Abstract: A plating system comprising a plating tank for applying plate processing to a substrate, a sensor configured to measure actual plating film thickness of the substrate, and a controller configured to control plating current supplied to the plating tank and plating time for the plate processing of the substrate within the plating tank. The controller is capable of setting target plating film thickness, plating current, and plating time as a plate processing recipe. At least one of the plating current and the plating time is automatically corrected so that the actual plating film thickness and the target plating film thickness become equal to each other, and the result is reflected in the plate processing for the subsequent substrate.

Abstract: The substrate processing apparatus includes a processing chamber including an outer chamber configured to hold a processing liquid and an inner chamber capable of surrounding the substrate held by the substrate holder; a liquid delivery pipe having one end coupled to a bottom of the inner chamber and other end coupled to the outer chamber; a pump configured to suck the processing liquid from the inner chamber through the liquid delivery pipe and to deliver the processing liquid to the outer chamber through the liquid delivery pipe; and a guide cover having a through-hole in which the substrate holder can be inserted. The guide cover is located below an upper end of the outer chamber and above the inner chamber.

Abstract: A substrate attaching/detaching unit includes a stocker accommodating a plurality of substrate holders 80 and adapted so that the substrate holders 80 are aligned in a vertical direction with one another in a horizontal posture, a first substrate holder conveying mechanism that takes the substrate holders 80 into and out of the stocker, an elevating mechanism that raises and lowers the first substrate holder conveying mechanism in the vertical direction, a second substrate holder conveying mechanism that transfers the substrate holder to and from the first substrate holder conveying mechanism, and a substrate attaching/detaching mechanism that attaches and detaches the substrate to and from the substrate holder held in the second substrate holder conveying mechanism.

Abstract: A cylinder block including: a plurality of cylinders; a cylinder head attached on the cylinder block and including, for each of the cylinders, an intake port extending from a combustion chamber upward and obliquely relative to an axis of the cylinder; a direct injector disposed at a position on an outer side of the intake port in a cylinder radial direction and directly injecting fuel into the combustion chamber; a port injector disposed at a position on a same side as the direct injector relative to the intake port, and injecting fuel into the intake port are provided. The intake port includes: a valve seat provided at an intake air inlet opened to the combustion chamber; and an arc portion protruding downward in a center area of the intake port on an upstream side of the valve seat, and an injection direction of the port injector is orientated in a direction in which the fuel injected from the port injector passes through a lower area of the arc portion.

Abstract: A plating apparatus including a plating bath, a substrate holder to be arranged in the plating bath and adapted to hold a substrate, an anode for generating an electric field between the substrate and the anode, and at least one electric field shielding body for shielding the substrate holder and a part or the whole of the electric field, wherein the electric field shielding body has an opening portion for allowing the electric field between the substrate and the anode to pass therethrough, and is configured so as to be capable of adjusting an opening size in a first direction of the opening portion and an opening size in a second direction of the opening portion independently of each other.

Abstract: To provide a substrate holder and a plating apparatus that can easily position a substrate. A substrate holder includes a substrate holding body for holding a substrate, and a first holding member and a second holding member that interpose and hold the substrate holding body therebetween, and the first holding member includes an opening portion through which the plating target surface of the substrate is exposed, and a power supply member configured to be in contact with a plating target surface of the substrate.

Abstract: Provided is a supply-liquid producing apparatus capable of producing a supply liquid by an amount needed at a use point. A supply-liquid producing apparatus includes a mixer that mixes water and ozone gas to produce ozone water; a booster pump that increases the pressure of the water supplied to the mixer; a gas-liquid separation tank that separates the ozone water produced by the mixer into ozone water to be supplied to a use point and exhaust gas to be discharged from an exhaust port; a flowmeter that measures the flow rate of the ozone water supplied from the gas-liquid separation tank to the use point; a flow control unit that adjusts the flow rate of the water supplied to the mixer by controlling the booster pump in response to the flow rate of the ozone water measured by the flowmeter; and an exhaust pressure control unit that controls the exhaust pressure to keep constant the water level in the gas-liquid separation tank.

Abstract: A rinsing bath which can simplify a discharging structure of a rinsing liquid is disclosed. The rinsing bath includes an inner bath for storing the rinsing liquid, an overflow bath configured to receive the rinsing liquid overflowing the inner bath, a stopper for closing a drain hole provided on a bottom of the inner bath, an actuator configured to move the stopper between a closing position in which the stopper closes the drain hole and a opening position in which the stopper is away from the drain hole, a rinsing liquid supply pipe configured to supply the rinsing liquid into the inner bath, and a drain pipe coupled to a bottom of the overflow bath. The drain hole communicates between an inside of the inner bath and an inside of the overflow bath.

Abstract: A substrate processing apparatus comprises a transferring device including a grasping section configured to grasp a substrate holder, and a transferring section configured to transfer the substrate holder grasped by the grasping section, and a processing bath for storing a substrate held by the substrate holder so that a surface of the substrate is vertically oriented, and processing the substrate. The grasping section is configured to grasp the substrate holder with a surface of the substrate oriented horizontally. The transferring section is configured to transfer the substrate holder above the processing bath, with the surface of the substrate oriented horizontally.

Abstract: The present invention provides a plating apparatus capable of individually controlling a plating process on a front surface and a back surface of a substrate and a substrate holder usable for such a plating apparatus. A substrate holder for holding a substrate which is a plating target during a plating process is provided and such a substrate holder includes a body part for holding the substrate, provided with a first opening and a second opening, the body part is configured such that when the body part holds the substrate, a plated region on the front surface of the substrate is exposed through the first opening and a plated region on the back surface of the substrate is exposed through the second opening and a sealing part that protrudes from a peripheral portion is included in at least part of the peripheral portion of the body part.

Abstract: A substrate attachment/detachment device which clamps and holds a substrate by means of first and second retaining members of a substrate holder, the device comprising a first holder retainer configured to hold the first retaining member in a first posture; and a second holder retainer configured to be movable in a linear manner toward and away from the first holder retainer, capable of holding the second retaining member in the first posture and a second posture which is substantially orthogonal to the first posture, configured to push the second retaining member against the first retaining member in the first posture to lock the first and second retaining members to each other.

Abstract: A plating system comprising a plating tank for applying plate processing to a substrate, a sensor configured to measure actual plating film thickness of the substrate, and a controller configured to control plating current supplied to the plating tank and plating time for the plate processing of the substrate within the plating tank. The controller is capable of setting target plating film thickness, plating current, and plating time as a plate processing recipe. At least one of the plating current and the plating time is automatically corrected so that the actual plating film thickness and the target plating film thickness become equal to each other, and the result is reflected in the plate processing for the subsequent substrate.

Abstract: A substrate processing apparatus according to the present invention comprises a transferring device including a grasping section configured to grasp a substrate holder, and a transferring section configured to transfer the substrate holder grasped by the grasping section, and a processing bath for storing a substrate held by the substrate holder so that a surface of the substrate is vertically oriented, and processing the substrate. The grasping section is configured to grasp the substrate holder with a surface of the substrate oriented horizontally. The transferring section is configured to transfer the substrate holder above the processing bath, with the surface of the substrate oriented horizontally.

Abstract: A substrate processing apparatus is described herein. The substrate processing apparatus comprises a transferring device including: a grasping section configured to grasp a substrate holder, a transferring section configured to transfer the substrate holder grasped by the grasping section, and a processing bath for storing a substrate held by the substrate holder so that a surface of the substrate is vertically oriented. The grasping section is configured to grasp the substrate holder with a surface of the substrate oriented horizontally. The transferring section is configured to transfer the substrate holder above the processing bath, with the surface of the substrate oriented horizontally.

Abstract: A cylinder block including: a plurality of cylinders; a cylinder head attached on the cylinder block and including, for each of the cylinders, an intake port extending from a combustion chamber upward and obliquely relative to an axis of the cylinder; a direct injector disposed at a position on an outer side of the intake port in a cylinder radial direction and directly injecting fuel into the combustion chamber; a port injector disposed at a position on a same side as the direct injector relative to the intake port, and injecting fuel into the intake port are provided. The intake port includes: a valve seat provided at an intake air inlet opened to the combustion chamber; and an arc portion protruding downward in a center area of the intake port on an upstream side of the valve seat, and an injection direction of the port injector is orientated in a direction in which the fuel injected from the port injector passes through a lower area of the arc portion.

Abstract: A cleaning apparatus 1 is provided with a heating unit 5 that heats a cleaning surface of a substrate W, a cleaning unit 6 that supplies ozone water to the cleaning surface of the substrate W and cleans the cleaning surface and a control unit 7 that controls the heating of the cleaning surface and the supply of the cleaning liquid so as to clean the cleaning surface after heating the cleaning surface of the substrate W.

Abstract: A substrate processing apparatus has a substrate rotating device 10, 20 for holding and rotating a substrate W, a cleaning device 41 configured to clean a substrate W which is rotated by the substrate rotating device 10, 20 at predetermined rotating speed, a movement device 42 configured to move the cleaning device 41 between a cleaning position P3 and a separate position P2, and a control unit 64. The control unit 64 controls the movement device 42 so that the cleaning device 41 located at the separate position P2 starts moving toward the cleaning position P3 before a rotating speed of the substrate W held by the substrate rotating device 10, 20 reaches the predetermined rotating speed and the cleaning device 41 reaches the cleaning position P3 after a rotating speed of the substrate W reaches the predetermined rotating speed. Therefore, it is possible to improve the throughput in the substrate cleaning step.

Abstract: A lifting device 630b includes a lifting mechanism 640 and an adjustment member 660. The lifting mechanism 640 is provided between at least one of a plurality of units of a substrate processing apparatus and an installation surface of the unit, and adjusts height of the at least one unit with respect to the installation surface. The adjustment member 660 is provided with an extended section 664 extended from the lifting mechanism 640, and is capable of operating the lifting mechanism 640 through the extended section 664.

Abstract: A substrate processing apparatus can prevent photo-corrosion of, e.g., copper interconnects due to exposure of a surface to be processed of a substrate to light, and can perform processing, such as cleaning, of a substrate surface while preventing photo-corrosion of, e.g., copper interconnects due to exposure to light. The substrate processing apparatus includes a plurality of processing areas housing therein processing units which have been subjected to light shielding processing; and at least one transfer area housing therein a transfer robot and disposed between two adjacent ones of the plurality of processing areas. A light shielding wall is provided between the transfer area and each of the two adjacent processing areas, and a light-shielding maintenance door is provided for the front opening of the transfer area. The processing units are coupled to the light shielding walls in a light-shielding manner.

Abstract: The substrate processing apparatus includes a processing chamber including an outer chamber configured to hold a processing liquid and an inner chamber capable of surrounding the substrate held by the substrate holder; a liquid delivery pipe having one end coupled to a bottom of the inner chamber and other end coupled to the outer chamber; a pump configured to suck the processing liquid from the inner chamber through the liquid delivery pipe and to deliver the processing liquid to the outer chamber through the liquid delivery pipe; and a guide cover having a through-hole in which the substrate holder can be inserted. The guide cover is located below an upper end of the outer chamber and above the inner chamber.