Abstract: An outer sheath for an electronic device which includes an electronic element is formed by placing a thermosetting resin on the outer surface of the electronic element to form a first thermosetting resin layer, placing a thermoplastic resin on the outer surface of the first thermosetting resin layer to form a thermoplastic layer and placing a thermosetting resin layer on the thermoplastic layer to form a second thermosetting resin layer. All three layers are then heated so as to cure the first and second thermosetting resin layers and to cause the thermoplastic layer to melt and form a non-porous layer which is subsequently solidified.

Abstract: An electronic device 1 includes an electronic element 3 having an outer sheath 5 covering at least substantially the entire outer surface of the electronic element. The outer sheath 5 has three layers: a first thermoplastic layer 5a formed on at least substantially the entire outer surface of the electronic element; a thermoplastic resin layer 5a formed on at least substantially the entire outer surface of the first thermosetting layer 5a, and a second thermoplastic resin layer 5b formed on at least substantially the entire outer surface of the thermoplastic layer. The outer sheath is formed by placing an uncured thermosetting resin on the outer surface of the electronic element to form the first thermosetting resin layer placing an uncured thermosetting resin on the outer surface of the first thermosetting resin layer to form the thermoplastic layer and placing an uncured thermosetting resin layer on the thermoplastic layer to form the second thermosetting resin layer.

Abstract: To generate a problem solving plan and/or a system control plan respectively in association with the contents of the problem and/or the system operation conditions, there are disposed element knowledge for storing therein problem solving methods and system control guidelines and harmonizing knowledge for selecting and/or modifying the element knowledge. Depending on the contents of the problem and/or the system operation conditions, selections and modifications are executed on the problem solving methods and system control guidelines so as to produce an optimal problem solving method and/or an optimal system control guideline. Even when the solving method, the problem solving condition, and system executing situation vary depending on a given problem solving condition and a given system executing situation, an appropriate solving plan can be proposed.