head reads the group of N signal tracks by the use of any one of the L read elements.
    Type: Grant
    Filed: August 5, 2003
    Date of Patent: August 15, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Toshio Tsuchiya, Kenkichi Inada, Akihisa Obata
  • Publication number: 20060148211
    Abstract: A wafer dividing method for cutting a wafer having devices which are composed of a laminate laminated on the front surface of a substrate with a cutting blade along a plurality of streets for sectioning the devices, comprising the steps of a groove forming step for forming two grooves deeper than the thickness of the laminate at an interval larger than the thickness of the cutting blade by applying a laser beam along the streets formed on the wafer; an alignment step for picking up an image of the two grooves formed in the streets of the wafer by the above groove forming step and positioning the cutting blade at the center position between the two grooves based on the image; and a cutting step for moving the cutting blade and the wafer relative to each other while the cutting blade is rotated to cut the wafer along the streets having the two grooves formed therein, after the above alignment step.
    Type: Application
    Filed: January 4, 2006
    Publication date: July 6, 2006
    Inventors: Kenichi Iwasaki, Satoshi Genda, Toshio Tsuchiya
  • Patent number: 7023635
    Abstract: A recording/reproducing apparatus capable of switching over among a plurality of heads with high precision, wherein the apparatus is provided with: a recording/reproducing unit for recording/reproducing signals onto/from a recording medium with a plurality of heads; a generating unit for generating control data for controlling the recording/reproducing unit; and a transmitting unit for transmitting control data generated by the generating unit to the recording/reproducing unit, wherein priority is given in transmission to data for controlling the switching of the plurality of heads over other data.
    Type: Grant
    Filed: March 15, 2004
    Date of Patent: April 4, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Shigeru Yamazaki, Kemmei Masuda, Toshio Tsuchiya
  • Publication number: 20060009008
    Abstract: A method for the laser processing of a wafer having a plurality of devices which are composed of a laminate consisting of an insulating film and a functional film on the front surface of a substrate, the method comprising applying a pulse laser beam along streets for sectioning the plurality of devices to form grooves along the streets, wherein a pulse width of the pulse laser beam is set to 100 to 1,000 ns.
    Type: Application
    Filed: July 7, 2005
    Publication date: January 12, 2006
    Inventors: Yasuomi Kaneuchi, Yukio Morishige, Satoshi Genda, Satoshi Kobayashi, Toshio Tsuchiya, Ryugo Oba
  • Publication number: 20050277270
    Abstract: A wafer processing method for carrying out processing by applying a laser beam along streets formed on a wafer, comprising a step of applying a laser beam at an incident angle of a predetermined inclination angle to the normal line of a processing surface of the wafer while the wafer is processing-fed along a street from one end to the other end on the side of the laser beam application at an acute angle to the processing surface of the wafer.
    Type: Application
    Filed: June 8, 2005
    Publication date: December 15, 2005
    Inventors: Toshiyuki Yoshikawa, Toshio Tsuchiya
  • Publication number: 20040169952
    Abstract: A recording/reproducing apparatus capable of switching over among a plurality of heads with high precision, wherein the apparatus is provided with: a recording/reproducing unit for recording/reproducing signals onto/from a recording medium with a plurality of heads; a generating unit for generating control data for controlling the recording/reproducing unit; and a transmitting unit for transmitting control data generated by the generating unit to the recording/reproducing unit, wherein priority is given in transmission to data for controlling the switching of the plurality of heads over other data.
    Type: Application
    Filed: March 15, 2004
    Publication date: September 2, 2004
    Applicant: HITACHI, LTD.
    Inventors: Shigeru Yamazaki, Kemmei Masuda, Toshio Tsuchiya
  • Patent number: 6757123
    Abstract: According to the invention, techniques for cleaning a rotary magneto-resistive head. Embodiments according to the invention are especially useful in tape drive systems, and the like. Embodiments can provide methods and apparatus for cleaning contaminant from rotary magneto-resistive heads while guarding against damage to the head from excess cleaning, and the like. Specific embodiments can control the rotational speed of a rotary magneto-resistive head in order to facilitate cleaning operations. Embodiments include a cleaning device and a control method, and are suited for use in a magneto-resistive head mounted on a rotary cylinder of a computer tape storage unit, for example, although application of the present invention is not limited to such embodiments.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: June 29, 2004
    Assignee: Exabyte Corporation
    Inventors: Kenmei Masuda, Hidekazu Takeda, Shigeru Yamazaki, Akihisa Obata, Toshio Tsuchiya, Kenkichi Inada, Kuniako Hirayama
  • Publication number: 20040080855
    Abstract: The present invention provides a magnetic recording and reproducing apparatus, a magnetic recording and reproducing method, and a thin film magnetic head that enable a good contact between elements and a recording medium with a reduced track pitch even if the number of head channels is increased, thereby realizing high recording density and high transfer rate.
    Type: Application
    Filed: August 5, 2003
    Publication date: April 29, 2004
    Inventors: Toshio Tsuchiya, Kenkichi Inada, Akihisa Obata