Patents by Inventor Toshiomi Yokoyama

Toshiomi Yokoyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shaping method of thin film and manufacturing method of perpendicular recording magnetic head using the same
    Patent number: 8080167
    Abstract: The present invention relates to a shaping method of a thin film layer and a manufacturing method of a perpendicular recording magnetic head using the same. In the thin film layer shaping method according to the present invention, since a second thin film of a lower etching rate is etched by a preliminary etching amount allowing for a difference between the etching rate of the second thin film and an etching rate of a first thin film in side-by-side relationship with each other, both the first and second thin films can be etched by the same etching amount through a subsequent etching step, so that the thin film layer can be shaped into a given shape. Thus, the surface of the thin film layer can be planarized.
    Type: Grant
    Filed: February 20, 2009
    Date of Patent: December 20, 2011
    Assignee: TDK Corporation
    Inventors: Hisayoshi Watanabe, Toshiomi Yokoyama, Nobuyuki Mori, Akihiro Kaneko, Michitaka Nishiyama, Kenji Yokoyama
  • SHAPING METHOD OF THIN FILM AND MANUFACTURING METHOD OF PERPENDICULAR RECORDING MAGNETIC HEAD USING THE SAME
    Publication number: 20100213163
    Abstract: The present invention relates to a shaping method of a thin film layer and a manufacturing method of a perpendicular recording magnetic head using the same. In the thin film layer shaping method according to the present invention, since a second thin film of a lower etching rate is etched by a preliminary etching amount allowing for a difference between the etching rate of the second thin film and an etching rate of a first thin film in side-by-side relationship with each other, both the first and second thin films can be etched by the same etching amount through a subsequent etching step, so that the thin film layer can be shaped into a given shape. Thus, the surface of the thin film layer can be planarized.
    Type: Application
    Filed: February 20, 2009
    Publication date: August 26, 2010
    Applicant: TDK CORPORATION
    Inventors: Hisayoshi Watanabe, Toshiomi Yokoyama, Nobuyuki Mori, Akihiro Kaneko, Michitaka Nishiyama, Kenji Yokoyama