Patents by Inventor Toshiya Ikeda
Toshiya Ikeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9968994Abstract: A casting nozzle suited to manufacture a casting material of pure magnesium or magnesium alloy is provided. A nozzle is utilized to manufacture a casting material by supplying molten metal to a portion between rolls which become a casting die, and arranged so that a pouring port is located between a pair of rolls opposed to other. This nozzle includes a main body formed of oxide material such as alumina, and a coating layer which is provided on the inner surface of the main body which comes into contact the molten metal, and formed of material that does not include oxygen substantially. Since the main body does not come into direct contact with the molten metal due to the coating layer, it is possible to prevent oxygen included in the main body from reacting with the molten metal.Type: GrantFiled: September 16, 2014Date of Patent: May 15, 2018Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Masatada Numano, Yoshihiro Nakai, Toshiya Ikeda, Mitsuyuki Kobayashi
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Patent number: 9943904Abstract: A magnesium alloy material such as a magnesium alloy cast material or a magnesium alloy rolled material, excellent in mechanical characteristics and surface precision, a producing method capable of stably producing such material, a magnesium alloy formed article utilizing the rolled material, and a producing method therefor. The magnesium material includes a melting step of melting a magnesium alloy in a melting furnace to obtain a molten metal, a transfer step of transferring the molten metal from the melting furnace to a molten metal reservoir, and a casting step of supplying a movable mold with the molten metal from the molten metal reservoir, through a pouring gate, and solidifying the molten metal to continuously produce a cast material. Parts are formed by a low-oxygen material having an oxygen content of 20 mass % or less. The cast material is given a thickness of from 0.1 to 10 mm.Type: GrantFiled: October 21, 2010Date of Patent: April 17, 2018Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Masatada Numano, Yoshihiro Nakai, Toshiya Ikeda, Taichiro Nishikawa
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Patent number: 9556501Abstract: A magnesium-based composite member is provided with a through hole through which a fastening member for attachment to a fixing target is to be inserted. A substrate is provided with a substrate hole through which the fastening member is to be inserted, and made of a composite material which is a composite of SiC and a matrix metal which is any of magnesium and a magnesium alloy. A receiving portion is attached to the substrate and made of a metal material different from the matrix metal. The receiving portion is provided with a receiving portion hole through which the fastening member is to be inserted, and at least a part of an inner circumferential surface of the through hole is formed from an inner circumferential surface of the receiving portion hole.Type: GrantFiled: March 16, 2011Date of Patent: January 31, 2017Assignees: Sumitomo Electric Industries, Ltd., A.L.M.T. CorpInventors: Isao Iwayama, Taichiro Nishikawa, Yoshiyuki Takaki, Toshiya Ikeda, Shigeki Koyama
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Patent number: 9347120Abstract: A composite member has a substrate made of a composite material having SiC combined with magnesium or a magnesium alloy, and has a warpage degree of not less than 0.01×10?3 and not more than 10×10?3, the warpage degree being defined as lmax/Dmax, where lmax being a difference between a maximum value and a minimum value of surface displacement of one surface of composite member measured along a longest side thereof, and Dmax being a length of the longest side. Thereby, a composite member capable of efficiently dissipating heat to an installation object, a heat-dissipating member using the composite member, and a semiconductor device having the heat-dissipating member are provided.Type: GrantFiled: February 20, 2012Date of Patent: May 24, 2016Assignees: SUMITOMO ELECTRIC INDUSTREIS, LTD., A.L.M.T. Corp.Inventors: Isao Iwayama, Taichiro Nishikawa, Toshiya Ikeda, Shigeki Koyama
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Publication number: 20150225635Abstract: A composite member suitable for a heat radiation member of a semiconductor element and a method of manufacturing the same are provided. This composite member is a composite of magnesium or a magnesium alloy and SiC, and it has porosity lower than 3%. This composite member can be manufactured by forming an oxide film on a surface of raw material SiC, arranging coated SiC having the oxide film formed in a cast, and infiltrating this coated SiC aggregate with a molten metal (magnesium or the magnesium alloy). The porosity of the composite member can be lowered by improving wettability between SiC and the molten metal by forming the oxide film. According to this manufacturing method, a composite member having excellent thermal characteristics such as a coefficient of thermal expansion not lower than 4 ppm/K and not higher than 10 ppm/K and thermal conductivity not lower than 180 W/m·K can be manufactured.Type: ApplicationFiled: April 10, 2015Publication date: August 13, 2015Inventors: Isao IWAYAMA, Yoshihiro NAKAI, Taichiro NISHIKAWA, Yoshiyuki TAKAKI, Misato KUSAKARI, Toshiya IKEDA
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Patent number: 9028959Abstract: A composite member suitable for a heat radiation member of a semiconductor element and a method of manufacturing the same are provided. This composite member is a composite of magnesium or a magnesium alloy and SiC, and it has porosity lower than 3%. This composite member can be manufactured by forming an oxide film on a surface of raw material SiC, arranging coated SiC having the oxide film formed in a cast, and infiltrating this coated SiC aggregate with a molten metal (magnesium or the magnesium alloy). The porosity of the composite member can be lowered by improving wettability between SiC and the molten metal by forming the oxide film. According to this manufacturing method, a composite member having excellent thermal characteristics such as a coefficient of thermal expansion not lower than 4 ppm/K and not higher than 10 ppm/K and thermal conductivity not lower than 180 W/m·K can be manufactured.Type: GrantFiled: October 2, 2009Date of Patent: May 12, 2015Assignees: Sumitomo Electric Industries, Ltd., A. L. M. T. Corp.Inventors: Isao Iwayama, Yoshihiro Nakai, Taichiro Nishikawa, Yoshiyuki Takaki, Misato Kusakari, Toshiya Ikeda
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Publication number: 20150001262Abstract: A casting nozzle suited to manufacture a casting material of pure magnesium or magnesium alloy is provided. A nozzle is utilized to manufacture a casting material by supplying molten metal to a portion between rolls which become a casting die, and arranged so that a pouring port is located between a pair of rolls opposed to other. This nozzle includes a main body formed of oxide material such as alumina, and a coating layer which is provided on the inner surface of the main body which comes into contact the molten metal, and formed of material that does not include oxygen substantially. Since the main body does not come into direct contact with the molten metal due to the coating layer, it is possible to prevent oxygen included in the main body from reacting with the molten metal.Type: ApplicationFiled: September 16, 2014Publication date: January 1, 2015Inventors: Masatada NUMANO, Yoshihiro NAKAI, Toshiya IKEDA, Mitsuyuki KOBAYASHI
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Patent number: 8863999Abstract: A casting nozzle suited to manufacture a casting material of pure magnesium or magnesium alloy is provided. A nozzle 1 is utilized to manufacture a casting material 100 by supplying molten metal to a portion between rolls 10 which become a casting die, and arranged so that a pouring port 4 is located between a pair of rolls 10 opposed to other. This nozzle 1 includes a main body 1a formed of oxide material such as alumina, and a coating layer 3 which is provided on the inner surface of the main body 1a which comes into contact the molten metal, and formed of material that does not include oxygen substantially. Since the main body 1a does not come into direct contact with the molten metal due to the coating layer 3, it is possible to prevent oxygen included in the main body 1a from reacting with the molten metal.Type: GrantFiled: February 20, 2006Date of Patent: October 21, 2014Assignee: Sumitomo Electric Industries, Ltd.Inventors: Masatada Numano, Yoshihiro Nakai, Toshiya Ikeda, Mitsuyuki Kobayashi
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Publication number: 20130328184Abstract: A composite member has a substrate made of a composite material having SiC combined with magnesium or a magnesium alloy, and has a warpage degree of not less than 0.01×10?3 and not more than 10×10?3, the warpage degree being defined as lmax/Dmax, where lmax being a difference between a maximum value and a minimum value of surface displacement of one surface of composite member measured along a longest side thereof, and Dmax being a length of the longest side. Thereby, a composite member capable of efficiently dissipating heat to an installation object, a heat-dissipating member using the composite member, and a semiconductor device having the heat-dissipating member are provided.Type: ApplicationFiled: February 20, 2012Publication date: December 12, 2013Applicants: A.L.M.T. CORP., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Isao Iwayama, Taichiro Nishikawa, Toshiya Ikeda, Shigeki Koyama
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Publication number: 20130009301Abstract: A magnesium-based composite member is provided with a through hole through which a fastening member for attachment to a fixing target is to be inserted. A substrate is provided with a substrate hole through which the fastening member is to be inserted, and made of a composite material which is a composite of SiC and a matrix metal which is any of magnesium and a magnesium alloy. A receiving portion is attached to the substrate and made of a metal material different from the matrix metal. The receiving portion is provided with a receiving portion hole through which the fastening member is to be inserted, and at least a part of an inner circumferential surface of the through hole is formed from an inner circumferential surface of the receiving portion hole.Type: ApplicationFiled: March 16, 2011Publication date: January 10, 2013Applicants: A.L.M.T. Corp, Sumitomo Electric Industries, Ltd.Inventors: Isao Iwayama, Taichiro Nishikawa, Yoshiyuki Takaki, Toshiya Ikeda, Shigeki Koyama
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Patent number: 8092914Abstract: A heat sink substrate has a composite structure including a three-dimensional network structure of SiC ceramic having pores infiltrated with Si, and has a thermal conductivity of not less than 150 W/m·K and an oxygen content of not greater than 7 ppm. The heat sink substrate is easily allowed to have an increased surface area. Further, the heat sink substrate has a higher thermal conductivity and a coefficient thermal expansion close to that of the SiC. Therefore, the heat sink substrate is superior in the efficiency of heat conduction from a semiconductor device. The heat sink substrate is produced by infiltrating a thermally melted Si into the pores of the three-dimensional network structure in a non-oxidative atmosphere in the presence of an oxygen absorber.Type: GrantFiled: April 25, 2007Date of Patent: January 10, 2012Assignee: A.L.M.T. Corp.Inventors: Masahiro Omachi, Akira Fukui, Toshiya Ikeda
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Publication number: 20110256419Abstract: A composite member suitable for a heat radiation member of a semiconductor element and a method of manufacturing the same are provided. This composite member is a composite of magnesium or a magnesium alloy and SiC, and it has porosity lower than 3%. This composite member can be manufactured by forming an oxide film on a surface of raw material SiC, arranging coated SiC having the oxide film formed in a cast, and infiltrating this coated SiC aggregate with a molten metal (magnesium or the magnesium alloy). The porosity of the composite member can be lowered by improving wettability between SiC and the molten metal by forming the oxide film. According to this manufacturing method, a composite member having excellent thermal characteristics such as a coefficient of thermal expansion not lower than 4 ppm/K and not higher than 10 ppm/K and thermal conductivity not lower than 180 W/m·K can be manufactured.Type: ApplicationFiled: October 2, 2009Publication date: October 20, 2011Inventors: Isao Iwayama, Yoshihiro Nakai, Taichiro Nishikawa, Yoshiyuki Takaki, Misato Kusakari, Toshiya Ikeda
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Publication number: 20110033332Abstract: A magnesium alloy material such as a magnesium alloy cast material or a magnesium alloy rolled material, excellent in mechanical characteristics and surface precision, a producing method capable of stably producing such material, a magnesium alloy formed article utilizing the rolled material, and a producing method therefor. The magnesium material includes a melting step of melting a magnesium alloy in a melting furnace to obtain a molten metal, a transfer step of transferring the molten metal from the melting furnace to a molten metal reservoir, and a casting step of supplying a movable mold with the molten metal from the molten metal reservoir, through a pouring gate, and solidifying the molten metal to continuously produce a cast material. Parts are formed by a low-oxygen material having an oxygen content of 20 mass % or less. The cast material is given a thickness of from 0.1 to 10 mm.Type: ApplicationFiled: October 21, 2010Publication date: February 10, 2011Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Masatada NUMANO, Yoshihiro NAKAI, Toshiya IKEDA, Taichiro NISHIKAWA
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Patent number: 7841380Abstract: A magnesium alloy material such as a magnesium alloy cast material or a magnesium alloy rolled material, excellent in mechanical characteristics and surface precision, a producing method capable of stably producing such material, a magnesium alloy formed article utilizing the rolled material, and a producing method therefor. The magnesium material producing method includes a melting step of melting a magnesium alloy in a melting furnace to obtain a molten metal, a transfer step of transferring the molten metal from the melting furnace to a molten metal reservoir, and a casting step of supplying a movable mold with the molten metal from the molten metal reservoir, through a pouring gate, and solidifying the molten metal to continuously produce a cast material. Parts are formed by a low-oxygen material having an oxygen content of 20 mass % or less. The cast material is given a thickness of from 0.1 to 10 mm.Type: GrantFiled: June 28, 2005Date of Patent: November 30, 2010Assignee: Sumitomo Electric Industries, Ltd.Inventors: Masatada Numano, Yoshihiro Nakai, Toshiya Ikeda, Taichiro Nishikawa
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Patent number: 7814961Abstract: A casting nozzle for supplying a molten alloy liquid of aluminum alloy or magnesium alloy to a movable mold for continuous casting from a tundish, in which the molten alloy liquid is stored. The casting nozzle is fixed to the tundish. The casting nozzle tip arranged on the movable mold side is made of a highly heat-conductive material having a heat conductivity of 0.2 W/mK or more, and a highly elastic material having an elastic modulus of 5000 MPa or more, etc. By making the tip of the casting nozzle with a material having superior thermal conductivity, the irregularity in solidification of the molten alloy liquid is decreased and thereby the surface quality of a cast alloy is improved. The nozzle tip is formed with a material having high elasticity and superior elastic deformability, whereby the interstice between the movable mold and the tip of outer peripheral edge of the nozzle is narrowed, and accordingly a cast alloy having superior surface quality can be obtained.Type: GrantFiled: August 26, 2008Date of Patent: October 19, 2010Assignee: Sumitomo Electric Industries, Ltd.Inventors: Masatada Numano, Yoshihiro Nakai, Toshiya Ikeda, Mitsuyuki Kobayashi
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Publication number: 20100206537Abstract: Provided are a heat spreader for a semiconductor device, which can be joined such that a multitude of pin-shaped fins are not easily fractured even when the heat spreader for a semiconductor device is incorporated in a heat dissipation structure for a semiconductor device, in which direct cooling is performed by using water, and a method for manufacturing the heat spreader for a semiconductor device. The heat spreader (1) for a semiconductor device comprises: a plurality of columnar members (13) joined onto at least one of surfaces of a plate-like member (11, 12) by stud welding; and a joining layer (14) formed between the plate-like member (11, 12) and the columnar members (13). The plate-like member (11, 12) includes a base material (11) and surface layers (12). The surface layers (12) and the columnar members (13) are made of a material containing aluminum or an aluminum alloy. A thickness of the plate-like member (11, 12) is 0.5 mm through 6 mm and a thickness of each of the surface layers (12) is 0.Type: ApplicationFiled: May 20, 2008Publication date: August 19, 2010Inventors: Toshiya Ikeda, Shigeki Koyama, Shinya Nishida
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Patent number: 7721786Abstract: A casting nozzle for supplying a molten alloy liquid of aluminum alloy or magnesium alloy to a movable mold for continuous casting from a tundish, in which the molten alloy liquid is stored. The casting nozzle is fixed to the tundish. The casting nozzle tip arranged on the movable mold side is made of a highly heat-conductive material having a heat conductivity of 0.2 W/mK or more, and a highly elastic material having an elastic modulus of 5000 MPa or more, etc. By making the tip of the casting nozzle with a material having superior thermal conductivity, the irregularity in solidification of the molten alloy liquid is decreased and thereby the surface quality of a cast alloy is improved. The nozzle tip is formed with a material having high elasticity and superior elastic deformability, whereby the interstice between the movable mold and the tip of outer peripheral edge of the nozzle is narrowed, and accordingly a cast alloy having superior surface quality can be obtained.Type: GrantFiled: June 27, 2005Date of Patent: May 25, 2010Assignee: Sumitomo Electric Industries, Ltd.Inventors: Masatada Numano, Yoshihiro Nakai, Toshiya Ikeda, Mitsuyuki Kobayashi
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Patent number: 7618502Abstract: The wear resistant aluminum alloy elongate body contains 7-13 mass % of Si, 0.001-0.3 mass % of iron, 2.0-5.0 mass % of Cu, 0.3-1.0 mass % of Mg, 0.001-0.3 mass % of Mn, 0.001-0.3 mass % of Cr, 0.003-0.03 mass % of Sr, 0.005-0.05 mass % of Ti, and the remaining part of Al and unavoidable impurity. The size of Si grains existing in the elongate body is, by the average value, at most 10 ?m and by the maximum value, at most 30 ?m, and the size of the Si grains in the range of down to 1.5 mm deep from the surface is, by the maximum value, at most 6 ?m. Further, crystal texture of Al alloy is one selected from the group consisting of hot rolled texture, re-crystallized texture and mixed texture of hot rolled texture and re-crystallized texture.Type: GrantFiled: July 3, 2007Date of Patent: November 17, 2009Assignees: Sumitomo Electric Industries, Ltd., Toyoda Automatic Loom Works, Ltd.Inventors: Shinichi Sato, Takayuki Kato, Norikazu Deto, Masashi Nojiri, Toshiya Ikeda, Yoshihiro Nakai, Yoshiki Kishikawa, Kiyotaka Utsunomiya
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Publication number: 20090020567Abstract: A casting nozzle suited to manufacture a casting material of pure magnesium or magnesium alloy is provided. A nozzle 1 is utilized to manufacture a casting material 100 by supplying molten metal to a portion between rolls 10 which become a casting die, and arranged so that a pouring port 4 is located between a pair of rolls 10 opposed to other. This nozzle 1 includes a main body 1a formed of oxide material such as alumina, and a coating layer 3 which is provided on the inner surface of the main body 1a which comes into contact the molten metal, and formed of material that does not include oxygen substantially. Since the main body 1a does not come into direct contact with the molten metal due to the coating layer 3, it is possible to prevent oxygen included in the main body 1a from reacting with the molten metal.Type: ApplicationFiled: February 20, 2006Publication date: January 22, 2009Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Masatada Numano, Yoshihiro Nakai, Toshiya Ikeda, Mitsuyuki Kobayashi
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Publication number: 20090000759Abstract: A casting nozzle for supplying a molten alloy liquid of aluminum alloy or magnesium alloy to a movable mold for continuous casting from a tundish, in which the molten alloy liquid is stored. The casting nozzle is fixed to the tundish. The casting nozzle tip arranged on the movable mold side is made of a highly heat-conductive material having a heat conductivity of 0.2 W/mK or more, and a highly elastic material having an elastic modulus of 5000 MPa or more, etc. By making the tip of the casting nozzle with a material having superior thermal conductivity, the irregularity in solidification of the molten alloy liquid is decreased and thereby the surface quality of a cast alloy is improved. The nozzle tip is formed with a material having high elasticity and superior elastic deformability, whereby the interstice between the movable mold and the tip of outer peripheral edge of the nozzle is narrowed, and accordingly a cast alloy having superior surface quality can be obtained.Type: ApplicationFiled: August 26, 2008Publication date: January 1, 2009Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Masatada NUMANO, Yoshihiro Nakai, Toshiya Ikeda, Mitsuyuki Kobayashi