Abstract: A transport and storage carrier for semiconductor members including wafers which is characterized in that the carrier is molded from a resin composition comprising a synthetic resin having a melting temperature of at least 300° C. and a carbon fibril admixed with the resin, the molded carrier being 1 to 5 seconds in average charge decay time for decay of 1,000 V to 5 V.

Abstract: A loader disposed in a low cleanliness room along a border between the low cleanliness room and a high cleanliness room, for transporting a dust free article between an inside of a container receiving the dust free article and the high cleanliness room, which includes: (a) a stage for mounting the container; (b) an opening portion through which the dust free article is transported between the inside of the container and the high cleanliness room; (c) a door for opening and closing the opening portion; (d) unifying means for unifying a cover of the container and the door when the container approaches the door; and (e) a driving means for transferring the unified cover and door within the loader to simultaneously open and close the opening portion of the container.

Abstract: A loader disposed in a low cleanliness room along a border between the low cleanliness room and a high cleanliness room, for transporting a dust free article between an inside of a container receiving the dust free article to the high cleanliness room, which comprises: (a) a stage for mounting the container; (b) an opening portion through which the dust free article is transported between the inside of the container and the high cleanliness room; (c) a door for opening and closing the opening portion; (d) unifying means for unifying a cover of the container and the door when the container approaches the door; and (e) a driving means for transferring unified cover and door within the loader to simultaneously open and close the opening portion and the container.