Patents by Inventor Toshiya Asano
Toshiya Asano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8362364Abstract: A wiring board assembly includes a rectangular plate-shaped wiring board having a plurality of resin insulation layers and conduction layers alternately laminated together to define opposite first and second main surfaces and a plurality of connection terminals arranged on the first main surface for surface contact with terminals of a chip and a rectangular frame-shaped reinforcing member fixed to the first main surface of the wiring board with the connection terminals exposed through an opening of the reinforcing member. The reinforcing member has a plurality of structural pieces separated by slits extending from an inner circumferential surface to an outer circumferential surface of the reinforcing member.Type: GrantFiled: February 15, 2010Date of Patent: January 29, 2013Assignee: NGK Spark Plug Co., Ltd.Inventors: Toshiya Asano, Shinnosuke Maeda
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Patent number: 8309861Abstract: A wiring board assembly includes a rectangular plate-shaped wiring board having a plurality of resin insulation layers and conduction layers alternately laminated together to define opposite first and second main surfaces and a plurality of connection terminals arranged on the first main surface for surface contact with terminals of a chip and a rectangular frame-shaped reinforcing member fixed to the first main surface of the wiring board with the connection terminals exposed through an opening of the reinforcing member. The reinforcing member has a plurality of structural pieces separated by slits extending from an inner circumferential surface to an outer circumferential surface of the reinforcing member.Type: GrantFiled: February 15, 2010Date of Patent: November 13, 2012Assignee: NGK Spark Plug Co., Ltd.Inventors: Toshiya Asano, Shinnosuke Maeda
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Publication number: 20120204420Abstract: A method for manufacturing a wiring board, which prevents electrostatic destruction generated in a mask pattern, by employing a structured exposure mask at a low cost is provided. The method can comprise the steps of forming a photosensitive resin layer on an insulating layer located underneath a predetermined conductor layer, forming a plating resist by exposing and developing the photosensitive resin layer with an exposure light while an exposure mask is disposed on a surface of the photosensitive resin layer, forming a metal plating layer that has a conductor pattern formed by applying a metal plating to an opening of the plating resist, and removing the plating resist. The exposure mask may have a plurality of graphic patterns, and each corner of the graphic patterns maybe chamfered by 50 micrometers or more so that electrostatic destruction due to electric discharge between the adjacent graphic patterns is prevented.Type: ApplicationFiled: February 13, 2012Publication date: August 16, 2012Applicant: NGK SPARK PLUG CO., LTD.Inventors: Toshiya ASANO, Nobuhiro ISHIKAWA, Tomonori SATOU, Makoto WATANABE, Kenichi YAMADA
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Patent number: 8233289Abstract: A multilayer wiring substrate of the present invention has a laminated structure composed of conductor layers and resin insulating layers stacked alternately. A plurality of surface connection terminals to which terminals of a chip component are to be surface-connected are formed on a main face of the laminated structure. A plurality of via conductors connected to the plurality of surface connection terminals are formed in the resin insulating layers. Each of the plurality of surface connection terminals has a structure in which a copper layer, a nickel layer, and a gold layer are stacked in this sequence. The gold layer is larger in diameter than at least the copper layer. The gold layer has an overhanging portion which extends radially outward from a circumference of the copper layer.Type: GrantFiled: February 16, 2010Date of Patent: July 31, 2012Assignee: NGK Spark Plug Co., Ltd.Inventors: Shinnosuke Maeda, Toshiya Asano, Takuya Hando
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Patent number: 8153909Abstract: A coreless wiring board has no core board but a laminated structure in which a conductor layer and resin insulating layers are alternately laminated into a multilayer. Each of the resin insulating layers is formed to contain a glass cloth in an epoxy resin. A plurality of via holes is formed to penetrate each of the resin insulating layers, and a filled via conductor for electrically connecting the conductor layers is formed in the via holes respectively. A tip of the glass cloth contained in each of the resin insulating layers is protruded from an internal wall surface of the via hole and cuts into a sidewall of the filled via conductor.Type: GrantFiled: March 13, 2009Date of Patent: April 10, 2012Assignee: NGK Spark Plug Co., Ltd.Inventors: Hiroshi Katagiri, Toshiya Asano
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Patent number: 8110754Abstract: A multi-layer wiring board without a core substrate includes: a multi-layer laminated structure; first terminals provided on a front surface of the multi-layer laminated structure; second terminals provided on a rear surface of the multi-layer laminated structure; terminal pins bonded to a corresponding one of the second terminals, wherein each of the terminal pins is formed in a nailhead shape that includes a shaft portion and a head portion, and a diameter of the head portion is larger than that of the shaft portion; and a reinforcing plate which has pin insertion openings formed at positions corresponding to the terminal pins and which is fixed to the rear surface, wherein the diameter of the pin insertion openings is smaller than the diameter of the head portion and is larger than the diameter of the shaft portion.Type: GrantFiled: March 27, 2009Date of Patent: February 7, 2012Assignee: NGK Spark Plug Co., Ltd.Inventor: Toshiya Asano
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Patent number: 8093503Abstract: A coreless wiring board has no core board but a laminated structure in which a conductor layer and resin insulating layers are alternately laminated into a multilayer. Each of the resin insulating layers is formed to contain a glass cloth in an epoxy resin. A plurality of via holes taking a shape of an inverse truncated cone and having steps on internal wall surfaces is formed to penetrate each of the resin insulating layers, and a filled via conductor for electrically connecting the conductors is formed in each of the via holes.Type: GrantFiled: March 13, 2009Date of Patent: January 10, 2012Assignee: NGK Spark Plug Co., Ltd.Inventors: Hiroshi Katagiri, Toshiya Asano
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Patent number: 8035035Abstract: A multi-layer wiring board without a core substrate includes: a multi-layer laminated structure; first terminals provided on a front surface of the multi-layer laminated structure; second terminals provided on a rear surface of the multi-layer laminated structure; a solder resist which covers the rear surface and which has solder resist openings formed at positions corresponding to the second terminals; a reinforcing plate which is made of a non-metal material and which has reinforcing plate openings formed at positions corresponding to the second terminals; and an adhesive layer interposed between the solder resist and the reinforcing plate to fix the reinforcing plate to the solder resist and which includes adhesive layer openings formed at positions corresponding to the second terminals. A diameter of the solder resist openings and a diameter of the reinforcing plate openings are smaller than that of the adhesive layer openings.Type: GrantFiled: March 27, 2009Date of Patent: October 11, 2011Assignee: NGK Spark Plug Co., Ltd.Inventor: Toshiya Asano
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Patent number: 7977580Abstract: An intermediate multilayer wiring board product includes: a stack of a plurality of resin insulating layers, a first conductor layer, and a second conductor layer. The stack includes: a product forming region comprising a plurality of product portions arranged along a major surface of the stack, each of the plurality of product portions to become a product of the multilayer wiring board; and a frame portion surrounding the product forming region. The first conductor layer is formed on at least one of the plurality of resin insulating layers within each of the plurality of product portions. The second conductor layer is formed on at least one of the plurality of resin insulating layers within the frame portion. The frame portion has a plurality of cuts penetrating the frame portion in a thickness direction thereof, the plurality of cuts being arranged at substantially equal intervals.Type: GrantFiled: May 28, 2009Date of Patent: July 12, 2011Assignee: NGK Spark Plug Co., Ltd.Inventors: Seigo Ueno, Toshiya Asano
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Publication number: 20100208437Abstract: A multilayer wiring substrate of the present invention has a laminated structure composed of conductor layers and resin insulating layers stacked alternately. A plurality of surface connection terminals to which terminals of a chip component are to be surface-connected are formed on a main face of the laminated structure. A plurality of via conductors connected to the plurality of surface connection terminals are formed in the resin insulating layers. Each of the plurality of surface connection terminals has a structure in which a copper layer, a nickel layer, and a gold layer are stacked in this sequence. The gold layer is larger in diameter than at least the copper layer. The gold layer has an overhanging portion which extends radially outward from a circumference of the copper layer.Type: ApplicationFiled: February 16, 2010Publication date: August 19, 2010Inventors: Shinnosuke MAEDA, Toshiya ASANO, Takuya HANDO
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Publication number: 20100208442Abstract: A wiring board assembly includes a rectangular plate-shaped wiring board having a plurality of resin insulation layers and conduction layers alternately laminated together to define opposite first and second main surfaces and a plurality of connection terminals arranged on the first main surface for surface contact with terminals of a chip and a rectangular frame-shaped reinforcing member fixed to the first main surface of the wiring board with the connection terminals exposed through an opening of the reinforcing member. The reinforcing member has a plurality of structural pieces separated by slits extending from an inner circumferential surface to an outer circumferential surface of the reinforcing member.Type: ApplicationFiled: February 15, 2010Publication date: August 19, 2010Inventors: Toshiya ASANO, Shinnosuke MAEDA
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Publication number: 20090294156Abstract: An intermediate multilayer wiring board product includes: a stack of a plurality of resin insulating layers, a first conductor layer, and a second conductor layer. The stack includes: a product forming region comprising a plurality of product portions arranged along a major surface of the stack, each of the plurality of product portions to become a product of the multilayer wiring board; and a frame portion surrounding the product forming region. The first conductor layer is formed on at least one of the plurality of resin insulating layers within each of the plurality of product portions. The second conductor layer is formed on at least one of the plurality of resin insulating layers within the frame portion. The frame portion has a plurality of cuts penetrating the frame portion in a thickness direction thereof, the plurality of cuts being arranged at substantially equal intervals.Type: ApplicationFiled: May 28, 2009Publication date: December 3, 2009Inventors: Seigo UENO, Toshiya Asano
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Publication number: 20090242262Abstract: A multi-layer wiring board without a core substrate includes: a multi-layer laminated structure; first terminals provided on a front surface of the multi-layer laminated structure; second terminals provided on a rear surface of the multi-layer laminated structure; terminal pins bonded to a corresponding one of the second terminals, wherein each of the terminal pins is formed in a nailhead shape that includes a shaft portion and a head portion, and a diameter of the head portion is larger than that of the shaft portion; and a reinforcing plate which has pin insertion openings formed at positions corresponding to the terminal pins and which is fixed to the rear surface, wherein the diameter of the pin insertion openings is smaller than the diameter of the head portion and is larger than the diameter of the shaft portion.Type: ApplicationFiled: March 27, 2009Publication date: October 1, 2009Inventor: Toshiya Asano
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Publication number: 20090242245Abstract: A multi-layer wiring board without a core substrate includes: a multi-layer laminated structure; first terminals provided on a front surface of the multi-layer laminated structure; second terminals provided on a rear surface of the multi-layer laminated structure; a solder resist which covers the rear surface and which has solder resist openings formed at positions corresponding to the second terminals; a reinforcing plate which is made of a non-metal material and which has reinforcing plate openings formed at positions corresponding to the second terminals; and an adhesive layer interposed between the solder resist and the reinforcing plate to fix the reinforcing plate to the solder resist and which includes adhesive layer openings formed at positions corresponding to the second terminals. A diameter of the solder resist openings and a diameter of the reinforcing plate openings are smaller than that of the adhesive layer openings.Type: ApplicationFiled: March 27, 2009Publication date: October 1, 2009Inventor: Toshiya Asano
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Publication number: 20090236138Abstract: A coreless wiring board has no core board but a laminated structure in which a conductor layer and resin insulating layers are alternately laminated into a multilayer. Each of the resin insulating layers is formed to contain a glass cloth in an epoxy resin. A plurality of via holes is formed to penetrate each of the resin insulating layers, and a filled via conductor for electrically connecting the conductor layers is formed in the via holes respectively. A tip of the glass cloth contained in each of the resin insulating layers is protruded from an internal wall surface of the via hole and cuts into a sidewall of the filled via conductor.Type: ApplicationFiled: March 13, 2009Publication date: September 24, 2009Inventors: Hiroshi KATAGIRI, Toshiya Asano
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Publication number: 20090229874Abstract: A coreless wiring board has no core board but a laminated structure in which a conductor layer and resin insulating layers are alternately laminated into a multilayer. Each of the resin insulating layers is formed to contain a glass cloth in an epoxy resin. A plurality of via holes taking a shape of an inverse truncated cone and having steps on internal wall surfaces is formed to penetrate each of the resin insulating layers, and a filled via conductor for electrically connecting the conductors is formed in each of the via holes.Type: ApplicationFiled: March 13, 2009Publication date: September 17, 2009Inventors: Hiroshi KATAGIRI, Toshiya ASANO
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Patent number: 7348695Abstract: A linear motor includes a coil and a plurality of magnets disposed along a central axis of the coil. The magnetization directions of the plurality of magnets have different tilts with respect to the central axis.Type: GrantFiled: December 1, 2005Date of Patent: March 25, 2008Assignee: Canon Kabushiki KaishaInventors: Nobushige Korenaga, Toshiya Asano
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Patent number: 7330093Abstract: An alignment apparatus moves an X-Y slider together with X and Y beams. Electromagnetic guides (electromagnetic mechanisms) are interposed between the X-Y slider, the X beam, and the Y beam. The electromagnetic guides include alignment and acceleration electromagnets attached to the X-Y slider, and targets attached to the X and Y beams. The alignment electromagnet is feedback controlled, whereas the acceleration electromagnet is feedforward controlled.Type: GrantFiled: October 11, 2005Date of Patent: February 12, 2008Assignee: Canon Kabushiki KaishaInventors: Toshiya Asano, Yugo Shibata
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Patent number: 7193493Abstract: An alignment apparatus moves an X-Y slider together with X and Y beams. Electromagnetic guides (electromagnetic mechanisms) are interposed between the X-Y slider, the X beam, and the Y beam. The electromagnetic guides include alignment and acceleration electromagnets attached to the X-Y slider, and targets attached to the X and Y beams. The alignment electromagnet is feedback-controlled, whereas the acceleration electromagnet is feedforward-controlled.Type: GrantFiled: September 26, 2003Date of Patent: March 20, 2007Assignee: Canon Kabushiki KaishaInventors: Toshiya Asano, Yugo Shibata
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Patent number: 7067942Abstract: A linear motor including a coil, a plurality of first magnet groups having polar directions disposed in periodically different directions, and a plurality of second magnet groups having polar directions disposed in periodically different directions. In a set including a predetermined magnet of the first magnet groups and a magnet of the second magnet groups, corresponding to the predetermined magnet, magnetization directions of the set of magnets have mutually different tilts with respect to the central axis of the coil. The coil includes a first coil effective to produce a Lorentz's force between the first coil and the first magnet groups, and a second coil effective to produce a Lorentz's force between the second coil and the second magnet groups.Type: GrantFiled: February 13, 2004Date of Patent: June 27, 2006Assignee: Canon Kabushiki KaishaInventors: Nobushige Korenaga, Toshiya Asano