Patents by Inventor Toshiyasu Ito

Toshiyasu Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220224040
    Abstract: A high-speed transmission connector is described that includes a housing, a row of front side contacts supported on the housing, a row of rear side contacts supported on the housing, and a metal member. The housing has a slot to be fitted with a header of an external communication partner, and an upper plate portion and a lower plate portion facing each other vertically across the slot. The front side contact portions are exposed on a front side in the slot and the rear side contact portions are exposed on a rear side in the slot. The metal member supports the upper plate portion and the lower plate portion and fastens the upper plate portion and the lower plate portion.
    Type: Application
    Filed: January 7, 2022
    Publication date: July 14, 2022
    Inventors: Yoshiharu Ishii, Toshiyasu Ito
  • Publication number: 20220209446
    Abstract: A connector set is provided that includes a first connector, a first cap to be attached to the first connector when the first connector is reflow-mounted on a first external substrate, a second connector, and a second cap to be attached to the second connector when the second connector is reflow-mounted on a second external substrate formed of a material with a smaller thermal expansion coefficient than that of the first external substrate. The second cap is formed of a material with a smaller thermal expansion coefficient than that of the first cap.
    Type: Application
    Filed: December 22, 2021
    Publication date: June 30, 2022
    Inventors: Toshiyasu ITO, Yosuke TAKAI
  • Publication number: 20220209443
    Abstract: A connector is provided that includes a plurality of socket type connectors to be mounted on a first substrate and a plurality of plug type connectors to be mounted on a second substrate, thereby electrically connecting the first substrate and the second substrate. The socket type connector includes a housing with a slot and a plurality of contacts arranged in the slot. The plug type connector includes a housing with a header to be fitted in the slot, and a plurality of contacts arranged in the header. The housing of the socket type connector and the housing of the plug type connector has a rotationally asymmetrical shape as viewed from a fitting direction.
    Type: Application
    Filed: December 22, 2021
    Publication date: June 30, 2022
    Inventors: Toshiyasu ITO, Yosuke TAKAI
  • Publication number: 20220209445
    Abstract: A connector set is disclosed that includes a plurality of connectors and a cap to be attached to the plurality of connectors when the plurality of connectors are reflow-mounted on an external substrate. Each one end portion of the connectors and the cap is provided with a fitted portion and a fitting portion to be fitted in the fitted portion. The fitted portion is provided with an opening portion for moving the fitting portion so as to absorb thermal expansion from one end portion side to the other end portion side due to temperature conversion of reflow.
    Type: Application
    Filed: December 22, 2021
    Publication date: June 30, 2022
    Inventors: Toshiyasu ITO, Yosuke TAKAI
  • Patent number: 11336045
    Abstract: According to an embodiment, an LGA socket includes a center substrate, first and second insulator and a plurality of pairs of contacts. The center substrate is configured by a multi-layer structure including a ground layer and a plurality of through holes formed through the center substrate. The first insulator is arranged around the plurality of through holes on an upper surface of the center substrate. The second insulator is arranged around the plurality of through holes on a lower surface of the center substrate. The plurality of pairs of contacts are inserted into the through holes from an upper side and from a lower side of the through holes and are soldered via the through holes to be electrically connected to each other.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: May 17, 2022
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Yoshiya Yamada, Koji Kikuchi, Toshiyasu Ito, Yosuke Takai
  • Patent number: 11243363
    Abstract: In a transceiver module, when one end portion of a module board (18) is inserted and connected to a concave portion (16R) of a plug connector (16), a projection portion (16PP) formed on the periphery of the concave portion (16R) of the plug connector (16) is fitted into a notch portion (18PH) as one end surface of the module board (18) comes into contact with an inner peripheral surface that forms the concave portion (16R).
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: February 8, 2022
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke Takai, Toshiyasu Ito
  • Patent number: 11239589
    Abstract: A host connector includes a connector insulator having a slot allowing detachable insertion of a plug connector of a module, a first contact terminal group including contact terminals arranged inside the connector insulator and each brought into contact with a contact pad on one side at a connection end of the plug connector, and a second contact terminal group including contact terminals each brought into contact with a contact pad on another side opposed to the aforementioned contact pad. The first contact terminal group includes grounding sub-contact terminals arranged inside slits of the connector insulator, grounding main contact terminals supporting the grounding sub-contact terminals, and signal contact terminals. Contact portions of each grounding main contact terminal and of each signal contact terminal having the same shape are arranged on a common straight line, and the signal contact terminals are disposed between the grounding main contact terminals.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: February 1, 2022
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke Takai, Toshiyasu Ito
  • Patent number: 11199670
    Abstract: A length of a protection wall, which is greater than a length of projection of a connecting end portion of a plug connector from opening end portions of an upper case as well as a lower case of an optical module, is set to be smaller than an interval between a contact surface of each of lower stopper pieces of a receptacle cage to come into contact with an end surface of a side wall as well as an end surface of an end surface of the lower case and an opening end surface of a slot of a host connector.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: December 14, 2021
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke Takai, Toshiyasu Ito
  • Publication number: 20210378121
    Abstract: A socket which holds an IC package and is to be mounted on a circuit board is described that includes: a housing with a bottom portion, two pairs of side wall portions and an opening accommodating the IC package, contacts and holders. The bottom portion is provided with penetration holes. The two pairs of side wall portions face each other across the opening and one pair of side wall portions are provided with ribs protruding outward. The contacts are supported by the housing so as to pass through the penetration holes and are exposed on an opposite side of the opening. The holders have first support holes and are fixed to side surfaces of the housing with the ribs passing through the first support holes.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 2, 2021
    Inventor: Toshiyasu ITO
  • Publication number: 20210376530
    Abstract: A socket having a housing, a plurality of contacts, a plurality of insulating members and a plurality of conductive resin members is described. The housing is in a box shape with an opening and is provided with a matrix of penetration holes at a bottom portion. The plurality of contacts include contacts for ground and respective pairs of contacts for high-speed differential transmission. The plurality of insulating members support the plurality of contacts and are pressed into the housing so that the contacts are exposed on an opposite side of the opening from the penetration holes of the housing. The plurality of conductive resin members are fitted at positions of the plurality of insulating members in contact with the contacts for ground.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 2, 2021
    Inventor: Toshiyasu ITO
  • Publication number: 20210257765
    Abstract: According to an embodiment, an LGA socket includes a center substrate, first and second insulator and a plurality of pairs of contacts. The center substrate is configured by a multi-layer structure including a ground layer and a plurality of through holes formed through the center substrate. The first insulator is arranged around the plurality of through holes on an upper surface of the center substrate. The second insulator is arranged around the plurality of through holes on a lower surface of the center substrate. The plurality of pairs of contacts are inserted into the through holes from an upper side and from a lower side of the through holes and are soldered via the through holes to be electrically connected to each other.
    Type: Application
    Filed: February 17, 2021
    Publication date: August 19, 2021
    Inventors: Yoshiya YAMADA, Koji KIKUCHI, Toshiyasu ITO, Yosuke TAKAI
  • Publication number: 20210184383
    Abstract: According to an embodiment of the present disclosure, a connector for high-speed transmission to be fitted with an external counterpart connector includes a housing and a plurality of terminals. The housing has at least one or more slots. The plurality of terminals includes ground terminals and signal terminals are arranged in the slot along a first direction orthogonal to a fitting direction of the connector. Partition walls are provided between adjacent terminals in the slot, and a height of the partition walls between the ground terminals and the signal terminals in the fitting direction is lower than a height of other partition walls in the fitting direction.
    Type: Application
    Filed: December 9, 2020
    Publication date: June 17, 2021
    Inventors: Toshiyasu ITO, Yosuke TAKAI, Taichi ENJOJI
  • Publication number: 20210075163
    Abstract: A group of contact pads (20EB) formed on a lower surface (20B) at a connection end of a board portion of an optical module board (20) includes, in order from the endmost end, a contact pad (20B1) conducting to a ground line (G), contact pads (20B2) and (20B3) conducting to transmission-side high-speed signal lines (S), a contact pad (20B4) conducting to the ground line (G), contact pads (20B5, 20B6, and 20B7) conducting to low-speed signal lines (S), a contact pad (20B8) conducting to the ground line (G), contact pads (20B9 and 20B10) conducting to receiving-side high-speed signal lines (S), and a contact pad (20B11) conducting to the ground line (G).
    Type: Application
    Filed: December 14, 2017
    Publication date: March 11, 2021
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke TAKAI, Toshiyasu ITO
  • Publication number: 20210055488
    Abstract: In a transceiver module, when one end portion of a module board (18) is inserted and connected to a concave portion (16R) of a plug connector (16), a projection portion (16PP) formed on the periphery of the concave portion (16R) of the plug connector (16) is fitted into a notch portion (18PH) as one end surface of the module board (18) comes into contact with an inner peripheral surface that forms the concave portion (16R).
    Type: Application
    Filed: October 26, 2020
    Publication date: February 25, 2021
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke TAKAI, Toshiyasu ITO
  • Patent number: 10859777
    Abstract: In a transceiver module, when one end portion of a module board (18) is inserted and connected to a concave portion (16R) of a plug connector (16), a projection portion (16PP) formed on the periphery of the concave portion (16R) of the plug connector (16) is fitted into a notch portion (18PH) as one end surface of the module board (18) comes into contact with an inner peripheral surface that forms the concave portion (16R).
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: December 8, 2020
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke Takai, Toshiyasu Ito
  • Publication number: 20200358217
    Abstract: A host connector includes a connector insulator having a slot allowing detachable insertion of a plug connector of a module, a first contact terminal group including contact terminals arranged inside the connector insulator and each brought into contact with a contact pad on one side at a connection end of the plug connector, and a second contact terminal group including contact terminals each brought into contact with a contact pad on another side opposed to the aforementioned contact pad. The first contact terminal group includes grounding sub-contact terminals arranged inside slits of the connector insulator, grounding main contact terminals supporting the grounding sub-contact terminals, and signal contact terminals. Contact portions of each grounding main contact terminal and of each signal contact terminal having the same shape are arranged on a common straight line, and the signal contact terminals are disposed between the grounding main contact terminals.
    Type: Application
    Filed: May 11, 2020
    Publication date: November 12, 2020
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke TAKAI, Toshiyasu ITO
  • Publication number: 20200142143
    Abstract: In a transceiver module, when one end portion of a module board (18) is inserted and connected to a concave portion (16R) of a plug connector (16), a projection portion (16PP) formed on the periphery of the concave portion (16R) of the plug connector (16) is fitted into a notch portion (18PH) as one end surface of the module board (18) comes into contact with an inner peripheral surface that forms the concave portion (16R).
    Type: Application
    Filed: January 3, 2020
    Publication date: May 7, 2020
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke TAKAI, Toshiyasu ITO
  • Publication number: 20190285817
    Abstract: A length of a protection wall, which is greater than a length of projection of a connecting end portion of a plug connector from opening end portions of an upper case as well as a lower case of an optical module, is set to be smaller than an interval between a contact surface of each of lower stopper pieces of a receptacle cage to come into contact with an end surface of a side wall as well as an end surface of an end surface of the lower case and an opening end surface of a slot of a host connector.
    Type: Application
    Filed: October 3, 2018
    Publication date: September 19, 2019
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke TAKAI, Toshiyasu ITO
  • Patent number: 10321607
    Abstract: When an optical module is inserted into a compartment of a receptacle cage in a state where a heatsink is detached from the receptacle cage, a tip end portion of a protection wall portion of the optical module comes into contact with end portions of guide pieces of a guide plate even if the optical module is inserted with the protection wall portion being lifted up, and the tip end portion of the protection wall portion is thereby pushed down and guided to a clearance below the guide pieces.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: June 11, 2019
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Toshiyasu Ito, Shigeru Sato, Yosuke Takai
  • Patent number: D949799
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: April 26, 2022
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Toshiyasu Ito, Yosuke Takai, Taichi Enjoji