Patents by Inventor Toshiyuki Iwao
Toshiyuki Iwao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9035740Abstract: A circuit protecting element includes insulating substrate (11), a pair of surface electrodes (12) provided to both ends of a top face of insulating substrate (11), element (13) bridging the pair of surface electrodes (12) and electrically connected to the pair of surface electrodes (12), base layer (14) formed between element (13) and insulating substrate (11), and insulating layer (15) covering element (13). Base layer (14) is formed of a mixture of diatom earth and silicone resin. The structure discussed above allows stabilizing the blowout characteristics of the circuit protecting element.Type: GrantFiled: November 6, 2008Date of Patent: May 19, 2015Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Tomoyuki Washizaki, Toshiyuki Iwao, Takashi Kitamura, Takashi Watanabe, Naohiro Mikamoto, Masahito Fuchigami, Kazutoshi Matsumura
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Patent number: 8368502Abstract: A surface mount current fuse of the present invention includes a first base which has a recess and is smaller in width at the other end than at one end in the longitudinal direction, and a second base which has the same shape as the first base. The first base and the second base are combined to form a box-shaped body by joining the lower surface of the second base to the upper surface of the upper surface of the first base in such a manner that one end of the first base and the other end of the second base are in contact with each other. The recess of the first base and the recess of the second base form a space portion in which to dispose an element portion. The borderline between the first base and the second base passes through the center point on a side surface of the body. As a result, the surface mount current fuse has high production efficiency.Type: GrantFiled: March 14, 2007Date of Patent: February 5, 2013Assignee: Panasonic CorporationInventors: Tomoyuki Washizaki, Toshiyuki Iwao, Kenji Senda, Takashi Watanabe, Kazutoshi Matsumura, Seiji Tsuda
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Patent number: 7884698Abstract: An electronic component is provided in which: impact-absorbing layers are provided so as to cover at least the corner portions of both end portions of a base which is made of an insulating mixture of ceramic and glass; a conductive film is formed so as to cover the surface of these impact-absorbing layers and the surface of the base; the portions of this conductive film which cover the surfaces of the impact-absorbing layers are formed into electrodes; and a resistance-adjusting groove is provided in an other portion of the conductive film than the portions serving as the electrodes.Type: GrantFiled: April 30, 2004Date of Patent: February 8, 2011Assignee: Panasonic CorporationInventors: Hideki Tanaka, Tomoyuki Washizaki, Kiyoshi Ikeuchi, Toshiyuki Iwao, Yasuki Nagatomo, Kesato Iiboshi, Jiro Ota, Yasuhiro Izumi
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Publication number: 20100245028Abstract: A circuit protecting element includes insulating substrate (11), a pair of surface electrodes (12) provided to both ends of a top face of insulating substrate (11), element (13) bridging the pair of surface electrodes (12) and electrically connected to the pair of surface electrodes (12), base layer (14) formed between element (13) and insulating substrate (11), and insulating layer (15) covering element (13). Base layer (14) is formed of a mixture of diatom earth and silicone resin. The structure discussed above allows stabilizing the blowout characteristics of the circuit protecting element.Type: ApplicationFiled: November 6, 2008Publication date: September 30, 2010Inventors: Tomoyuki Washizaki, Toshiyuki Iwao, Takashi Kitamura, Takashi Watanabe, Naohiro Mikamoto, Masahito Fuchigami, Kazutoshi Matsumura
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Publication number: 20090015365Abstract: A surface mount current fuse of the present invention includes a first base which has a recess and is smaller in width at the other end than at one end in the longitudinal direction, and a second base which has the same shape as the first base. The first base and the second base are combined to form a box-shaped body by joining the lower surface of the second base to the upper surface of the upper surface of the first base in such a manner that one end of the first base and the other end of the second base are in contact with each other. The recess of the first base and the recess of the second base form a space portion in which to dispose an element portion. The borderline between the first base and the second base passes through the center point on a side surface of the body. As a result, the surface mount current fuse has high production efficiency.Type: ApplicationFiled: March 14, 2007Publication date: January 15, 2009Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Tomoyuki Washizaki, Toshiyuki Iwao, Kenji Senda, Takashi Watanabe, Kazutoshi Matsumura, Seiji Tsuda
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Patent number: 7183892Abstract: Chip PTC thermistors that can easily be inspected the soldered portions after it is mounted on a printed circuit board and that can be used in a flow soldering process, and methods of making same. A chip PTC thermistor of the present invention includes: a first main electrode and a first sub-electrode on first surface of a cuboidal form conductive polymer having the PTC characteristics, a second main electrode and a second sub-electrode on a second surface opposite the first surface of the conductive polymer. Between the first sub-electrode and the second sub-electrode, and between the first sub-electrode and the second main electrode are electrically connecting with a first side electrode and a second side electrode, respectively.Type: GrantFiled: July 19, 2004Date of Patent: February 27, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Junji Kojima, Kohichi Morimoto, Takashi Ikeda, Toshiyuki Iwao
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Publication number: 20060255897Abstract: An electronic component is provided in which: impact-absorbing layers are provided so as to cover at least the corner portions of both end portions of a base which is made of an insulating mixture of ceramic and glass; a conductive film is formed so as to cover the surface of these impact-absorbing layers and the surface of the base; the portions of this conductive film which cover the surfaces of the impact-absorbing layers are formed into electrodes; and a resistance-adjusting groove is provided in an other portion of the conductive film than the portions serving as the electrodes.Type: ApplicationFiled: April 30, 2004Publication date: November 16, 2006Inventors: Hideki Tanaka, Tomoyuki Washizaki, Kiyoshi Ikeuchi, Toshiyuki Iwao, Yasuki Nagatomo, Kesato Iiboshi, Jiro Ota, Yasuhiro Izumi
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Publication number: 20040252006Abstract: Chip PTC thermistors that can easily be inspected the soldered portions after it is mounted on a printed circuit board and that can be used in a flow soldering process, and methods of making same. A chip PTC thermistor of the present invention includes: a first main electrode and a first sub-electrode on first surface of a cuboidal form conductive polymer having the PTC characteristics, a second main electrode and a second sub-electrode on a second surface opposite the first surface of the conductive polymer. Between the first sub-electrode and the second sub-electrode, and between the first sub-electrode and the second main electrode are electrically connecting with a first side electrode and a second side electrode, respectively.Type: ApplicationFiled: July 19, 2004Publication date: December 16, 2004Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Junji Kojima, Kohichi Morimoto, Takashi Ikeda, Toshiyuki Iwao
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Patent number: 6782604Abstract: Chip PTC thermistors that can easily be inspected the soldered portions after it is mounted on a printed circuit board and that can be used in a flow soldering process, and methods of making same. A chip PTC thermistor of the present invention includes: a first main electrode and a first sub-electrode on first surface of a cuboidal form conductive polymer having the PTC characteristics, a second main electrode and a second sub-electrode on a second surface opposite the first surface of the conductive polymer. Between the first sub-electrode and the second sub-electrode, and between the first sub-electrode and the second main electrode are electrically connecting with a first side electrode and a second side electrode, respectively.Type: GrantFiled: February 16, 2000Date of Patent: August 31, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Junji Kojima, Kohichi Morimoto, Takashi Ikeda, Toshiyuki Iwao
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Patent number: 6771476Abstract: A circuit protector comprising a substrate, a conductive layer formed around the substrate, a narrowed portion formed on the conductive layer at a certain part, terminals formed at both ends of the substrate. The substrate has 1-30% pores in a unit surface area in a vicinity of its surface. The present invention also relates to a mounting structure of the circuit protector onto a circuit board.Type: GrantFiled: December 27, 2001Date of Patent: August 3, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Michio Fukuoka, Kenichi Hasegawa, Yasuki Nagatomo, Eizo Hatanaka, Hideyuki Tokada, Toshiyuki Iwao
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Patent number: 6593844Abstract: A chip PTC thermistor comprising a conductive polymer having PTC properties, a first outer electrode, a second outer electrode, one or more inner electrodes sandwiched between the conductive polymer, a first electrode electrically directly coupled with the first outer electrode, and a second electrode. The odd-numbered inner electrode among the one-or-more inner electrodes is directly coupled with the second electrode, while the even-numbered inner electrode, with the first electrode. When total number of the inner electrodes is an odd number the second outer electrode makes direct electrical contact with the first electrode, when it is an even number the second outer electrode makes direct electrical contact with the second electrode.Type: GrantFiled: June 13, 2001Date of Patent: July 15, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshiyuki Iwao, Koichi Morimoto, Kiyoshi Ikeuchi, Junji Kojima, Takashi Ikeda
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Patent number: 6556123Abstract: A chip PTC thermistor is provided which is capable of increasing the rate of increase in resistance when an overcurrent is applied, thereby increasing the breakdown voltage. The PTC thermistor comprises: a first main electrode and a first sub-electrode disposed on a first face of a conductive polymer with PTC properties; a second main electrode and a second sub-electrode disposed on a second face of the conductive polymer, which is facing the first face; and first and second side electrode and disposed on side faces of the conductive polymer. Cut-off sections are provided to the vicinity of joints of the first main electrode and the first side electrode, and joints of the second main electrode and the second side electrode.Type: GrantFiled: January 2, 2002Date of Patent: April 29, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshiyuki Iwao, Junji Kojima, Akira Tanaka, Takashi Ikeda, Kiyoshi Ikeuchi
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Patent number: 6441717Abstract: A chip polymer PTC thermistor for surface mount assembly having a superior long-term connection reliability between side electrode and main and sub electrodes. The thermister comprises; a rectangular parallelepiped conductive polymer(11) having PTC properties; a first main electrode(12a) and a first sub electrode(12b) disposed on a first face of the conductive polymer; a second main electrode(12c) and a second sub electrode(12d) disposed on a second face opposite the first face of the conductive polymer; and first and second side electrodes(13a,13b) folding around and over the entire surface of side faces of the conductive polymer, the side electrodes electrically coupling the electrodes disposed on the two faces of the conductive polymer, and a thickness of the side electrodes is not less than one twentieth of the distance between the first main electrode(12a) and the second sub electrode(12d) and the distance between the first sub electrode(12b) and second main electrode(12a,12c).Type: GrantFiled: December 15, 2000Date of Patent: August 27, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Takashi Ikeda, Kohichi Morimoto, Junji Kojima, Kiyoshi Ikeuchi, Toshiyuki Iwao
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Publication number: 20020097547Abstract: A circuit protector comprising a substrate, a conductive layer formed around the substrate, a narrowed portion formed on the conductive layer at a certain part, terminals formed at both ends of the substrate. The substrate has 1-30 % pores in a unit surface area in a vicinity of its surface. The present invention also relates to a mounting structure of the circuit protector onto a circuit board.Type: ApplicationFiled: December 27, 2001Publication date: July 25, 2002Inventors: Michio Fukuoka, Kenichi Hasegawa, Yasuki Nagatomo, Eizo Hatanaka, Hideyuki Tokada, Toshiyuki Iwao
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Publication number: 20020021203Abstract: Chip PTC thermistors that can easily be inspected the soldered portions after it is mounted on a printed circuit board and that can be used in a flow soldering process, and methods of making same. A chip PTC thermistor of the present invention includes: a first main electrode and a first sub-electrode on first surface of a cuboidal form conductive polymer having the PTC characteristics, a second main electrode and a second sub-electrode on a second surface opposite the first surface of the conductive polymer. Between the first sub-electrode and the second sub-electrode, and between the first sub-electrode and the second main electrode are electrically connecting with a first side electrode and a second side electrode, respectively.Type: ApplicationFiled: February 16, 2000Publication date: February 21, 2002Inventors: JUNJI KOJIMA, KOHICHI MORIMOTO, TAKASHI IKEDA, TOSHIYUKI IWAO
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Patent number: 6348852Abstract: The PTC thermistor chip of the present invention comprises a conductive polymer having PTC properties, a first outer electrode, a second outer layer electrode, not less than one inner electrode sandwiched between the conductive polymer, a first electrode electrically directly coupled with the first outer electrode, and a second electrode disposed electrically independently from the first electrode. When counting from one of the inner electrodes closest to the first outer layer electrode, and defining the inner layer electrode in a “n”th position as the “n”th inner electrode, the odd-numbered inner layer electrodes are directly coupled with the second electrode and the even-numbered inner layer electrodes, with the first electrode. In this PTC thermistor, the cross sections where the odd-numbered and even numbered inner electrodes are respectively in contact with the second and first electrodes are thicker than the other sections.Type: GrantFiled: June 7, 2001Date of Patent: February 19, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Junji Kojima, Kiyoshi Ikeuchi, Takashi Ikeda, Koichi Morimoto, Toshiyuki Iwao
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Patent number: 5829468Abstract: A valve device using pipe materials in which a fluid control mechanism is arranged and which comprises a valve device body (11) made of a metallic pipe material and having a tubular flange (21) integrally formed on the outer surface of the body so as to protrude therefrom, and a tubular member (12) for forming a flow passage, which is fitted and connected at the base end thereof to the top end of the tubular flange (21). The tubular flange (21) is formed so that the area of the opening at the base end thereof communicating with the flow passage within the valve device body is greater than the area of the opening at the top end of the tubular flange. The inner peripheral portion (21a) of the base end of the tubular flange (21) is formed with a smoothly curved surface, and the flow passage is formed along such a curved surface.Type: GrantFiled: May 22, 1995Date of Patent: November 3, 1998Assignee: Toto Ltd.Inventors: Hachihei Watanabe, Masatoshi Enoki, Katsuaki Nakamura, Tatsuo Matsukuma, Tsuguya Okubo, Akira Yubisui, Takayoshi Yanagida, Hiromi Katahira, Toshiyuki Iwao, Yuji Matsuo