Abstract: A ceramic heater includes an RF plate having a placement surface on which a wafer is to be placed, and made of a ceramic sintered body in which an RF electrode is embedded; and a heater plate made of a ceramic sintered body in which a heater is embedded, the RF plate and the heater plate being joined with a space interposed therebetween on a side opposite to the placement surface. The relationship among a minimum height H (mm) of the space in a direction perpendicular to the placement surface, a proportion A of a total area of portions where the RF plate and the heater plate are joined, with respect to an area of a plane along the placement surface that is defined by an outer edge of the placement surface, and a distance D (mm) between the RF electrode and the heater, satisfies H/A?1000 and H/A+(D?H)/(1?A)?14.

Abstract: A substrate supporting device having a feeder structure that enables a large number of electrodes to be successfully supplied with power. A ceramic heater 100 includes a base 10 having an upper surface as a support surface on which a substrate is supported, electrodes 20 embedded in the base 10, a base-supporting member 30 that is mounted on a lower surface of the base 10 and that is formed of a heat insulating material, and feeder rods 40 that extend through respective through-holes 35 formed in a circumferential wall 34 of the base-supporting member 30 and extending in the vertical direction and that are electrically connected to the electrodes 20.

Abstract: Disclosed is a ceramic heater, which includes: a disc-shaped ceramic substrate with top and bottom surfaces; and a planar electrode and first and second heating resistors embedded in the ceramic substrate in this order from top to bottom. In top view, the first heating resistor has: a planer first resistive portion arranged inside a first imaginary circle defined by an outermost circumferential contour of the planer electrode; a linear or strip-shaped second resistive portion arranged outward of the first resistive portion in a radial direction of the ceramic substrate and extending along a circumferential direction of the ceramic substrate; and a connecting portion connecting the first and second resistive portions to each other; and the second heating resistor is arranged inside a second imaginary circle defined by an innermost circumferential contour of the second resistive portion.

Abstract: Disclosed is a ceramic heater, which includes: a disc-shaped ceramic substrate with top and bottom surfaces; and a planar electrode and first and second heating resistors embedded in the ceramic substrate in this order from top to bottom. In top view, the first heating resistor has: a planer first resistive portion arranged inside a first imaginary circle defined by an outermost circumferential contour of the planer electrode; a linear or strip-shaped second resistive portion arranged outward of the first resistive portion in a radial direction of the ceramic substrate and extending along a circumferential direction of the ceramic substrate; and a connecting portion connecting the first and second resistive portions to each other; and the second heating resistor is arranged inside a second imaginary circle defined by an innermost circumferential contour of the second resistive portion.

Abstract: A ceramic heater includes an RF plate having a placement surface on which a wafer is to be placed, and made of a ceramic sintered body in which an RF electrode is embedded; and a heater plate made of a ceramic sintered body in which a heater is embedded, the RF plate and the heater plate being joined with a space interposed therebetween on a side opposite to the placement surface. The relationship among a minimum height H (mm) of the space in a direction perpendicular to the placement surface, a proportion A of a total area of portions where the RF plate and the heater plate are joined, with respect to an area of a plane along the placement surface that is defined by an outer edge of the placement surface, and a distance D (mm) between the RF electrode and the heater, satisfies H/A?1000 and H/A+(D?H)/(1?A)?14.

Abstract: A substrate supporting device having a feeder structure that enables a large number of electrodes to be successfully supplied with power. A ceramic heater 100 includes a base 10 having an upper surface as a support surface on which a substrate is supported, electrodes 20 embedded in the base 10, a base-supporting member 30 that is mounted on a lower surface of the base 10 and that is formed of a heat insulating material, and feeder rods 40 that extend through respective through-holes 35 formed in a circumferential wall 34 of the base-supporting member 30 and extending in the vertical direction and that are electrically connected to the electrodes 20.

Abstract: An object of this invention is to provide a surface protective film which is capable of suppressing the entry of a corrosive gas as compared with conventional surface protective films. A surface protective film according to this invention is a film which contains yttria (Y2O3) as a main component and also contains cerium. Since the surface protective film contains cerium, defects such as micropores in the film are reduced, thereby enabling suppression of the entry of a corrosive gas.

Abstract: A corrosion-resistant member used in a corrosive environment includes a substrate, and a ceramic sprayed film, which covers a part or all of the substrate surface and has relative density of 80% or greater. Maximum diameter of voids existing in the ceramic sprayed film surface is 25 ?m or less. This corrosion-resistant member is obtained by using Y2O3 as a material having a bulk density of at least 1.5 g/cm3 and dried to a moisture content of 1 mass percent or less and spraying plasma on the substrate with an output power of 40 to 110 kW by a spraying device including two anode torches.