Abstract: A semiconductor device includes a cylindrical main pillar that is formed on a substrate and of which a central axis is perpendicular to the surface of the substrate, source and drain diffused layers that are formed in a concentric shape centered on the central axis at upper and lower portions of the main pillar and made from a first-conduction-type material, a body layer that is formed at an intermediate portion of the main pillar sandwiched between the source and drain diffused layers and made from the first-conduction-type material, and a front gate electrode that is formed on a lateral face of the main pillar while placing a gate insulating film therebetween. Moreover, a back gate electrode made from a second-conduction-type material is formed in a pillar shape penetrating from an upper portion to a lower portion on an inner side of the main pillar.

Abstract: A semiconductor device includes a cylindrical main pillar that is formed on a substrate and of which a central axis is perpendicular to the surface of the substrate, source and drain diffused layers that are formed in a concentric shape centered on the central axis at upper and lower portions of the main pillar and made from a first-conduction-type material, a body layer that is formed at an intermediate portion of the main pillar sandwiched between the source and drain diffused layers and made from the first-conduction-type material, and a front gate electrode that is formed on a lateral face of the main pillar while placing a gate insulating film therebetween. Moreover, a back gate electrode made from a second-conduction-type material is formed in a pillar shape penetrating from an upper portion to a lower portion on an inner side of the main pillar.

Abstract: A semiconductor device includes: a semiconductor substrate having a substrate surface; a spiral body constituted by a linear semiconductor layer on which a body region including a channel region, a first source/drain region disposed on the body region, and a second source/drain region disposed under the body region or in the semiconductor substrate around the linear semiconductor layer are formed, the linear semiconductor layer being formed on the substrate surface substantially in a spiral form viewed from the substrate surface in a plan view, formed substantially in a protrudent form in a cross-sectional view, and having a pair of sidewall portions; a gate insulating film formed on at least the pair of sidewall portions constituting the linear semiconductor layer; and a gate electrode that is adjacent to the pair of sidewall portions via the gate insulating film.