Abstract: A wiring substrate includes: an insulating substrate including a base portion comprising a through hole having a first opening and a second opening, and a frame portion located on the base portion; and a heat dissipator disposed on a side of the base portion that is opposite to the frame portion so as to block the second opening, wherein an inner surface of the through hole faces a side surface of the heat dissipator with a clearance being provided between the inner surface of the through hole and the side surface of the heat dissipator.

Abstract: A wiring substrate includes: an insulating substrate including a base portion comprising a through hole having a first opening and a second opening, and a frame portion located on the base portion; and a heat dissipator disposed on a side of the base portion that is opposite to the frame portion so as to block the second opening, wherein an inner surface of the through hole faces a side surface of the heat dissipator with a clearance being provided between the inner surface of the through hole and the side surface of the heat dissipator.

Abstract: A wiring substrate includes: an insulating substrate including a base portion comprising a through hole having a first opening and a second opening, and a frame portion located on the base portion; and a heat dissipator disposed on a side of the base portion that is opposite to the frame portion so as to block the second opening, wherein an inner surface of the through hole faces a side surface of the heat dissipator with a clearance being provided between the inner surface of the through hole and the side surface of the heat dissipator.

Abstract: A wiring substrate includes: an insulating substrate including a base portion comprising a through hole having a first opening and a second opening, and a frame portion located on the base portion; and a heat dissipator disposed on a side of the base portion that is opposite to the frame portion so as to block the second opening, wherein an inner surface of the through hole faces a side surface of the heat dissipator with a clearance being provided between the inner surface of the through hole and the side surface of the heat dissipator.

Abstract: A device for insulating an electrically conducting plane having a first electric potential relatively to a second electric potential is provided. The device comprises an insulating substrate including two parallel planar surfaces, a first conducting outer layer and an electrostatic field reducer. The electrostatic field reducer reduces the value of the electrostatic field in a point of the peripheral edge, the reducer includes at least one conducting area distinct from the first outer layer, positioned on the first surface of the insulating substrate and/or in the insulating substrate. The reducer reduces the value of the electrostatic field in this point relative to the value of the electrostatic field in this point in the absence of the conducting area. The conducting area has a potential with a value strictly comprised between the values of the first and second potentials.

Abstract: A device for insulating an electrically conducting plane having a first electric potential relatively to a second electric potential is provided. The device comprises an insulating substrate including two parallel planar surfaces, and a first conducting outer layer and an electrostatic field reducer. The electrostatic field reducer reduces the value of the electrostatic field in a point of the peripheral edge, the reducer includes at least one conducting area distinct from the first outer layer, positioned on the first surface of the insulating substrate and/or in the insulating substrate. The reducer reduces the value of the electrostatic field in this point relative to the value of the electrostatic field in this point in the absence of the conducting area. The conducting area has a potential with a value strictly comprised between the values of the first and second potentials.