Abstract: According to one embodiment, a photosensitive composition includes a great number of photosensitive core-shell type nano-particles each including a core and a shell and having a structure that the core is metal oxide particle and covered by the shell. The shell includes a) unsaturated carboxylic acid or unsaturated carboxylate, which is a negatively ionized unsaturated carboxylic acid, and b) silylated unsaturated carboxylic acid or unsaturated carboxylate which is negatively ionized silylated unsaturated carboxylic acid.

Abstract: According to one embodiment, a photosensitive composition includes a great number of photosensitive core-shell type nano-particles each including a core and a shell and having a structure that the core is metal oxide particle and covered by the shell. The shell includes a) unsaturated carboxylic acid or unsaturated carboxylate, which is a negatively ionized unsaturated carboxylic acid, and b) silylated unsaturated carboxylic acid or unsaturated carboxylate which is negatively ionized silylated unsaturated carboxylic acid.

Abstract: The present invention relates to a photosensitive composition, which is capable of being irradiated with high energy beam having a wave length of 1 to 300 nm band. The photosensitive composition includes a binder resin; and a photoelectron absorbent, capable of being excited with photoelectron emitted from the binder resin that absorbs the high energy beam, when the binder resin is irradiated with the high energy beam.

Abstract: The present invention relates to a photosensitive composition, which is capable of being irradiated with high energy beam having a wave length of 1 to 300 nm band. The photosensitive composition includes a binder resin; and a photoelectron absorbent, capable of being excited with photoelectron emitted from the binder resin that absorbs the high energy beam, when the binder resin is irradiated with the high energy beam.

Abstract: A method of purifying immersion oil, includes bringing a liquid organic compound into contact with a solid base, wherein the solid base is barium oxide.

Abstract: There is provided a method of forming, on a substrate, a fine resist pattern comprising a step for forming a photosensitive layer by using a photo-sensitive composition comprising at least a compound generating an acid by irradiation of light and a fluorine-containing polymer,

Abstract: There is provided a method of forming a fine resist pattern in which a highly practicable photosensitive composition obtained from a material having a high transparency against an exposure light having a short wavelength such as F2 excimer laser beam is used as a resist.

Abstract: There is provided a method of forming a fine resist pattern in which a highly practicable photo-sensitive composition obtained from a material having a high transparency against an exposure light having a short wavelength such as F2 excimer laser beam is used as a resist, and the method of forming a fine resist pattern comprises a step for forming a photo-sensitive layer on a substrate or on a given layer on a substrate using a photo-sensitive composition comprising at least a compound generating an acid by irradiation of light and a compound having fluorine atom in its molecular structure, a step for exposing by selectively irradiating a given area of said photo-sensitive layer with energy ray, a step for heat-treating the exposed photo-sensitive layer, and a step for forming a fine pattern by developing the heat-treated photo-sensitive layer to selectively remove the exposed portion or un-exposed portion of the photo-sensitive layer.

Abstract: To provide chemically amplified resist which is excellent in resolution, focusing and size accuracy as well by preventing problem of T-shaped resist pattern and reinforcing exposure dependence of solution speed, a mixture of t-BOC protected polyhydroxystyrene polymers having different molecular weight are used as a basic polymer of chemically amplified resist together with PAG. Preferable molecular-weight ratio and mixing ratio of the mixture are 1:5 to 1:20, and 10 to 30 parts by weight of low molecular-weight polymer to 100 parts of high molecular-weight polymer, respectively.

Abstract: To provide chemically amplified resist which is excellent in resolution, focusing and size accuracy as well by eliminating problem of the tapered resist pattern owing to the photo-absorption, and gives, at the same time, high thermal stability and sufficient resistance against dry-etching, resin having an aromatic ring is added in chemically amplified resist comprising a alicyclic acrylic polymer and a photoacid generator. As to the resin having the aromatic ring, it is preferably a polyhydroxystyrene polymer, a novolac polymer or a t-BOC protected polyhydroxystyrene polymer. Preferable additive amount of these polymers is 1 to 10 parts by weight to 100 parts of base polymer.