Patents by Inventor Toshiyuki Baba
Toshiyuki Baba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110205132Abstract: Disclosed is an antenna capable of receiving a very wide band of frequencies. The antenna includes a pair of antenna elements and a pair of feeding legs, which are arranged symmetrically with respect to a line L, with a narrow space G in between.Type: ApplicationFiled: October 14, 2009Publication date: August 25, 2011Inventors: Toshio Kudo, Shoji Nasu, Kazuyuki Kashihara, Toshiyuki Baba
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Publication number: 20110053176Abstract: A particle suspension for use in immunoassay, comprising: particles for use in immunoassay; and a silicone antifoam agent, is disclosed. And a reagent kit for use in immunoassay, comprising: a reagent containing particles and a silicone antifoam agent; another reagent containing an antigen or antibody capable of binding to a target substance and particles; and a further reagent containing a labeled antigen or antibody capable of binding to the target substance, is disclosed.Type: ApplicationFiled: August 9, 2010Publication date: March 3, 2011Applicant: SYSMEX CORPORATIONInventor: Toshiyuki BABA
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Publication number: 20090187776Abstract: The power consumption controller of the present invention controls the power consumption of a physical server having a virtual server at an appropriate value. A management server determines an unused CPU budget from the difference between the total amount of the loads of respective virtual servers and a hypervisor and the total CPU budget of the physical server. The management server determines the drive frequency of the CPU inside the physical server based on the unused CPU budget. The management server changes a CPU allocation budget related to the respective virtual servers and the hypervisor in accordance with the determined drive frequency. The hypervisor controls the CPU allocation budget and drive frequency in accordance with an indication from the management server. Consequently, the power consumption of the physical server is controlled.Type: ApplicationFiled: July 9, 2008Publication date: July 23, 2009Inventors: Toshiyuki BABA, Yoshifumi Takamoto, Keisuke Hatasaki
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Patent number: 7314541Abstract: The present invention provides an improved ion measuring composite electrode, measuring instrument incorporating the composite electrode, and a manufacturing method for forming a preform of a composite double glass pipe for forming the ion measuring composite electrode. A hollow inner pipe and a hollow outer pipe are axially aligned with an elongated member having liquid absorption capacity. The inner pipe is welded to the outer pipe to form an annular space there between for receiving reference electrode liquid. The elongated member insures electrical conductivity even in the presence of air bubbles so that the measuring instrument is operatable and an appropriate weld can be easily manufactured to improve productivity.Type: GrantFiled: October 28, 2003Date of Patent: January 1, 2008Assignee: Horiba, Ltd.Inventor: Toshiyuki Baba
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Patent number: 6866893Abstract: A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.Type: GrantFiled: July 11, 2002Date of Patent: March 15, 2005Assignee: Murata Manufacturing Co., Ltd.Inventors: Toshiyuki Baba, Toshio Nishimura, Tsuyoshi Kitagawa, Jiro Inoue, Shoichi Kawabata
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Patent number: 6815869Abstract: A surface acoustic wave device includes a surface acoustic wave element mounted on a substrate, and the surface acoustic wave element is sealed by a resin sealing layer. Even when the size of the surface acoustic wave element is reduced, a short circuit in a mounting electrode is prevented from occurring when it is mounted, a fillet formation of a conductive bond in the mounting can be easily and visually checked, and the cost can be reduced. The surface acoustic wave element is mounted on a multi-layered substrate by a face-down mounting method by using bumps, the surface acoustic wave element is sealed by the resin sealing layer, electrode lands on an upper surface of the multi-layered substrate connected to the bumps are connected to internal electrodes through via hole electrodes, and the internal electrodes are electrically connected to the mounting electrodes on a lower surface of the multi-layered substrate and end surface wiring electrodes.Type: GrantFiled: December 18, 2002Date of Patent: November 9, 2004Assignee: Murata Manufacturing Co., Ltd.Inventors: Toshiyuki Baba, Masashi Omura
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Patent number: 6800189Abstract: A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.Type: GrantFiled: July 11, 2002Date of Patent: October 5, 2004Assignee: Murata Manufacturing Co., Ltd.Inventors: Toshiyuki Baba, Toshio Nishimura, Tsuyoshi Kitagawa, Jiro Inoue, Shoichi Kawabata
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Publication number: 20040129563Abstract: The present invention provides an improved ion measuring composite electrode, measuring instrument incorporating the composite electrode, and a manufacturing method for forming a preform of a composite double glass pipe for forming the ion measuring composite electrode. A hollow inner pipe and a hollow outer pipe are axially aligned with an elongated member having liquid absorption capacity. The inner pipe is welded to the outer pipe to form an annular space there between for receiving reference electrode liquid. The elongated member insures electrical conductivity even in the presence of air bubbles so that the measuring instrument is operatable and an appropriate weld can be easily manufactured to improve productivity.Type: ApplicationFiled: October 28, 2003Publication date: July 8, 2004Inventor: Toshiyuki Baba
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Publication number: 20030146677Abstract: A surface acoustic wave device includes a surface acoustic wave element mounted on a substrate, and the surface acoustic wave element is sealed by a resin sealing layer. Even when the size of the surface acoustic wave element is reduced, a short circuit in a mounting electrode is prevented from occurring when it is mounted, a fillet formation of a conductive bond in the mounting can be easily and visually checked, and the cost can be reduced. The surface acoustic wave element is mounted on a multi-layered substrate by a face-down mounting method by using bumps, the surface acoustic wave element is sealed by the resin sealing layer, electrode lands on an upper surface of the multi-layered substrate connected to the bumps are connected to internal electrodes through via hole electrodes, and the internal electrodes are electrically connected to the mounting electrodes on a lower surface of the multi-layered substrate and end surface wiring electrodes.Type: ApplicationFiled: December 18, 2002Publication date: August 7, 2003Inventors: Toshiyuki Baba, Masashi Omura
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Patent number: 6538896Abstract: A surface mount type electronic component includes a substantially rectangular case substrate, an electronic element mounted on the case substrate along the longitudinal direction, and a cap which is fixed onto the case substrate in such a manner as to cover the electronic element. First and second top-surface electrodes and first and second bottom-surface electrodes, which extend along the width direction of the case substrate, are arranged with a spacing on the top surface and the bottom surface of the case substrate, respectively. The first top-surface electrode and the first bottom-surface electrode are connected to each other via a first side electrode disposed on the side surface of the case substrate, and the second top-surface electrode and the second bottom-surface electrode are connected to each other via a second side electrode disposed on the side surface of the case substrate.Type: GrantFiled: April 15, 2002Date of Patent: March 25, 2003Assignee: Murata Manufacturing Co., Ltd.Inventors: Eitaro Kameda, Toshiyuki Baba, Hideaki Kuroda, Yasuhiro Morimoto
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Publication number: 20020189832Abstract: A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.Type: ApplicationFiled: July 11, 2002Publication date: December 19, 2002Applicant: Murata Manufacturing Co., Ltd.Inventors: Toshiyuki Baba, Toshio Nishimura, Tsuyoshi Kitagawa, Jiro Inoue, Shoichi Kawabata
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Patent number: 6489558Abstract: A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.Type: GrantFiled: August 18, 2000Date of Patent: December 3, 2002Assignee: Murata Manufacturing Co., Ltd.Inventors: Toshiyuki Baba, Toshio Nishimura, Tsuyoshi Kitagawa, Jiro Inoue, Shoichi Kawabata
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Publication number: 20020174997Abstract: A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.Type: ApplicationFiled: July 11, 2002Publication date: November 28, 2002Applicant: Murata Manufacturing Co., Ltd.Inventors: Toshiyuki Baba, Toshio Nishimura, Tsuyoshi Kitagawa, Jiro Inoue, Shoichi Kawabata
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Publication number: 20020163787Abstract: A surface mount type electronic component includes a substantially rectangular case substrate, an electronic element mounted on the case substrate along the longitudinal direction, and a cap which is fixed onto the case substrate in such a manner as to cover the electronic element. First and second top-surface electrodes and first and second bottom-surface electrodes, which extend along the width direction of the case substrate, are arranged with a spacing on the top surface and the bottom surface of the case substrate, respectively. The first top-surface electrode and the first bottom-surface electrode are connected to each other via a first side electrode disposed on the side surface of the case substrate, and the second top-surface electrode and the second bottom-surface electrode are connected to each other via a second side electrode disposed on the side surface of the case substrate.Type: ApplicationFiled: April 15, 2002Publication date: November 7, 2002Applicant: Murata Manufacturing Co., Ltd.Inventors: Eitaro Kameda, Toshiyuki Baba, Hideaki Kuroda, Yasuhiro Morimoto
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Publication number: 20020146755Abstract: A quality control material composition or a standard material for clinical laboratory tests, containing recombinant human serum albumin prepared by recombinant technology as a base component.Type: ApplicationFiled: February 1, 2001Publication date: October 10, 2002Inventors: Toshiyuki Baba, Takashi Fukui, Yuzzo Hasegawa, Hisahide Hiura, Yahiro Uemura
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Publication number: 20020060085Abstract: A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.Type: ApplicationFiled: August 8, 2001Publication date: May 23, 2002Applicant: Murata Manufacturing Co., Ltd.Inventors: Toshiyuki Baba, Toshio Nishimura, Tsuyoshi Kitagawa, Jiro Inoue, Shoichi Kawabata
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Patent number: 6369487Abstract: A piezoelectric resonance component includes a capacitor substrate, a piezoelectric resonator mounted on the capacitor substrate, and a cover member fixedly attached to the capacitor substrate. The capacitor substrate includes a dielectric substrate, a plurality of inner electrodes arranged in layers within the dielectric substrate, and a plurality of outer electrodes disposed on at least one of opposed side surfaces of the dielectric substrate. The plurality of inner electrodes include an inner electrode to be connected to a ground potential and a pair of split inner electrodes located at a common vertical position and spaced apart from each other with respect to a central portion of the dielectric substrate.Type: GrantFiled: March 28, 2000Date of Patent: April 9, 2002Assignee: Murata Manufacturing Co., Inc.Inventors: Eitaro Kameda, Toshiyuki Baba, Jiro Inoue, Shoichi Kawabata
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Patent number: 6111343Abstract: A piezoelectric resonator includes a base member including a plurality of laminated piezoelectric layers and internal electrodes. The adjacent piezoelectric layers are polarized in different directions with an internal electrode disposed therebetween. A groove is provided on one lateral surface of the base member, and every other internal electrode is exposed at both sides of the groove. Insulating films are disposed on unexposed portions of the internal electrodes. External electrodes are provided on both sides of the groove in the base member and are connected to the internal electrodes. As a result of this structure, the piezoelectric resonator prevents a reduction in the difference .DELTA.F between the resonant frequency and the anti-resonant frequency.Type: GrantFiled: August 20, 1998Date of Patent: August 29, 2000Assignee: Murata Manufacturing Co., Ltd.Inventors: Toshihiko Unami, Toshiyuki Baba, Toshio Nishimura, Tatsunori Kakuda
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Patent number: 6097134Abstract: A piezoelectric resonator having a small spurious resonance and a large difference .DELTA.F between the resonant frequency and the antiresonant frequency has a compact size and an external electrode has a structure which prevents damage or breaking of the external electrode. The piezoelectric resonator has a substantially rectangular-parallelepiped base member which includes a plurality of laminated piezoelectric layers. A middle portion of the piezoelectric layers is polarized in opposite directions relative to each other. On main surfaces of the middle part of the piezoelectric layers, first and second groups of inner electrodes and are exposed alternately at both side surfaces of the base member. On both side surfaces of the base member, first and second external electrodes are arranged so as to alternately connect to the first and second groups of inner electrodes.Type: GrantFiled: April 22, 1998Date of Patent: August 1, 2000Assignee: Murata Manufacturing Co., Ltd.Inventors: Shoichi Kawabata, Toshihiko Unami, Takashi Mizuguchi, Jiro Inoue, Mamoru Ogawa, Toshiyuki Baba, Toshio Nishimura
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Patent number: 6091180Abstract: A piezoelectric resonator which vibrates in a longitudinal vibration mode includes first insulating films disposed on a side surface of a base member so as to cover at least part of exposed portions of a first group of the internal electrodes and second insulating films disposed on the side surface of the base member so as to cover at least part of the exposed portions of a second group of the internal electrodes. A first thin-film external electrode extends continuously in the longitudinal direction of the base member on the first insulating films and a second thin-film external electrode extends continuously in the longitudinal direction of the base member on the second insulating film. A first conductive resin film and a second conductive resin film are respectively provided on the first thin-film external electrode and the second thin-film external electrode such that even if the thin-film external electrodes are broken or damaged, the piezoelectric resonator still functions.Type: GrantFiled: July 22, 1998Date of Patent: July 18, 2000Assignee: Murata Manufacturing Co., Ltd.Inventors: Toshihiko Unami, Toshiyuki Baba, Toshio Nishimura, Tatsunori Kakuda, Takeshi Yamazaki, Tetsuo Takeshima, Shigemasa Kusabiraki, Yutaka Kawai, Hirohide Yoshino