Patents by Inventor Toshiyuki Hayashi

Toshiyuki Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110202172
    Abstract: An exemplary aspect of the invention is a rack mounting position management system including a rack having a plurality of units, and a mounted device mounted in the rack. The rack includes, for each of the units, a signal output unit that outputs a signal having a different value for each of the units of the rack. The mounted device includes a signal acquisition unit that acquires the signal output from the signal output unit, and a control unit that discriminates a mounting position of the mounted device in the rack according to a value of the signal acquired by the signal acquisition unit.
    Type: Application
    Filed: February 10, 2011
    Publication date: August 18, 2011
    Inventor: TOSHIYUKI HAYASHI
  • Publication number: 20110061833
    Abstract: The present invention has a waste heat recovery device (37) that supplies engine waste heat by way of engine coolant; a radiator (18) that dissipates engine waste heat by way of engine coolant; an exhaust gas heat exchanger (33) that supplies engine waste heat from exhaust gas to engine coolant; and a coolant pump (32) that causes engine coolant to circulate. Furthermore, the constitution is such that pressure drop equipment (34) is arranged upstream with respect to a coolant pump suction region (32b); a restrictor is arranged in a communication passage (50) between a coolant pump suction region and a region (20) vented to atmosphere; a location upstream with respect to the pressure drop equipment is made to communicate with the region vented to atmosphere; and the region vented to atmosphere is made capable of being kept in communication with atmosphere.
    Type: Application
    Filed: April 24, 2009
    Publication date: March 17, 2011
    Applicant: Yanmar Co., Ltd.
    Inventors: Hirotoshi Kihara, Shohei Amakawa, Toshiyuki Hayashi, Shojiro Matsumura
  • Publication number: 20110056453
    Abstract: In the context of an enclosure-housed engine in which an engine 10 is housed within an enclosure 2, the present invention is such that arranged in an intake chamber 8A, separate from one or more chambers where a radiator 18 and the engine are disposed, there is engine intake equipment comprising an air cleaner 22 and an intake silencer 23; the constitution being such that at least one wall face of said intake chamber is subjected to a cooling airstream, intake and exhaust of which are driven by a radiator fan; and the constitution being such that the radiator fan 19 is driven, regardless of whether or not engine coolant within the radiator is circulating, when outside air temperature is greater than or equal to a prescribed temperature.
    Type: Application
    Filed: April 24, 2009
    Publication date: March 10, 2011
    Applicant: Yanmar co., Ltd.
    Inventors: Masaaki Ono, Toshiyuki Hayashi, Hirotoshi kihara, Shojiro Matsumura
  • Patent number: 7894320
    Abstract: An optical pickup device has: a light source; an objective lens that condenses laser light emitted from the light source on a recording layer of an optical disc; and a movable lens that is disposed between the light source and the objective lens and that is movable along the optical axis. The movable lens is moved to correct for spherical aberration. Between the light source and the objective lens, a RIM intensity adjusting element is also disposed that adjusts the RIM intensity by changing the range within which, as the movable lens is moved, the intensity of the laser light incident on the objective lens can be varied.
    Type: Grant
    Filed: April 11, 2008
    Date of Patent: February 22, 2011
    Assignee: Funai Electric Co., Ltd.
    Inventor: Toshiyuki Hayashi
  • Patent number: 7839743
    Abstract: An optical disc apparatus includes an amplitude obtaining portion receiving S shaped waveform information of focus error signal from a focus error signal processing portion to obtain amplitude of the S shaped waveform and a discriminating portion discriminating kind of objective lens disposed in a light path of an optical pickup device. The discriminating portion changes controlled variable of a spherical aberration compensating element into a plurality of prescribed control values, and obtains the amplitude of S shaped waveform from an amplitude obtaining portion for each of the control values. Then the discriminating portion performs discrimination of kind of the objective lens disposed in the light path based on that a rate of change of the amplitude of S shaped waveform to change of controlled variable of the spherical aberration compensating element is different in response to kind of the objective lens.
    Type: Grant
    Filed: September 10, 2007
    Date of Patent: November 23, 2010
    Assignee: Funai Electric Co., Ltd.
    Inventor: Toshiyuki Hayashi
  • Patent number: 7513819
    Abstract: There are provided a polishing apparatus and a polishing method capable of performing polishing a work (such as a wafer) with high efficiency and high precision, a novel work holding plate effectively holding a work and an adhering method for a work capable of adhering the work on the work holding plate with high precision. The polishing apparatus comprises: a polishing table(29); and a work holding plate(38), wherein a work held on the work holding plate(38) is polished supplying a polishing agent solution(41) in the apparatus, and in polishing action, an amount of deformation of the polishing table(29) in a direction normal to an upper surface thereof with respect to the upper surface thereof and/or an amount of deformation of the work holding plate(38) in a direction normal to a work holding surface thereof is restricted to 100 m or less by forming the polishing table(29) in one-piece, contriving flow paths of cooling water and others.
    Type: Grant
    Filed: October 15, 2004
    Date of Patent: April 7, 2009
    Assignee: Shin-Eisu Handotai Co., Ltd
    Inventors: Etsuo Kiuchi, Toshiyuki Hayashi
  • Publication number: 20080267044
    Abstract: An optical pickup device has: a light source; an objective lens that condenses laser light emitted from the light source on a recording layer of an optical disc; and a movable lens that is disposed between the light source and the objective lens and that is movable along the optical axis. The movable lens is moved to correct for spherical aberration. Between the light source and the objective lens, a RIM intensity adjusting element is also disposed that adjusts the RIM intensity by changing the range within which, as the movable lens is moved, the intensity of the laser light incident on the objective lens can be varied.
    Type: Application
    Filed: April 11, 2008
    Publication date: October 30, 2008
    Inventor: Toshiyuki Hayashi
  • Patent number: 7364495
    Abstract: The present invention provides a wafer double-side polishing apparatus comprising at least a carrier plate having wafer holding holes; upper and lower turn tables to which polishing pads are attached; and a slurry supply means; with wafers held in the wafer holding holes, the carrier plate being moved between the upper and lower turn tables while supplying slurry, to simultaneously polish both front and back surfaces of wafers, wherein a PCD of upper turn table load supporting points that is a diameter of a circle joining load supporting points of the upper turn table coincides with a PCD of centers of the wafer holding holes on the carrier plate that is a diameter of a circle joining each center of the wafer holding holes on the carrier plate.
    Type: Grant
    Filed: March 26, 2003
    Date of Patent: April 29, 2008
    Assignee: Etsu Handotai Co., Ltd.
    Inventors: Hiroyoshi Tominaga, Toshiyuki Hayashi
  • Publication number: 20080062851
    Abstract: An optical disc apparatus includes an amplitude obtaining portion receiving S shaped waveform information of focus error signal from a focus error signal processing portion to obtain amplitude of the S shaped waveform and a discriminating portion discriminating kind of objective lens disposed in a light path of an optical pickup device. The discriminating portion changes controlled variable of a spherical aberration compensating element into a plurality of prescribed control values, and obtains the amplitude of S shaped waveform from an amplitude obtaining portion for each of the control values. Then the discriminating portion performs discrimination of kind of the objective lens disposed in the light path based on that a rate of change of the amplitude of S shaped waveform to change of controlled variable of the spherical aberration compensating element is different in response to kind of the objective lens.
    Type: Application
    Filed: September 10, 2007
    Publication date: March 13, 2008
    Inventor: Toshiyuki Hayashi
  • Publication number: 20050124264
    Abstract: The present invention provides a wafer double-side polishing apparatus comprising at least a carrier plate having wafer holding holes; upper and lower turn tables to which polishing pads are attached; and a slurry supply means; with wafers held in the wafer holding holes, the carrier plate being moved between the upper and lower turn tables while supplying slurry, to simultaneously polish both front and back surfaces of wafers, wherein a PCD of upper turn table load supporting points that is a diameter of a circle joining load supporting points of the upper turn table coincides with a PCD of centers of the wafer holding holes on the carrier plate that is a diameter of a circle joining each center of the wafer holding holes on the carrier plate.
    Type: Application
    Filed: March 26, 2003
    Publication date: June 9, 2005
    Applicant: SHIN-ETSU HANDOTAI CO., LTD
    Inventors: Hiroyoshi Tominaga, Toshiyuki Hayashi
  • Publication number: 20050048882
    Abstract: There are provided a polishing apparatus and a polishing method capable of performing polishing a work (such as a wafer) with high efficiency and high precision, a novel work holding plate effectively holding a work and an adhering method for a work capable of adhering the work on the work holding plate with high precision. The polishing apparatus comprises: a polishing table(29); and a work holding plate(38), wherein a work held on the work holding plate(38) is polished supplying a polishing agent solution(41) in the apparatus, and in polishing action, an amount of deformation of the polishing table(29) in a direction normal to an upper surface thereof with respect to the upper surface thereof and/or an amount of deformation of the work holding plate(38) in a direction normal to a work holding surface thereof is restricted to 100 m or less by forming the polishing table(29) in one-piece, contriving flow paths of cooling water and others.
    Type: Application
    Filed: October 15, 2004
    Publication date: March 3, 2005
    Inventors: Etsuo Kiuchi, Toshiyuki Hayashi
  • Patent number: 6827638
    Abstract: There are provided a polishing apparatus and a polishing method capable of performing polishing a work (such as a wafer) with high efficiency and high precision, a novel work holding plate effectively holding a work and an adhering method for a work capable of adhering the work on the work holding plate with high precision. The polishing apparatus comprises: a polishing table(29); and a work holding plate(38), wherein a work held on the work holding plate(38) is polished supplying a polishing agent solution(41) in the apparatus, and in polishing action, an amount of deformation of the polishing table(29) in a direction normal to an upper surface thereof with respect to the upper surface thereof and/or an amount of deformation of the work holding plate(38) in a direction normal to a work holding surface thereof is restricted to 100 &mgr;m or less by forming the polishing table(29) in one-piece, contriving flow paths of cooling water and others.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: December 7, 2004
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Etsuo Kiuchi, Toshiyuki Hayashi
  • Publication number: 20020187728
    Abstract: There are provided a polishing apparatus and a polishing method capable of performing polishing a work (such as a wafer) with high efficiency and high precision, a novel work holding plate effectively holding a work and an adhering method for a work capable of adhering the work on the work holding plate with high precision. The polishing apparatus comprises: a polishing table(29); and a work holding plate(38), wherein a work held on the work holding plate(38) is polished supplying a polishing agent solution(41) in the apparatus, and in polishing action, an amount of deformation of the polishing table(29) in a direction normal to an upper surface thereof with respect to the upper surface thereof and/or an amount of deformation of the work holding plate(38) in a direction normal to a work holding surface thereof is restricted to 100 &mgr;m or less by forming the polishing table(29) in one-piece, contriving flow paths of cooling water and others.
    Type: Application
    Filed: September 28, 2001
    Publication date: December 12, 2002
    Inventors: Etsuo Kiuchi, Toshiyuki Hayashi
  • Patent number: 5412407
    Abstract: A heat transfer recording apparatus which is arranged to transfer ink from a heat transfer printing medium to a recording medium by selective application of heat while transporting the heat transfer printing medium and the recording medium. The apparatus is provided with a winding mechanism for winding the heat transfer printing medium, a rewinding mechanism for rewinding the heat transfer printing medium, a transporting mechanism for transporting the heat transfer printing medium and the recording medium, a discharging mechanism for discharging the recording medium, a cutter for cutting the recording medium after completion of image recording, and a driving-force transmitting mechanism for selectively transmitting the driving force of a common drive source to the winding mechanism, the rewinding mechanism, the discharging mechanism, and the cutter.
    Type: Grant
    Filed: January 18, 1994
    Date of Patent: May 2, 1995
    Assignee: Canon Kabushiki Kaisha
    Inventors: Akio Okubo, Toshiyuki Hayashi, Masahiro Funakoshi
  • Patent number: 5359435
    Abstract: A facsimile apparatus, which includes a recording unit adopting serial recording type ink-jet recording means, and which can arbitrarily supply one recording sheet to the recording unit without warping (curling) a recording sheet, and has an optimal arrangement capable of decreasing the installation area, includes a main body forming the outer surface of the facsimile apparatus, the recording unit arranged in the main body; an original reader arranged in an upper portion of the main body; an original insertion port for an original, which port is formed in the upper surface of the main body; a sheet insertion port for a recording sheet, which port is formed in the upper surface of the main body; an original discharge port for the original, which port is formed in the front surface of the main body; a sheet discharge port for the recording sheet, which port is formed in the front surface of the main body; an original convey path for conveying the original from the original insertion port to the original dischar
    Type: Grant
    Filed: August 25, 1992
    Date of Patent: October 25, 1994
    Assignee: Canon Kabushiki Kaisha
    Inventors: Toshiyuki Hayashi, Takeshi Ikeda, Toshiyuki Takano, Hiroshi Ogushi
  • Patent number: 5329373
    Abstract: A facsimile apparatus, which includes a recording unit including a serial ink-jet recording head and a replaceable ink cartridge, and can arbitrarily supply one recording sheet to the recording unit when a cut sheet is used as the recording sheet.
    Type: Grant
    Filed: August 26, 1992
    Date of Patent: July 12, 1994
    Assignee: Canon Kabushiki Kaisha
    Inventors: Toshiyuki Hayashi, Toshiyuki Takano, Hiroshi Ogushi
  • Patent number: 5281977
    Abstract: There is disclosed a thermal transfer recording apparatus capable of regulating the amount of transport of ink sheet according to the selected recording sheet, thereby maintaining uniform quality of image recording. The apparatus is provided with an ink sheet transporting mechanism, a recording sheet transporting mechanism, a thermal recording head, a selector for selecting the recording sheet, and a controller for regulating the transport amount of ink sheet according to the selected recording sheet. For a recording sheet with rougher recording surface, the transport amount of ink sheet is so regulated to increase the amount of transferred ink, thereby better covering the rougher recording surface.
    Type: Grant
    Filed: February 18, 1992
    Date of Patent: January 25, 1994
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shigeharu Kurita, Toshiyuki Hayashi, Toshiyuki Takano, Masahiro Funakoshi
  • Patent number: 5041845
    Abstract: A heat transfer recording apparatus for transmitting the ink of a heat transfer medium to a recording medium to thereby record an image on the recording medium has conveying member for conveying the recording medium, winding member for winding the heat transfer medium after image recording, a cutter for cutting the recording medium after image recording, a drive source, first force transmitting member for transmitting the drive force of the drive source to the winding member and second force transmitting member for transmitting the drive force of the drive source to the cutter.
    Type: Grant
    Filed: July 11, 1990
    Date of Patent: August 20, 1991
    Assignee: Canon Kabushiki Kaisha
    Inventors: Akio Ohkubo, Toshiyuki Hayashi, Masahiro Funakoshi
  • Patent number: 3995573
    Abstract: A sewing machine in which the portion of the bed plate disposed forwardly of the needle or operating area is inclined downwardly. This perceptually brings the needle closer to the operator and provides improved visibility of the working area.
    Type: Grant
    Filed: February 17, 1976
    Date of Patent: December 7, 1976
    Assignee: Maruzen Sewing Machine Co., Ltd.
    Inventors: Teiichi Nishigami, Toshiyuki Hayashi