Abstract: Polishing processes are separated into a plurality of phases; that is, an early polishing phase, a planarization phase, and a post-planarization phase. Polishing is effected by means of changing polishing requirements from phase to phase. Since polishing is effected under appropriate polishing requirements which vary from phase to phase, a polishing time is shortened by means of increasing a polishing rate in each phase. By means of polishing a wafer through use of highly-selective ceria slurry having superior smoothness, high smoothness and high productivity can be achieved simultaneously.

Abstract: Polishing processes are separated into a plurality of phases; that is, an early polishing phase, a planarization phase, and a post-planarization phase. Polishing is effected by means of changing polishing requirements from phase to phase. Since polishing is effected under appropriate polishing requirements which vary from phase to phase, a polishing time is shortened by means of increasing a polishing rate in each phase. By means of polishing a wafer through use of highly-selective ceria slurry having superior smoothness, high smoothness and high productivity can be achieved simultaneously.

Abstract: A polishing apparatus includes a rotatable sample holder for holding a substrate which has a rugged surface, a rotatable polishing table, a polishing cloth adapted to contact the substrate which is held on said sample holder, a device for supplying a polishing reagent between said polishing cloth and the substrate which is held on the sample holder, an elastic member arranged between the polishing table and the polishing cloth. The polishing cloth is fixed to the polishing table in a tensioned state without being adhered to the elastic member.

Abstract: A polishing apparatus and a polishing method using the apparatus in which an elastic portion is interposed between a polishing table and a polishing cloth, whereby the contacting state between the face of the polishing cloth and a face of a sample to be polished is made uniform and the flatness of the sample is improved. A polishing apparatus and a polishing method using the apparatus in which a second elastic body having on a sample-contacting face resin pellets and/or polishing particles is used in a polishing cloth, whereby the degree of the polishing on a face of a sample to be polished is uniformalized in a macroscopic view point and the flatness is improved in a microscopic view point.