Abstract: A thermosetting resin composition containing a thermosetting resin, an inorganic filler, and a polymer having a mass average molecular weight of 10,000 or more, wherein the thermosetting resin composition includes boron nitride agglomerated particles as the inorganic filler, and includes an epoxy compound and a benzoxazine compound as the thermosetting resin, and a ratio of a mass content of the boron nitride agglomerated particles to a mass content of the benzoxazine compound (boron nitride agglomerated particles/benzoxazine) is 5 or more and 50 or less, a thermally conductive sheet having thermal conductivity and heat resistance can be formed. In addition, the thermosetting resin composition can be formed into a film without any problem when forming a sheet, and sufficient adhesive strength can be obtained when cured.

Abstract: A process for manufacturing resin-molded semiconductor devices which are sealed in an epoxy resin is carried out without employing a metal mold. In the process, an epoxy resin is deposited on a sub-assembly consisting of a semiconductor pellet brazed to axial leads while turning the sub-assembly with the axial leads as a center so that the epoxy resin is applied to a predetermined shape; then the epoxy resin is heated at an elevated temperature while turning the sub-assembly so that surface portions of the epoxy resin are hardened and the epoxy resin is further heated at an elevated temperature without turning the sub-assembly so that the epoxy resin is completely hardened.