Abstract: According to this invention, there is disclosed a semiconductor device in which a memory section and a logic section are arranged on the same semiconductor chip, comprising a high-resistance element constituting a memory cell, a low-resistance line connected to the high-resistance element, a power source line serving as a power source path from a power source pad, a switching element arranged between the low-resistance line and the power source line, and a control circuit for controlling the switching element.

Abstract: A semiconductor integrated circuit device of multi-layer interconnection structure includes a pad formed of a multilayer interconnection layer. The power source pad is connected to a power source interconnection layer via a lead-out interconnection layer which is formed of the same multilayer interconnection layer as that used to form the power source pad.

Abstract: A semiconductor device includes a circuit block formed on a semiconductor chip with multilayered wiring layers having two or more layers, and having a specific function assigned thereto, a first current path pattern formed in a first layer of the multilayered wiring layers and running around the circuit block, a second current path pattern formed in a second layer of the multilayered wiring layers and running around the circuit block, part of the second current path pattern lying over the first current path pattern and the other portion of the second current path pattern lying off the first current path pattern so as to define a connection space with a predetermined width between the first current path pattern and the second current path pattern, a first signal path pattern formed in the first layer of the multilayered wiring layers and serving as a signal path to the circuit block, a second signal path pattern formed in the second layer of the multilayered wiring layers and serving as the signal path to the

Abstract: A laminated decorative sheet is prepared by applying a coating layer consisting of a thermo-setting resin composition on a base paper for a decorative laminate which has been prepared by incorporating a composition the whole or a major part of which is composed of a synthetic rubber and/or a thermo-plastic synthetic resin substance into the base paper during the paper making thereof or by impregnating the base paper with the thermo-plastic synthetic resin composition or with the mixture thereof; or alternatively is prepared by laminating another base paper for a decorative laminate which has been impregnated with the thermosetting resin composition on the above mentioned base paper containing the thermo-plastic synthetic resin composition, and the thus prepared layers are laminated under heat and pressure to form a laminated decorative sheet having smooth surface which is subjected to emboss-processing under a heating condition of at least 100.degree.