Abstract: A method for cleaning a vaporizer that vaporizes, at normal temperature and pressure, a source material in a liquid state, and supplies the vaporized source material to a reactor through a supply pipe, includes a cleaning step of passing the source material to the vaporizer while maintaining the source material in a liquid state to clean the vaporizer.

Abstract: A method for cleaning a vaporizer that vaporizes, at normal temperature and pressure, a source material in a liquid state, and supplies the vaporized source material to a reactor through a supply pipe, includes a cleaning step of passing the source material to the vaporizer while maintaining the source material in a liquid state to clean the vaporizer.

Abstract: A method of manufacturing a sheet glass includes: a re-draw process forming a sheet glass by, heating and softening a glass preform manufactured by float method, and extending the glass preform to a desirable plate thickness. An extension direction in which the glass preform is extended by the re-draw process is 90 degrees with respect to a direction in which molten glass is fed in the float method.

Abstract: A method includes forming a glass ribbon by heating and softening a glass plate preform and drawing the glass plate preform to a predetermined thickness in a heating furnace; and performing coring on the glass ribbon in order to form circular substrates in a straight line along a longitudinal direction of the glass ribbon.

Abstract: A method of manufacturing a sheet glass includes: a re-draw process forming a sheet glass by, heating and softening a glass preform manufactured by float method, and extending the glass preform to a desirable plate thickness. An extension direction in which the glass preform is extended by the re-draw process is 90 degrees with respect to a direction in which molten glass is fed in the float method.

Abstract: A method includes forming a glass ribbon by heating and softening a glass plate preform and drawing the glass plate preform to a predetermined thickness in a heating furnace; and performing coring on the glass ribbon in order to form circular substrates in a straight line along a longitudinal direction of the glass ribbon.

Abstract: A reflow furnace comprises: a carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification equipment including a retrieving device to retrieve a part of the ambient gas containing vaporized flux component when soldering, a heating device to heat the retrieved ambient gas to a desired temperature, an oxidation catalyst to burn the flux component contained in the heated ambient gas, and a returning device to return a high temperature gas after being burned to the heating chamber.

Abstract: A reflow furnace comprises: a carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification equipment including a retrieving device to retrieve a part of the ambient gas containing vaporized flux component when soldering, a heating device to heat the retrieved ambient gas to a desired temperature, an oxidation catalyst to burn the flux component contained in the heated ambient gas, and a returning device to return a high temperature gas after being burned to the heating chamber.

Abstract: A reflow furnace comprises: carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification equipment including a retrieving device to retrieve a part of the ambient gas containing vaporized flux component when soldering, a heating device to heat the retrieved ambient gas to a desired temperature, an oxidation catalyst to burn the flux component contained in the heated ambient gas, a control device to control an oxygen concentration in a high temperature gas after being burned, and a returning device to return the high temperature gas with the oxygen concentration controlled after being burned to the heating chamber.

Abstract: A flux collection system is proposed in which in a buffering area between an inlet and a heating chamber of a reflow furnace, blowing in-furnace ambient gas to a printed circuit board from a position under a carrier device and sucking ambient gas at a lower section of the carrier device cause a device to prevent outside air from entering and ambient gas from releasing the ambient gas including flux component to be blown out from a narrowing mechanism to collide with a partition plate and promote mixture of solidified flux and liquefied flux to collect flux easily.

Abstract: The bumper mounting structure includes a front side member 1 and a bumper reinforcing member 2. In assembly, the tip end of the front side member 1 is connected with the bumper reinforcing member 2. The tip end of the member 1 is opened and provided with a slant part 10, forming a weakened part in the member 1. When an impact load causes the bumper reinforcing member 2 to be deformed, the deformation of the front side member 1 is induced at its opened end because of its weakened structure. Consequently, it is possible to carry out the effective absorption of impact energy without elevating a reaction force abruptly.

Abstract: A vehicle front structure including a pair of front side members extending in a fore-and-aft direction of the vehicle, each including a first front end portion with a first leading end, and a pair of subframes extending along the front side members on a lower side thereof, each including a second front end portion with a second leading end. The first and second front end portions are connected with each other via a connecting portion therebetween. An abutment member in the form of a tie-down hook or a first cross member is connected with the subframes via the connecting portion. The abutment member includes a front end forward offset from the first and second leading ends of the front side members and the subframes and a portion placed at substantially same height as the second front end portion.

Abstract: The bumper mounting structure includes a front side member 1 and a bumper reinforcing member 2. In assembly, the tip end of the front side member 1 is connected with the bumper reinforcing member 2. The tip end of the member 1 is opened and provided with a slant part 10, forming a weakened part in the member 1. When an impact load causes the bumper reinforcing member 2 to be deformed, the deformation of the front side member 1 is induced at its opened end because of its weakened structure. Consequently, it is possible to carry out the effective absorption of impact energy without elevating a reaction force abruptly.

Abstract: A vehicle front structure including a pair of front side members extending in a fore-and-aft direction of the vehicle, each including a first front end portion with a first leading end, and a pair of subframes extending along the front side members on a lower side thereof, each including a second front end portion with a second leading end. The first and second front end portions are connected with each other via a connecting portion therebetween. An abutment member in the form of a tie-down hook or a first cross member is connected with the subframes via the connecting portion. The abutment member includes a front end forward offset from the first and second leading ends of the front side members and the subframes and a portion placed at substantially same height as the second front end portion.