Abstract: A cutting apparatus includes a cutting unit cutting an outer peripheral edge of a wafer to form an annular groove; a holding section holding the wafer in a rotatable manner; a line scan camera having imaging elements arranged in a row along a width direction of the annular groove so as to face the annular groove of the wafer held by the holding section and capturing the annular groove while rotating the holding section to output a signal; an inspection section obtaining an image of the annular groove corresponding to an entire circumference of the wafer from the signal output by the line scan camera and detecting a width of the annular groove and a chipping from the formed image; and a warning section sending warning information in a case in which an inspection result of the inspecting section is out of an allowable range registered in advance.