Patents by Inventor Toshiya Kinoshita
Toshiya Kinoshita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10596678Abstract: A sheet glass tool in which many abrasive grains are anchored in an anchoring layer formed on the tool tip, wherein a coolant flow channel is formed between a first abrasive grain and a second abrasive grain that are adjacent to each other.Type: GrantFiled: August 18, 2015Date of Patent: March 24, 2020Assignee: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.Inventor: Toshiya Kinoshita
-
Publication number: 20170341199Abstract: A sheet glass tool in which many abrasive grains are anchored in an anchoring layer formed on the tool tip, wherein a coolant flow channel is formed between a first abrasive grain and a second abrasive grain that are adjacent to each other.Type: ApplicationFiled: August 18, 2015Publication date: November 30, 2017Applicant: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.Inventor: Toshiya KINOSHITA
-
Patent number: 9102038Abstract: Provided is a beveling grindstone in which diamond abrasive grains etc. are prevented from falling off even after long-term grinding to allow long-term use of the grindstone and in which chipping that occurs during beveling of a hard and brittle material and the occurrence of cracking in the ground material are suppressed. The beveling grindstone is used to bevel the outer circumferential edge of a hard and brittle material and includes: a core having a groove portion formed on the outer circumferential surface thereof with which the outer circumferential edge of the hard and brittle material is brought into contact; and an abrasive grain layer which is formed in the groove portion and to which abrasive grains are secured by brazing. The abrasive grains have an average grain diameter of #4000 to #270.Type: GrantFiled: August 24, 2011Date of Patent: August 11, 2015Assignee: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.Inventor: Toshiya Kinoshita
-
Publication number: 20140080394Abstract: Provided is a beveling grindstone in which diamond abrasive grains etc. are prevented from falling off even after long-term grinding to allow long-term use of the grindstone and in which chipping that occurs during beveling of a hard and brittle material and the occurrence of cracking in the ground material are suppressed. The beveling grindstone is used to bevel the outer circumferential edge of a hard and brittle material and includes: a core having a groove portion formed on the outer circumferential surface thereof with which the outer circumferential edge of the hard and brittle material is brought into contact; and an abrasive grain layer which is formed in the groove portion and to which abrasive grains are secured by brazing. The abrasive grains have an average grain diameter of #4000 to #270.Type: ApplicationFiled: August 24, 2011Publication date: March 20, 2014Applicant: Nippon Steel & Sumikin Materials Co., Ltd.Inventor: Toshiya Kinoshita
-
Patent number: 8096858Abstract: The invention provides a polishing pad conditioner that enables stabilization of brazing metal melting point, minimization of abrasive grain detachment by uniformizing and stabilizing abrasive grain brazing condition, and enhancement of flatness by minimizing thermal deformation of the metal support. The polishing pad conditioner is fabricated by brazing multiple abrasive grains to the surface of a metal support with brazing metal, wherein the composition of the brazing metal expressed in mass % is such that 70%?Ni+Fe?90% (provided that 0?Fe/(Ni+Fe)?0.4), 1%?Cr?25%, 2%?Si+B?15% (provided that 0?B/(Si+B)?0.8), and 0.1%?P?8%.Type: GrantFiled: August 17, 2006Date of Patent: January 17, 2012Assignee: Nippon Steel Materials Co., Ltd.Inventors: Hiroaki Sakamoto, Toshiya Kinoshita
-
Publication number: 20100291844Abstract: The invention provides a dresser for an abrasive cloth, which has a smaller abrasive grain diameter than the conventional dresser and has an abrasive grain spacing regulated in a predetermined range depending upon the abrasive grain diameter to simultaneously meet a high level of pad grinding power and a pad flatness and, at the same time, is less likely to cause dropout of abrasive grains. The dresser comprises a plurality of abrasive grains fixed as a single layer on a surface of a metallic support material. The dresser is characterized in that the metallic support material on its surface on which the abrasive grains are fixed has a convex shape, the difference in height between the end part and the central port on the surface is not less than 3 ?m and not more than 40 ?m, and the center-to-center spacing between at least one set of adjacent grains is d?L<2d wherein d represents the diameter of the abrasive grains; L represents the center-to-center spacing between adjacent abrasive grains.Type: ApplicationFiled: October 28, 2008Publication date: November 18, 2010Applicant: NIPPON STEEL MATERIALS CO., LTD.Inventors: Hiroaki Sakamoto, Toshiya Kinoshita
-
Publication number: 20090275274Abstract: The invention provides a polishing pad conditioner that enables stabilization of brazing metal melting point, minimization of abrasive grain detachment by uniformizing and stabilizing abrasive grain brazing condition, and enhancement of flatness by minimizing thermal deformation of the metal support. The polishing pad conditioner is fabricated by brazing multiple abrasive grains to the surface of a metal support with brazing metal, wherein the composition of the brazing metal expressed in mass % is such that 70%?Ni+Fe?90% (provided that 0?Fe/(Ni+Fe)?0.4), 1%?Cr?25%, 2%?Si+B?15% (provided that 0?B/(Si+B)?0.8), and 0.1%?P?8%.Type: ApplicationFiled: August 17, 2006Publication date: November 5, 2009Inventors: Hiroaki Sakamoto, Toshiya Kinoshita
-
Patent number: 7465217Abstract: Disclosed are CMP conditioners which can suppress microscratching of the surface of a semiconductor substrate and can realize stable CMP conditioner properties. The CMP conditioner according to the first aspect of the present invention comprises a support member and a plurality of hard abrasive grains provided on a surface of the support member, wherein the plurality of hard abrasive grains are regularly arranged on the surface of the support member. The CMP conditioner according to the second aspect of the present invention comprises a support member and a plurality of hard abrasive grains provided on the surface of the support member, wherein the plurality of hard abrasive grains are arranged on the surface of the support member regularly and so as for the density of the hard abrasive grains to decrease from the inner side of the support member toward the outer side of the support member.Type: GrantFiled: March 20, 2006Date of Patent: December 16, 2008Assignee: Nippon Steel CorporationInventors: Toshiya Kinoshita, Eiji Hashino, Setsuo Sato, Ryuichi Araki
-
Publication number: 20060160477Abstract: Disclosed are CMP conditioners which can suppress microscratching of the surface of a semiconductor substrate and can realize stable CMP conditioner properties. The CMP conditioner according to the first aspect of the present invention comprises a support member and a plurality of hard abrasive grains provided on a surface of the support member, wherein the plurality of hard abrasive grains are regularly arranged on the surface of the support member. The CMP conditioner according to the second aspect of the present invention comprises a support member and a plurality of hard abrasive grains provided on the surface of the support member, wherein the plurality of hard abrasive grains are arranged on the surface of the support member regularly and so as for the density of the hard abrasive grains to decrease from the inner side of the support member toward the outer side of the support member.Type: ApplicationFiled: March 20, 2006Publication date: July 20, 2006Applicant: Nippon Steel CorporationInventors: Toshiya Kinoshita, Eiji Hashino, Setsuo Sato, Ryuichi Araki
-
Patent number: 6752708Abstract: A pad conditioner for semiconductor substrates for performing conditioning by slide contact with the abrasive surface of the polishing pad comprises a support member having a surface opposed to the polishing pad, a joining alloy layer covering the above surface of the support member, and a group of hard abrasive grains which are spread out and embedded in the joining alloy layer and supported by the joining alloy layer. At the contact interface between each of the hard abrasive grains and the above joining alloy, the surfaces of the hard abrasive grains are covered with either a layer of metallic carbides or a layer of metallic nitrides. Ag-base and Ag—Cu-base alloys, etc., can be used as the joining alloys.Type: GrantFiled: November 16, 2000Date of Patent: June 22, 2004Assignee: Nippon Steel CorporationInventors: Toshiya Kinoshita, Motonori Tamura
-
Publication number: 20040072510Abstract: Disclosed are CMP conditioners which can suppress microscratching of the surface of a semiconductor substrate and can realize stable CMP conditioner properties. The CMP conditioner according to the first aspect of the present invention comprises a support member and a plurality of hard abrasive grains provided on a surface of the support member, wherein the plurality of hard abrasive grains are regularly arranged on the surface of the support member. The CMP conditioner according to the second aspect of the present invention comprises a support member and a plurality of hard abrasive grains provided on the surface of the support member, wherein the plurality of hard abrasive grains are arranged on the surface of the support member regularly and so as for the density of the hard abrasive grains to decrease from the inner side of the support member toward the outer side of the support member.Type: ApplicationFiled: June 19, 2003Publication date: April 15, 2004Inventors: Toshiya Kinoshita, Eiji Hashino, Setsuo Sato, Ryuichi Araki
-
Publication number: 20020040347Abstract: A system for preventing unauthorized use of digital contents information which disables the use of a storage medium having digital contents recorded thereon by those other than an authorized user. An information terminal 10 reads out digital contents information desired by a user from a contents storing server 6 for storing digital contents information, encodes the read out digital contents information based on ID information of a player 15, and writes it on a predetermined storage medium. The player 15 reads out the data from the storage medium and performs a decode process on the data based on its own ID information to restore the digital contents information.Type: ApplicationFiled: October 2, 2001Publication date: April 4, 2002Inventors: Satoshi Murakami, Kiyoshi Kaneko, Mitsumasa Wada, Toshihiko Nakajima, Toshiya Utoh, Toshiya Kinoshita, Kiminobu Hamaguchi
-
Patent number: 6309433Abstract: There is provided a conditioner which eliminates loading of a polishing pad, stabilizes polishing speeds and has a long usable life in metal CMP employing acidic slurry, which allows production of semiconductors at high quality and high yield, and which is characterized in that diamond grains are supported by monolayer brazing in a supporting material comprising a metal and/or alloy, using an alloy with a melting point of 600-1200° C. which contains 0.5-20 wt % of at least one metal selected from among titanium, zirconium and chromium and 30-99.5 wt % of at least one metal selected from among gold, platinum and silver.Type: GrantFiled: July 29, 1999Date of Patent: October 30, 2001Assignee: Nippon Steel CorporationInventor: Toshiya Kinoshita
-
Patent number: 6190240Abstract: A pad conditioner for semiconductor substrates for performing conditioning by slide contact with the abrasive surface of the polishing pad comprises a support member having a surface opposed to the polishing pad, a joining alloy layer covering the above surface of the support member, and a group of hard abrasive grains which are spread out and embedded in the joining alloy layer and supported by the joining alloy layer. At the contact interface between each of the hard abrasive grains and the above joining alloy, the surfaces of the hard abrasive grains are covered with either a layer of metallic carbides or a layer of metallic nitrides. Ag-base and Ag—Cu-base alloys, etc., can be used as the joining alloys.Type: GrantFiled: April 14, 1999Date of Patent: February 20, 2001Assignee: Nippon Steel CorporationInventors: Toshiya Kinoshita, Motonori Tamura
-
Patent number: 5407750Abstract: A high purity and high density silicon carbide sintered body is made by controlling an amount of aluminum in an aluminum compound as a sintering additive from more than the solid solution upper limit in silicon carbide, preferably, as aluminum from 0.4 to 0.7% by weight of the total silicon carbide and aluminum compound. The sintered body has a density of 99.9% or more and can have a smooth surface with an average surface roughness of 2 nm or less when polished. Thus, this sintered body is suitable for producing a precise, rigid and heat resistant mirror substrate.Type: GrantFiled: December 18, 1992Date of Patent: April 18, 1995Assignee: Nippon Steel CorporationInventors: Toshiya Kinoshita, Hiroshi Kubo
-
Patent number: 4765739Abstract: In a fiber optical rotation sensor, a laser wave omitted from a laser diode is guided into a one directional optical coupler and is splitted into two laser waves by the coupler. The two laser waves are propagated in an optical fiber loop in an opposite directions and the phases of the laser waves are modulated in the fiber loop by a phase modulation signal having a frequency f.sub.0. The phase-modulated light waves are combined and converted into an interference laser wave and the interference laser wave is splitted in the coupler. One of the splitted interference laser waves is guided to a photodetector and is converted into an electric signal by the photodetector. A synchronous detector detects the electric signal with a frequency of an integral multiple of the frequency f.sub.0 to extract the corresponding integral multiple signal components Sn-1, Sn, Sn+1. The signal components Sn-1, Sn, Sn+1 (n.gtoreq.1) are supplied to operation circuit.Type: GrantFiled: October 30, 1986Date of Patent: August 23, 1988Assignee: Kabushiki Kaisha ToshibaInventors: Tadashi Koizumi, Toshiya Kinoshita