Patents by Inventor Toshitsugu KONISHI

Toshitsugu KONISHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor device
    Patent number: 11885621
    Abstract: A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: January 30, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Koichiro Nakashima, Takashi Uchida, Yusuke Nakamura, Hideki Ueda, Naruhito Noda, Toshitsugu Konishi, Toshio Yamazaki
  • SENSOR DEVICE
    Publication number: 20220057211
    Abstract: A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.
    Type: Application
    Filed: February 4, 2020
    Publication date: February 24, 2022
    Inventors: Koichiro NAKASHIMA, Takashi UCHIDA, Yusuke NAKAMURA, Hideki UEDA, Naruhito NODA, Toshitsugu KONISHI, Toshio YAMAZAKI