Abstract: A solid-state battery package that includes: a substrate; a solid-state battery on the substrate; and a water vapor barrier layer between the substrate and the solid-state battery. The water vapor barrier layer preferably has both an Si—O bond and an Si—N bond, and preferably has a water vapor transmission rate of less than 5×10?3 g/(m2·Day).

Abstract: A solid-state battery package that includes: a substrate; and a solid-state battery on the substrate. The solid-state battery has: a battery element having a positive electrode layer, a negative electrode layer, and a solid electrolyte; and an end-face electrode on an end face of the battery element and connected to one of the positive or negative electrode layers. The substrate has a substrate electrode layer on a main surface thereof, and at least a first side surface of the substrate electrode layer and a first end face of the end-face electrode are substantially on an identical line in a sectional view, a distance between the first side surface and a second side surface of the substrate electrode layer is equal to or more than a minimum distance between the first end face and an end surface of the positive or negative electrode layer that the end-face electrode is not connected.

Abstract: Provided is a MEMS module that includes a MEMS element having a first capacitor electrode that can be displaced, a second capacitor electrode that opposes the first capacitor electrode, and driving electrodes that cause the first capacitor electrode to be displaced. The driving electrodes are connected to a control unit that applies a driving voltage to the driving electrodes and monitor terminals for detecting power. Thus, an element for monitoring power is not needed and a MEMS module, a variable reactance circuit and an antenna device are provided that are capable of realizing smaller size and lower loss.

Abstract: A variable capacitance device includes a fixed substrate, a movable portion, driving electrodes, an RF capacitance electrode and an insulating film. The movable portion faces the fixed substrate and can change a gap between the movable portion and the fixed substrate. The driving electrodes are formed on the fixed substrate so as to face the movable portion. The RF capacitance electrode is formed on the fixed substrate so as to face the movable portion and be spaced apart from the driving electrodes. The insulating film is formed between the movable portion and the driving electrodes. The level of a voltage applied to the driving electrodes and the level of a voltage applied to the movable portion are periodically switched and the level of a voltage applied to the RF capacitance electrode and the level of a voltage applied to the movable portion are always the same.

Abstract: A variable capacitance device includes a fixed substrate, a movable portion, driving electrodes, an RF capacitance electrode and an insulating film. The movable portion faces the fixed substrate and can change a gap between the movable portion and the fixed substrate. The driving electrodes are formed on the fixed substrate so as to face the movable portion. The RF capacitance electrode is formed on the fixed substrate so as to face the movable portion and be spaced apart from the driving electrodes. The insulating film is formed between the movable portion and the driving electrodes. The level of a voltage applied to the driving electrodes and the level of a voltage applied to the movable portion are periodically switched and the level of a voltage applied to the RF capacitance electrode and the level of a voltage applied to the movable portion are always the same.

Abstract: Provided is a MEMS module that includes a MEMS element having a first capacitor electrode that can be displaced, a second capacitor electrode that opposes the first capacitor electrode, and driving electrodes that cause the first capacitor electrode to be displaced. The driving electrodes are connected to a control unit that applies a driving voltage to the driving electrodes and monitor terminals for detecting power. Thus, an element for monitoring power is not needed and a MEMS module, a variable reactance circuit and an antenna device are provided that are capable of realizing smaller size and lower loss.

Abstract: A method of manufacturing a plurality of circuit modules includes cutting a mother board including a plurality of electronic components mounted on at least a single surface thereof, and cutting out a plurality of circuit boards from the mother board. A plurality of terminal electrode boards, each of which is arranged so as to straddle at least the circuit boards that are adjacent to each other, are mounted onto one surface of the mother board. The mother board including the terminal electrode boards mounted on the one surface, and the electronic components, mounted on the at least single surface, is diced at positions where the circuit boards are to be cut out.