Patents by Inventor Toshiyuki Isome

Toshiyuki Isome has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device fabrication method
    Patent number: 7951715
    Abstract: The method comprises the step polishing the surface of a film-to-be-polished formed over a semiconductor substrate 10 with a polishing pad while a polishing slurry containing abrasive grains, and an additive of a surfactant is being supplied onto the polishing pad 104 to thereby planarize the surface of the film-to-be-polished, and the step of further polishing the surface of the film-to-be-polished with the polishing pad while the polishing slurry and water are being supplied onto the polishing pad, after the surface of the film-to-be-polished has been planarized.
    Type: Grant
    Filed: April 14, 2004
    Date of Patent: May 31, 2011
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Takashi Watanabe, Naoki Idani, Toshiyuki Isome
  • Semiconductor device fabrication method
    Publication number: 20050026439
    Abstract: The method comprises the step polishing the surface of a film-to-be-polished formed over a semiconductor substrate 10 with a polishing pad while a polishing slurry containing abrasive grains, and an additive of a surfactant is being supplied onto the polishing pad 104 to thereby planarize the surface of the film-to-be-polished, and the step of further polishing the surface of the film-to-be-polished with the polishing pad while the polishing slurry and water are being supplied onto the polishing pad, after the surface of the film-to-be-polished has been planarized.
    Type: Application
    Filed: April 14, 2004
    Publication date: February 3, 2005
    Applicant: FUJITSU LIMITED
    Inventors: Takashi Watanabe, Naoki Idani, Toshiyuki Isome