Abstract: Disclosed is an apparatus for and a method of thixocasting a cast iron, that can effectively prevent the scale from mixing in the die (cavity) thereby to obtain sound iron castings having good mechanical properties. The apparatus includes at least a pair of dies that can freely opened and closed to define a cavity to be filled under a pressure, and an injector that injects the semi-molten iron into the cavity through a hole in a gate at the entry of the cavity so as to throttle the entry. The gate is a separate member disposed at the entry of the cavity every time an injection casting operation is carried out and is taken out together with the casting after the injection casting operation.

Abstract: An apparatus for conveying a workpiece as used to convey the workpiece such as a semiconductor wafer, a glass substrate or liquid crystal panel, between processing apparatuses when the workpiece is processed in the plurality of processing apparatuses. The amount of liquid on a surface of a workpiece is adjusted to a predetermined amount, and the workpiece, which retains the predetermined amount of liquid, is conveyed between processes. The adjusting includes both supplying a sufficient amount of liquid onto the surface of the workpiece, which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.

Abstract: An apparatus for conveying a workpiece as used to convey the workpiece such as a semiconductor wafer, a glass substrate or liquid crystal panel, between processing apparatuses when the workpiece is processed in the plurality of processing apparatuses. The amount of liquid on a surface of a workpiece is adjusted to a predetermined amount, and the workpiece, which retains the predetermined amount of liquid, is conveyed between processes. The adjusting includes both supplying a sufficient amount of liquid onto the surface of the workpiece, which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.

Abstract: A method and apparatus for conveying workpiece is used for conveying a workpiece such as a semiconductor wafer, glass substrate or liquid crystal panel between processing apparatuses when the workpiece is processed in a plurality of processing apparatuses. The method includes adjusting the amount of liquid on a surface of a workpiece to a predetermined amount, and conveying the workpiece which retains the predetermined amount of liquid between processes. The surface of the workpiece is kept wet by the liquid on the workpiece. The adjusting includes supplying a sufficient amount of liquid onto the surface of the workpiece which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.

Abstract: A washing method provides a liquid jet washing by jetting a liquid against a rotating thin-plate-shaped workpiece from a nozzle which shifts while being positioned opposite a front or back surface of the workpiece, thus removing dust adhering to the front or back surface and thereby washing the workpiece. The locus of the shifting nozzle is caused to pass in the vicinity of, but not over, the center of rotation of the workpiece. Electronic circuitry present at the central portion of workpiece is prevented from suffering electrostatic breakage caused by collision with washing liquid. At the same time, an appropriate quantity of washing liquid is made to collide with the entire surface of a workpiece, so that the workpiece can be washed satisfactorily.

Abstract: A roll type washer is a primary washer and includes a roll type washing member which rotates in contact with the surface of a semiconductor wafer, and a rotary driving member which rotates the semiconductor wafer. A secondary washer is a pad type washer including a pad washing mechanism which rotates and pivots over the semiconductor surface while in contact with the surface, and a rotary member which rotates the semiconductor wafer.

Abstract: A cleaning apparatus is used for cleaning a thin disk-shaped workpiece such as a semiconductor wafer, a liquid crystal display or the like. The cleaning apparatus comprises a support mechanism for supporting a workpiece and rotating the workpiece about its own axis, and a cleaning member for being in sliding contact with at least one of opposite surfaces of the workpiece. The support mechanism comprises a plurality of spindles, and a plurality of rotatable holding portions provided on upper ends of the spindles and having respective circumferential edges engageable with a circumferential edge of the workpiece. The plurality of spindles are clustered into groups around the workpiece, and two adjacent groups of the spindles are positioned to form a wide spacing between two adjacent groups of the spindles, and a path along which the workpiece is supplied to and removed from the support mechanism is positioned in the wide spacing.

Abstract: A method of and an apparatus for cleaning a thin disk-shaped workpiece that is required to have a high degree of cleanliness, e.g., a semiconductor wafer, a glass substrate, a liquid crystal display, or the like. The method of cleaning the workpiece includes a plurality of cleaning steps, and comprises the steps of holding a workpiece, and performing a liquid jet cleaning of a surface of the workpiece in a first portion of plural cleaning steps. The method further comprises the step of performing a liquid jet cleaning of the surface of the workpiece in a latter portion of the plural cleaning steps.

Abstract: A method of and an apparatus for cleaning workpiece is suitable for cleaning a substrate such as a semiconductor substrate, a glass substrate, or a liquid crystal panel to a high level of cleanliness. The method of cleaning a workpiece comprises the steps of holding a workpiece, scrubbing the workpiece with a cleaning member, and rubbing the cleaning member against a member having a rough surface to carry out a self-cleaning of the cleaning member. The cleaning member which is contaminated by having scrubbed the workpiece is rubbed against the rough surface, and the rough surface scrapes the contaminant off the cleaning member. Therefore, the contaminant can effectively be removed from the cleaning member, and hence the cleaning member has a high self-cleaning effect.

Abstract: A semiconductor cleaning method includes scrubbing a semiconductor wafer using a cleaning member made primarily of polyurethane and having micropores in a surface contacting the semiconductor wafer. The micropores have an average diameter ranging from 10 to 200 .mu.m. The cleaning member may be made of either polyurethane foam or non-woven fabric composed of fibers bound together by urethane resin. By this scrubbing step, particles that are strongly attached to the surface of a substrate such as the semiconductor wafer can easily be removed. During cleaning of the substrate, surface irregularities and crystalline protrusions on the surface of a substrate such as a semiconductor wafer can be scraped off to adjust the surface roughness of the semiconductor wafer to a desired degree for making the semiconductor wafer surface flat.

Abstract: A substrate gripper device for gripping a substrate has a rotatable substrate stage, a plurality of fixing fingers vertically mounted on an outer edge of the rotatable substrate stage and having respective horizontal substrate rests for placing thereon an outer edge of the substrate, and a plurality of swing fingers angularly movably supported on the fixing fingers, respectively, for vertically gripping the substrate in coaction with the fixing fingers. The swing fingers are normally biased to move in a closing direction toward the fixing fingers, respectively, by helical springs acting on the swing fingers. A plurality of opening pins are vertically movably disposed below the swing fingers, respectively, and movable upwardly for angularly moving the swing fingers in the opening direction against biasing forces of the helical springs. An opening mechanism is vertically movably disposed below the substrate stage for simultaneously moving the opening pins upwardly.

Abstract: A vibrating column pump pumps liquid by making use of liquid vibration generated at the time when the vibrating pipe is vibrated in a longitudinal direction thereof. The vibrating column pump comprises a vibrating pipe for pumping liquid therethrough, flexible pipes for connecting both ends of the vibrating pipe with a stationary suction pipe and a stationary outlet pipe, vibrating means for vibrating the vibrating pipe in a longitudinal direction thereof, and retainer means for removably retaining the vibrating pipe in such a manner that the vibrating pipe is removably connected to the vibrating means. The liquid contacting unit including the vibrating pipe and the flexible pipes is separated from the vibrating means so that the liquid contacting unit is disposable and can be easily replaced with a new one.

Abstract: A substrate gripper device for gripping a substrate has a rotatable substrate stage, a plurality of fixing fingers vertically mounted on an outer edge of the rotatable substrate stage and having respective horizontal substrate rests for placing thereon an outer edge of the substrate, and a plurality of swing fingers angularly movably supported on the fixing fingers, respectively, for vertically gripping the substrate in coaction with the fixing fingers. The swing fingers are normally biased to move in a closing direction toward the fixing fingers, respectively, by helical springs acting on the swing fingers. A plurality of opening pins are vertically movably disposed below the swing fingers, respectively, and movable upwardly for angularly moving the swing fingers in the opening direction against biasing forces of the helical springs. An opening mechanism is vertically movably disposed below the substrate stage for simultaneously moving the opening pins upwardly.