Abstract: A multi-layer printed circuit applicable to a thermal printer head, having a plurality of parallel linear conductors with a heater and a diode in each conductors being classified into a plurality of groups and at least one end of the conductors in each group being connected together, said printed circuit comprising a first layer having an insulating substrate with a plurality of parallel linear conductors attached to said substrate, the terminated ends of the conductors in each group being arranged on an oblique line on the first layer, a second layer having a parallelogram-shape substrate portion with a plurality of parallel conductors on the surface of the same, each conductor on the second layer connecting each of the conductors in each group on the first layer to the corresponding conductors in the related group across some of the conductors on the first layer.