Patents by Inventor Toshirou Yamada

Toshirou Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6403846
    Abstract: A composition containing less than 95 mol % of a trihydrofluorinated saturated hydrocarbon represented by the following formula (I) Rf1—R1—Rf2  (I) (wherein R1 represents a carbon chain in which CHF and CH2 are bound, and Rf1 and Rf2 are bound to each other to form a ring by a perfluoroalkylene chain of 2 to 4 carbon atoms) and the balance of a tetrahydrofluorinated saturated hydrocarbon having the same carbon number and the same carbon structure as the trihydrofluorinated saturated hydrocarbon, as represented by the following formula (II) Rf1—R2—Rf2  (II) (wherein R2 represents a carbon chain in which CH2 and CH3 are bound, and Rf1 and Rf2 are as defined above) is provided as a composition containing, in a high proportion, trihydrofluorocarbon, a hydrofluorocarbon (HFC) known to have a small global heating coefficient, which has less influence on the global environment, shows less toxicity to animals, and is chemically stable.
    Type: Grant
    Filed: February 3, 2000
    Date of Patent: June 11, 2002
    Assignees: Japan as Represented by Director General of Agency of Industrial Science and Technology, Nippon Zeon Co., Ltd.
    Inventors: Akira Sekiya, Toshirou Yamada, Takashi Uruma, Tatsuya Sugimoto
  • Patent number: 6312759
    Abstract: Providing a fluorinated hydrocarbon with excellent cleaning action, incombustibility and high stability in alkali or water and heat; and a polymer-containing solution prepared by dissolving or dispersing a polymer with film-forming potency, preferably a fluoropolymer, in a solvent containing trihydrofluorocarbon. More specifically, a fluorinated hydrocarbon containing trihydrofluorocarbon with 4 to 6 carbon atoms at 95% or more, as represented by the following formula, is provided, together with a polymer-containing solution containing the same: Rf1—R1—Rf2   (I) wherein R1 represents a carbon chain of CHF and CH2, bound to each other; Rf1 and Rf2 independently represent a perfluoroalkyl group; and Rf1 and Rf2 may be bound to each other, to form a ring.
    Type: Grant
    Filed: April 13, 2000
    Date of Patent: November 6, 2001
    Assignee: Nippon Zeon Co., Ltd.
    Inventors: Toshirou Yamada, Kuniaki Goto, Tatsuya Sugimoto
  • Patent number: 5574119
    Abstract: A thermoplastic resin film at least oriented in the transverse direction with minimized bowing phenomenon is provided. The thermal shrinkage stress in the transverse direction of the film satisfies the following formula I, and the thermal shrinkage factor of said film in the transverse direction at a temperature that is 40.degree. C. higher than the glass transition temperature of said resin is 5% or less:(.sigma..sub.2 /.sigma..sub.1).ltoreq.1.0 (I)wherein .sigma..sub.1 is the thermal shrinkage stress (kg/mm.sup.2) of the film in the transverse direction at a temperature that is 70.degree. C. higher than the glass transition temperature of said resin, and .sigma..sub.2 is the thermal shrinkage stress (kg/mm.sup.2) of the said film in the transverse direction at a temperature that is 80.degree. C. lower than the melting temperature of said resin.
    Type: Grant
    Filed: January 23, 1995
    Date of Patent: November 12, 1996
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Toshirou Yamada, Chisato Nonomura
  • Patent number: 5411695
    Abstract: A thermoplastic resin film at least oriented in the transverse direction with minimized bowing phenomenon is provided. The thermal shrinkage stress in the transverse direction of the film satisfies the following formula I, and the thermal shrinkage factor of said film in the transverse direction at a temperature that is 40.degree. C. higher than the glass transition temperature of said resin is 5% or less:(.sigma..sub.2 /.sigma..sub.1).ltoreq. 1.0 (I)wherein .sigma..sub.1 is the thermal shrinkage stress (kg/mm.sup.2) of the film in the transverse direction at a temperature that is 70.degree. C. higher than the glass transition temperature of said resin, and .sigma..sub.2 is the thermal shrinkage stress (kg/mm.sup.2) of the said film in the transverse direction at a temperature that is 80.degree. C. lower than the melting temperature of said resin.
    Type: Grant
    Filed: October 13, 1993
    Date of Patent: May 2, 1995
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Toshirou Yamada, Chisato Nonomura