Patents by Inventor Toshiya Watanabe

Toshiya Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210004507
    Abstract: A powder material as the raw material of a three-dimensional laminated and shaped object is accurately evaluated. This invention provides an evaluation apparatus of a powder material as a raw material of a three-dimensional laminated and shaped object, including a calculator that calculates, using powder constitution data concerning particles constituting the powder material, a volume of a closed space formed by the plurality of particles in the powder material, and an evaluator that evaluates the powder material by comparing the volume of the closed space calculated by the calculator with a predetermined threshold.
    Type: Application
    Filed: March 8, 2018
    Publication date: January 7, 2021
    Applicant: TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING
    Inventors: Noriko YAMAZAKI, Noriko WATARI, Yuzuru OGURA, Toshiya WATANABE
  • Publication number: 20200361029
    Abstract: This machine tool control method has: a step for accepting processing content about a workpiece; a step for referring to a storage unit, which stores, for each piece of processing content, a range of set conditions regarding the movements of a machine tool for performing the processing, and specifying the range of the set conditions corresponding to the accepted processing content; and a step for determining the settings of the movements of the machine tool on the premise of the range of the specified set conditions upon accepting a processing order according to the processing content about the workpiece.
    Type: Application
    Filed: April 25, 2018
    Publication date: November 19, 2020
    Applicant: MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
    Inventors: Saneyuki GOYA, Toshiya WATANABE, Haruhiko NIITANI, Yoshihito FUJITA
  • Patent number: 10792759
    Abstract: Provided is a laser processing method in which a laser processing head for irradiating, with at least a short-pulse laser, a processed article having a protection layer laminated to a metal layer is used to process the processed article, whereby high-quality, highly accurate processing is possible by means of a short-pulse laser processing step for irradiating the protection layer with the short-pulse laser and ablating the protection layer, and a metal layer processing step for ablating the metal layer in the area that was ablated during the short-pulse laser processing step.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: October 6, 2020
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Saneyuki Goya, Masato Kinouchi, Atsushi Takita, Minoru Danno, Toshiya Watanabe, Takashi Ishide
  • Publication number: 20200293021
    Abstract: A method of optimizing a machining simulation condition includes a step of receiving a setting condition of a machine tool at the time of performing a prescribed machining detail, a step of calculating a first machining result that is a machining result assumed when the machine tool performs machining under the received setting condition, a step of acquiring a second machining result that is a machining result when the machine tool performs machining under the received setting condition, and a step of evaluating a degree of coincidence between the first machining result and the second machining result, and repeatedly performs the calculation of the first machining result while changing the precondition of the calculation until the degree of coincidence is equal to or more than a prescribed threshold value.
    Type: Application
    Filed: April 20, 2018
    Publication date: September 17, 2020
    Applicant: Mitsubishi Heavy Industries Machine Tool Co., Ltd.
    Inventors: Saneyuki GOYA, Toshiya WATANABE, Haruhiko NIITANI, Yoshihito FUJITA
  • Publication number: 20200180023
    Abstract: A process abnormality detection system for a three-dimensional additive manufacturing device which performs additive modeling by emitting a beam to a powder bed determines that a laying abnormality of the powder bed is occurring if at least one of a first condition that an average height of the powder bed from a reference position is out of a first predetermined range or a second condition that a height variation of the powder bed is out of a second predetermined range is satisfied, on the basis of a detection result of a shape measurement sensor.
    Type: Application
    Filed: August 8, 2017
    Publication date: June 11, 2020
    Inventors: Ryuichi NARITA, Toshiya WATANABE, Akio KONDOU, Masashi KITAMURA, Hidetaka HARAGUCHI, Shuji TANIGAWA, Claus THOMY, Henry KOEHLER, Michael KALMS
  • Publication number: 20200171652
    Abstract: A hand mechanism grips an object more favorably, regardless of the attitude and surrounding conditions of the object. When an object is to be gripped by a hand mechanism having three or more finger portions, at least one finger portion among the three or more finger portions functions as a state-altering finger portion for altering the attitude or the position of the object while contacting the object, and at least two finger portions among the finger portions other than the finger portion functioning as the state-altering finger portion function as gripping finger portions for gripping the object in a state where the attitude or the position has been altered by the state-altering finger portion.
    Type: Application
    Filed: May 15, 2018
    Publication date: June 4, 2020
    Applicant: THK CO., LTD.
    Inventors: Shinji Kawabata, Yoshimasa Endo, Fumiya Koizumi, Yoshikazu Matsuo, Yuki Nomura, Toshiya Watanabe, Kenji Hidaka
  • Publication number: 20200114508
    Abstract: A gripping system for gripping an object using a hand mechanism having at least two finger portions includes a specification unit that specifies a contactable portion and an unexposed portion, the contactable portion being a portion of the object that can be contacted by at least a first finger portion constituting one of the finger portions and the unexposed portion being a portion that is not exposed at the time of the determination, a first operation control unit that exposes the unexposed portion of the object, and a second operation control unit that grips the object in a state where the unexposed portion is exposed by bringing the first finger portion or the second finger portion into contact with the unexposed portion and bringing a finger portion other than the finger portion contacting the unexposed portion into contact with a predetermined surface of the object other than the unexposed portion.
    Type: Application
    Filed: May 15, 2018
    Publication date: April 16, 2020
    Applicant: THK CO., LTD.
    Inventors: Shinji Kawabata, Yoshikazu Matsuo, Yuki Nomura, Toshiya Watanabe
  • Patent number: 10442032
    Abstract: Provided are a processing device and a processing method with which the device can be made more compact, and with which highly precise processing can be performed. The processing device, which processes a member to be processed by irradiating the member to be processed with a laser, has: a laser oscillator having a plurality of vertical cavity surface-emitting laser diode chips that output laser light having a wavelength of 1,070 nm or less, and a substrate on the surface of which the plurality of vertical cavity surface-emitting laser diode chips are arranged in a matrix; a guidance optical system that guides the laser light output from the laser oscillator; and a control device that controls the output of the laser oscillator.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: October 15, 2019
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Saneyuki Goya, Kenji Muta, Toshiya Watanabe, Takashi Ishide
  • Patent number: 10380833
    Abstract: Provided is an item dispensing device that can reduce the height of each device without decreasing the number of items to be stored. The item dispensing device includes: a storage case for storing capsules; an item ejection port provided in a side wall of the storage case; a vertical rotating shaft attached to the storage case; a motor for driving the rotating shaft to rotate; a circular plate provided in a lower part of the storage case and rotated by the rotating shaft, the circular plate being provided with item holders along the circumferential direction, each of the item holders having an opening in the outer circumferential direction and provided to be engageable with a capsule, wherein a part of the outer circumference of the circular plate is opposed to the item ejection port; and a capsule ejection mechanism for energizing the capsule engaged with one of the item holders toward the item ejection port side when the item holder is positioned at the item ejection port.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: August 13, 2019
    Assignee: Masuki co., ltd
    Inventors: Takashi Yoshida, Toshiya Watanabe
  • Publication number: 20190176271
    Abstract: A laser machining device includes a laser machining head and a control unit. The laser machining head applies laser for machining an object to be machined, and includes a first laser light source for first laser, a second laser light source for second laser having a different pulse width different from the first laser, a condensing optical system provided between the object and the laser light sources to condense at least the lasers on the object, a switch mechanism provided between the condensing optical system and the laser light sources so that the switch mechanism is movable to a position that at least one of the lasers enters the condensing optical system, and an irradiation angle change mechanism provided between the condensing optical system and the switch mechanism to change an irradiation angle of the first laser. The control unit controls the laser machining head.
    Type: Application
    Filed: June 20, 2017
    Publication date: June 13, 2019
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Saneyuki Goya, Minoru Danno, Toshiya Watanabe
  • Publication number: 20190114875
    Abstract: Provided is an item dispensing device that can reduce the height of each device without decreasing the number of items to be stored. The item dispensing device includes: a storage case for storing capsules; an item ejection port provided in a side wall of the storage case; a vertical rotating shaft attached to the storage case; a motor for driving the rotating shaft to rotate; a circular plate provided in a lower part of the storage case and rotated by the rotating shaft, the circular plate being provided with item holders along the circumferential direction, each of the item holders having an opening in the outer circumferential direction and provided to be engageable with a capsule, wherein a part of the outer circumference of the circular plate is opposed to the item ejection port; and a capsule ejection mechanism for energizing the capsule engaged with one of the item holders toward the item ejection port side when the item holder is positioned at the item ejection port.
    Type: Application
    Filed: December 12, 2018
    Publication date: April 18, 2019
    Inventors: Takashi Yoshida, Toshiya Watanabe
  • Patent number: 10162187
    Abstract: This invention is directed to attenuating a beam output without changing the beam position and the beam diameter. A high-output optical attenuator includes a first reflector that totally reflects incident light and causes first reflected light serving as reflected light of the incident light to enter a second reflecting portion, a second reflector that reflects the first reflected light and causes second reflected light serving as reflected light of the first reflected light to enter a third reflecting portion, a third reflector that reflects the second reflected light and causes third reflected light serving as reflected light of the second reflected light to enter a fourth reflecting portion, and a fourth reflector that reflects the third reflected light as fourth reflected light having the same optical axis as the optical axis of the incident light. At least two of the second reflector, the third reflector, and the fourth reflector are half mirrors.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: December 25, 2018
    Inventors: Saneyuki Goya, Toshiya Watanabe, Minoru Danno, Yoshihito Fujita, Haruhiko Niitani
  • Patent number: 9862055
    Abstract: A processing apparatus and a processing method which perform processing more accurately with a simple structure are provided. The processing apparatus includes an irradiation head 16 and a control device. The irradiation head 16 includes a laser turning unit 35 and a condensing optical system 37. The laser turning unit 35 includes a first prism 51, a second prism 52, a first rotating mechanism 53, and a second rotating mechanism 54. The control device adjusts the differences between rotation speeds and phase angles of the first prism 51 and the second prism 52 based on a relation between at least a heat affected layer of a workpiece and a turning speed of laser.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: January 9, 2018
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Saneyuki Goya, Masato Kinouchi, Minoru Danno, Toshiya Watanabe, Takashi Ishide, Tsugumaru Yamashita, Yoshihito Fujita, Makoto Yamasaki, Ryu Suzuki, Kohei Kanaoka
  • Patent number: 9757816
    Abstract: Provided are a machining device and a machining method in which machining of higher precision can be performed with a simple configuration. The machining device has an irradiation head (16) and a controller; and the irradiation head (16) can be divided into a collimate optical system, a laser revolving unit (35), and a light collection optical system (37). The laser revolving unit (35) has a first prism (51), a second prism (52), a first rotation mechanism (53), and a second rotation mechanism (54). The controller controls the rotational speeds and the difference in phase angles of the first prism (51) and the second prism (52), on the basis of at least the relationship between a heat affected layer of a member to be machined and the revolving speed of the laser.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: September 12, 2017
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Yoshihito Fujita, Tsugumaru Yamashita, Saneyuki Goya, Makoto Yamasaki, Ryu Suzuki, Kohei Kanaoka, Takashi Ishide, Toshiya Watanabe
  • Publication number: 20170182590
    Abstract: Provided are a processing device and a processing method with which the device can be made more compact, and with which highly precise processing can be performed. The processing device, which processes a member to be processed by irradiating the member to be processed with a laser, has: a laser oscillator having a plurality of vertical cavity surface-emitting laser diode chips that output laser light having a wavelength of 1,070 nm or less, and a substrate on the surface of which the plurality of vertical cavity surface-emitting laser diode chips are arranged in a matrix; a guidance optical system that guides the laser light output from the laser oscillator; and a control device that controls the output of the laser oscillator.
    Type: Application
    Filed: January 26, 2015
    Publication date: June 29, 2017
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Saneyuki GOYA, Kenji MUTA, Toshiya WATANABE, Takashi ISHIDE
  • Publication number: 20170038596
    Abstract: This invention is directed to attenuating a beam output without changing the beam position and the beam diameter. A high-output optical attenuator includes a first reflector that totally reflects incident light and causes first reflected light serving as reflected light of the incident light to enter a second reflecting portion, a second reflector that reflects the first reflected light and causes second reflected light serving as reflected light of the first reflected light to enter a third reflecting portion, a third reflector that reflects the second reflected light and causes third reflected light serving as reflected light of the second reflected light to enter a fourth reflecting portion, and a fourth reflector that reflects the third reflected light as fourth reflected light having the same optical axis as the optical axis of the incident light. At least two of the second reflector, the third reflector, and the fourth reflector are half mirrors.
    Type: Application
    Filed: March 10, 2015
    Publication date: February 9, 2017
    Applicant: TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING
    Inventors: Saneyuki GOYA, Toshiya WATANABE, Minoru DANNO, Yoshihito FUJITA, Haruhiko NIITANI
  • Publication number: 20170036299
    Abstract: A laser heating control mechanism according to this invention is a mechanism that performs proper adjustment of preheating or postheating by a simple operation in three-dimensional shaping. The laser heating control mechanism is a laser heating control mechanism for preheating or postheating a heating target object. The laser heating control mechanism includes an optical fiber that transmits a laser beam and radiates the laser beam from an opening end face, a collimation optical system that fucuses the laser beam radiated from the opening end face onto the heating target object, and an irradiation range adjustment mechanism that adjusts the distance between the opening end face and the collimation optical system along the irradiation axis of the laser beam so as to irradiate the heating target object with the laser beam at a predetermined beam diameter.
    Type: Application
    Filed: March 23, 2015
    Publication date: February 9, 2017
    Applicant: TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING
    Inventors: Saneyuki Goya, Toshiya Watanabe, Minoru Danno
  • Publication number: 20160221120
    Abstract: In order to make focal positions of laser beams having different wavelength bands coincide with one another: a laser output device that oscillates laser beams having plural wavelength bands; a spectrometer that respectively disperses the laser beams of the respective wavelength bands; and condensers that respectively condense the laser beams dispersed by the spectrometer independently and match focal points thereof to the same position, are included.
    Type: Application
    Filed: February 26, 2014
    Publication date: August 4, 2016
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Ryuichi NARITA, Saneyuki GOYA, Kenji MUTA, Toshiya WATANABE, Masao WATANABE
  • Publication number: 20160207144
    Abstract: In order to simplify a configuration even if laser beams of different wavelength bands are used, a laser output device, which oscillates laser beams of plural wavelength bands, and an irradiation head, which performs irradiation by condensing the laser beams of the respective wavelength bands with focal distances thereof being shifted from each other on the same optical axis S, are included.
    Type: Application
    Filed: February 26, 2014
    Publication date: July 21, 2016
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Ryuichi NARITA, Saneyuki GOYA, Kenji MUTA, Toshiya WATANABE, Masao WATANABE
  • Publication number: 20160193693
    Abstract: Provided is a laser processing method in which a laser processing head for irradiating, with at least a short-pulse laser, a processed article having a protection layer laminated to a metal layer is used to process the processed article, whereby high-quality, highly accurate processing is possible by means of a short-pulse laser processing step for irradiating the protection layer with the short-pulse laser and ablating the protection layer, and a metal layer processing step for ablating the metal layer in the area that was ablated during the short-pulse laser processing step.
    Type: Application
    Filed: January 26, 2015
    Publication date: July 7, 2016
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Saneyuki GOYA, Masato KINOUCHI, Atsushi TAKITA, Minoru DANNO, Toshiya WATANABE, Takashi ISHIDE