Patents by Inventor Toshitaka Kuroda

Toshitaka Kuroda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical module with flexible wiring board
    Patent number: 9325418
    Abstract: On a predetermined mounting surface of a surface (22A) of a flexible wiring board (22), a flexible wiring board pressing plate (28) which presses the mounting surface against a lower cover (12) is provided at a position immediately below a first radiation block (24) and a pressing sheet (26). The flexible wiring board pressing plate (28) has five pairs of projections (28PA and 28PB) respectively arranged in lines. The projections (28PA and 28PB) are formed to intersect conductive patterns (22ACP) at predetermined intervals.
    Type: Grant
    Filed: October 25, 2012
    Date of Patent: April 26, 2016
    Assignee: MELLANOX TECHNOLOGIES, LTD.
    Inventors: Toshitaka Kuroda, Satoru Yoshida, Toshiyasu Ito
  • OPTICAL MODULE
    Publication number: 20140284463
    Abstract: On a predetermined mounting surface of a surface (22A) of a flexible wiring board (22), a flexible wiring board pressing plate (28) which presses the mounting surface against a lower cover (12) is provided at a position immediately below a first radiation block (24) and a pressing sheet (26). The flexible wiring board pressing plate (28) has five pairs of projections (28PA and 28PB) respectively arranged in lines. The projections (28PA and 28PB) are formed to intersect conductive patterns (22ACP) at predetermined intervals.
    Type: Application
    Filed: October 25, 2012
    Publication date: September 25, 2014
    Inventors: Toshitaka Kuroda, Satoru Yoshida, Toshiyasu Ito
  • Semiconductor device carrier unit and semiconductor socket provided therewith
    Patent number: 7511375
    Abstract: In a pressing cap forming part of a semiconductor device carrier unit, a pressing portion of a pressure body has recesses, to each of which a bump is inserted.
    Type: Grant
    Filed: September 28, 2005
    Date of Patent: March 31, 2009
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Toshitaka Kuroda, Minoru Hisaishi
  • Semiconductor device carrier unit and semiconductor socket provided therewith
    Publication number: 20060071331
    Abstract: In a pressing cap forming part of a semiconductor device carrier unit, a pressing portion of a pressure body has recesses, to each of which a bump is inserted.
    Type: Application
    Filed: September 28, 2005
    Publication date: April 6, 2006
    Inventors: Toshitaka Kuroda, Minoru Hisaishi
  • Socket for semiconductor device
    Publication number: 20050250363
    Abstract: The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.
    Type: Application
    Filed: June 27, 2005
    Publication date: November 10, 2005
    Inventors: Takeyuki Suzuki, Noriyuki Matsuoka, Yoshinori Wakabayashi, Toshitaka Kuroda
  • Socket for semiconductor device
    Patent number: 6910898
    Abstract: The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.
    Type: Grant
    Filed: July 8, 2003
    Date of Patent: June 28, 2005
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Takeyuki Suzuki, Noriyuki Matsuoka, Yoshinori Wakabayashi, Toshitaka Kuroda
  • Socket for semiconductor device
    Publication number: 20040009682
    Abstract: The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.
    Type: Application
    Filed: July 8, 2003
    Publication date: January 15, 2004
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Takeyuki Suzuki, Noriyuki Matsuoka, Yoshinori Wakabayashi, Toshitaka Kuroda