Patents by Inventor Toshiyuki Kai

Toshiyuki Kai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240072203
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicants: SemiLEDs Corporation, SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
  • Patent number: 8809476
    Abstract: A polymer includes a repeating unit shown by a following general formula (1). R1 represents a hydrogen atom, a methyl group, a fluorine atom, or a trifluoromethyl group. R2 represents a substituted or unsubstituted aryl group having 6 to 22 carbon atoms. Y represents a carbon atom. X represents an atomic group that forms an alicyclic hydrocarbon group together with Y.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: August 19, 2014
    Assignee: JSR Corporation
    Inventors: Ken Maruyama, Toshiyuki Kai
  • Patent number: 8771923
    Abstract: A radiation-sensitive composition includes a low-molecular-weight compound, a solvent and a radiation-sensitive acid-generator other than the low-molecular-weight compound. The low-molecular-weight compound has one or more acid-dissociable groups which decompose by an action of an acid to enhance solubility in an alkaline developing solution and one or more radiation-sensitive acid-generating groups which generate an acid upon application of an active ray or radiation per molecule. The low-molecular-weight compound has a polystyrene-reduced number-average molecular weight (Mn) measured by gel permeation chromatography (GPC) of 500 to 4,000. The low-molecular-weight compound is not obtained from chain growth polymerization of a monomer with an unsaturated bond. A content of the low-molecular-weight compound is 80 mass % or more of 100 mass % of a total solid component of the radiation-sensitive composition. The low-molecular-weight compound is a compound shown by a following formula (1).
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: July 8, 2014
    Assignee: JSR Corporation
    Inventors: Nobuji Matsumura, Daisuke Shimizu, Toshiyuki Kai
  • Patent number: 8470513
    Abstract: A radiation-sensitive resin composition includes a polymer that includes at least one repeating unit (i) selected from a repeating unit shown by a formula (1), (2), and (3); and a repeating unit (ii) shown by a formula (4). R1 represents a hydrogen atom or a methyl group. Each R2 independently represents one of a linear or branched alkyl group having 1 to 12 carbon atoms, a linear or branched alkoxy group having 1 to 12 carbon atoms, and an alicyclic hydrocarbon group having 3 to 25 carbon atoms. p is an integer from 0 to 3, and q is an integer from 1 to 3, and p+q?5. A chemically-amplified positive-tone resist film that is sensitive to extreme ultraviolet rays (EUV) can be formed using the radiation-sensitive resin composition.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: June 25, 2013
    Assignee: JSR Corporation
    Inventors: Kota Nishino, Ken Maruyama, Daisuke Shimizu, Toshiyuki Kai
  • Patent number: 8450045
    Abstract: A pattern forming method includes providing and curing a under-layer film containing a radiation-sensitive acid generator which generates an acid upon exposure to radiation on a substrate. The under-layer film is irradiated with radiation through a mask to cause an acid to be selectively generated in an exposed area of the under-layer film. An upper-layer film which does not contain a radiation-sensitive acid generator and which contains a composition capable of polymerizing or crosslinking by an action of an acid is provided. A cured film is provided by polymerization or crosslinking selectively in an area of the upper-layer film corresponding to the exposed area of the under-layer film in which the acid has been generated. An area of the upper-layer film corresponding to an area of the under-layer film in which the acid has not been generated is removed.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: May 28, 2013
    Assignee: JSR Corporation
    Inventors: Hikaru Sugita, Nobuji Matsumura, Daisuke Shimizu, Toshiyuki Kai, Tsutomu Shimokawa
  • Patent number: 8377627
    Abstract: A compound shown by the following formula (1).
    Type: Grant
    Filed: July 30, 2008
    Date of Patent: February 19, 2013
    Assignee: JSR Corporation
    Inventors: Daisuke Shimizu, Ken Maruyama, Toshiyuki Kai, Tsutomu Shimokawa
  • Patent number: 8361691
    Abstract: A radiation-sensitive composition contains (A) a low-molecular-weight compound having one or more acid-dissociable groups which decompose by the action of an acid to enhance solubility in an alkaline developing solution and one or more radiation-sensitive acid-generating groups which generate an acid upon application of an active ray or radiation per molecule, and having a polystyrene-reduced number-average molecular weight (Mn) measured by gel permeation chromatography (GPC) of 500 to 4,000, and (B) a solvent.
    Type: Grant
    Filed: August 28, 2007
    Date of Patent: January 29, 2013
    Assignee: JSR Corporation
    Inventors: Nobuji Matsumura, Daisuke Shimizu, Toshiyuki Kai
  • Patent number: 8334087
    Abstract: A radiation-sensitive composition includes (A) an acid-dissociable group-containing polymer, and (B) a radiation-sensitive acid generator. The acid-dissociable group-containing polymer (A) includes a polymer that includes a repeating unit shown by a general formula (1) in which R1 represents a hydrogen atom, a methyl group, a fluorine atom, or a trifluoromethyl group, R2 represents a substituted or unsubstituted aryl group having 6 to 22 carbon atoms, Y represents a carbon atom, and X represents an atomic group that forms an alicyclic hydrocarbon group together with Y.
    Type: Grant
    Filed: July 12, 2010
    Date of Patent: December 18, 2012
    Assignee: JSR Corporation
    Inventors: Ken Maruyama, Toshiyuki Kai
  • Publication number: 20120122036
    Abstract: A pattern forming method includes providing and curing a under-layer film containing a radiation-sensitive acid generator which generates an acid upon exposure to radiation on a substrate. The under-layer film is irradiated with radiation through a mask to cause an acid to be selectively generated in an exposed area of the under-layer film. An upper-layer film which does not contain a radiation-sensitive acid generator and which contains a composition capable of polymerizing or crosslinking by an action of an acid is provided. A cured film is provided by polymerization or crosslinking selectively in an area of the upper-layer film corresponding to the exposed area of the under-layer film in which the acid has been generated. An area of the upper-layer film corresponding to an area of the under-layer film in which the acid has not been generated is removed.
    Type: Application
    Filed: January 18, 2012
    Publication date: May 17, 2012
    Applicant: JSR Corporation
    Inventors: Hikaru SUGITA, Nobuji MATSUMURA, Daisuke SHIMIZU, Toshiyuki KAI, Tsutomu SHIMOKAWA
  • Patent number: 8173351
    Abstract: A compound shown by the following formula (1) can be used as a material for a radiation-sensitive composition capable of forming a resist film which effectively responds to electron beams or the like, exhibits low roughness, and can form a high precision minute pattern in a stable manner.
    Type: Grant
    Filed: January 8, 2008
    Date of Patent: May 8, 2012
    Assignee: JSR Corporation
    Inventors: Daisuke Shimizu, Ken Maruyama, Toshiyuki Kai, Tsutomu Shimokawa
  • Patent number: 8173348
    Abstract: A method for forming a pattern contains (1) a step of forming an underlayer film containing (A) a radiation-sensitive acid generator capable of generating an acid upon exposure to radiation rays or (B) a radiation-sensitive base generator capable of generating a base upon exposure to radiation rays on a substrate; (2) a step of irradiating the underlayer film with radiation rays through a mask with a predetermined pattern to obtain an exposed underlayer film portion having been selectively exposed through the predetermined pattern; (3) a step of forming (C) an organic thin film on the underlayer film so as to attain chemical bonding of the exposed underlayer film portion with the organic thin-film formed on the exposed underlayer film portion; and (4) a step of removing the organic thin film formed on areas of the underlayer film other than the exposed underlayer film portion.
    Type: Grant
    Filed: June 21, 2007
    Date of Patent: May 8, 2012
    Assignee: JSR Corporation
    Inventors: Daisuke Shimizu, Hikaru Sugita, Nobuji Matsumura, Toshiyuki Kai, Tsutomu Shimokawa
  • Publication number: 20120058429
    Abstract: A radiation-sensitive resin composition includes a polymer that includes at least one repeating unit (i) selected from a repeating unit shown by a formula (1), (2), and (3); and a repeating unit (ii) shown by a formula (4). R1 represents a hydrogen atom or a methyl group. Each R2 independently represents one of a linear or branched alkyl group having 1 to 12 carbon atoms, a linear or branched alkoxy group having 1 to 12 carbon atoms, and an alicyclic hydrocarbon group having 3 to 25 carbon atoms. p is an integer from 0 to 3, and q is an integer from 1 to 3, and p+q?5. A chemically-amplified positive-tone resist film that is sensitive to extreme ultraviolet rays (EUV) can be formed using the radiation-sensitive resin composition.
    Type: Application
    Filed: September 23, 2011
    Publication date: March 8, 2012
    Applicant: JSR CORPORATION
    Inventors: Kota Nishino, Ken Maruyama, Daisuke Shimizu, Toshiyuki Kai
  • Patent number: 8119324
    Abstract: A pattern formation method suitable for forming micro-patterns using electron beams (EB), X-rays, or extreme ultraviolet radiation (EUV) is provided.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: February 21, 2012
    Assignee: JSR Corporation
    Inventors: Hikaru Sugita, Nobuji Matsumura, Daisuke Shimizu, Toshiyuki Kai, Tsutomu Shimokawa
  • Patent number: 8067034
    Abstract: Disclosed are agents for phase-adjusting or enhancing the amplitude of an endogenous melatonin secretion rhythm and for improving a circadian rhythm, as well as functional food containing such an agent, which may prevent or ameliorate various symptoms, such as sleep disorder or prolonged sleep latency. The agent contains whey as the active component.
    Type: Grant
    Filed: December 7, 2007
    Date of Patent: November 29, 2011
    Assignee: CALPIS Co., Ltd
    Inventors: Yoshinori Moriyama, Seiji Tsuboi, Akihiro Masuyama, Toshiaki Takano, Keita Ueno, Toshiyuki Kai
  • Publication number: 20110117489
    Abstract: A compound shown by the following formula (1).
    Type: Application
    Filed: July 30, 2008
    Publication date: May 19, 2011
    Applicant: JSR Corporation
    Inventors: Daisuke Shimizu, Ken Maruyama, Toshiyuki Kai, Tsutomu Shimokawa
  • Publication number: 20100310987
    Abstract: A radiation-sensitive composition includes (A) an acid-dissociable group-containing polymer, and (B) a radiation-sensitive acid generator. The acid-dissociable group-containing polymer (A) includes a polymer that includes a repeating unit shown by a general formula (1) in which R1 represents a hydrogen atom, a methyl group, a fluorine atom, or a trifluoromethyl group, R2 represents a substituted or unsubstituted aryl group having 6 to 22 carbon atoms, Y represents a carbon atom, and X represents an atomic group that forms an alicyclic hydrocarbon group together with Y.
    Type: Application
    Filed: July 12, 2010
    Publication date: December 9, 2010
    Applicant: JSR Corporation
    Inventors: Ken MARUYAMA, Toshiyuki Kai
  • Publication number: 20100233635
    Abstract: A method for forming a pattern contains (1) a step of forming an underlayer film containing (A) a radiation-sensitive acid generator capable of generating an acid upon exposure to radiation rays or (B) a radiation-sensitive base generator capable of generating a base upon exposure to radiation rays on a substrate; (2) a step of irradiating the underlayer film with radiation rays through a mask with a predetermined pattern to obtain an exposed underlayer film portion having been selectively exposed through the predetermined pattern; (3) a step of forming (C) an organic thin film on the underlayer film so as to attain chemical bonding of the exposed underlayer film portion with the organic thin-film formed on the exposed underlayer film portion; and (4) a step of removing the organic thin film formed on areas of the underlayer film other than the exposed underlayer film portion.
    Type: Application
    Filed: June 21, 2007
    Publication date: September 16, 2010
    Applicant: JSR Corporation
    Inventors: Daisuke Shimizu, Hikaru Sugita, Nobuji Matsumura, Toshiyuki Kai, Tsutomu Shimokawa
  • Publication number: 20090311622
    Abstract: A pattern formation method suitable for forming micro-patterns using electron beams (EB), X-rays, or extreme ultraviolet radiation (EUV) is provided.
    Type: Application
    Filed: July 27, 2007
    Publication date: December 17, 2009
    Applicant: JSR CORPORATION
    Inventors: Hikaru Sugita, Nobuji Matsumura, Daisuke Shimizu, Toshiyuki Kai, Tsutomu Shimokawa
  • Publication number: 20090280433
    Abstract: A radiation-sensitive composition contains (A) a low-molecular-weight compound having one or more acid-dissociable groups which decompose by the action of an acid to enhance solubility in an alkaline developing solution and one or more radiation-sensitive acid-generating groups which generate an acid upon application of an active ray or radiation per molecule, and having a polystyrene-reduced number-average molecular weight (Mn) measured by gel permeation chromatography (GPC) of 500 to 4,000, and (B) a solvent.
    Type: Application
    Filed: August 28, 2007
    Publication date: November 12, 2009
    Applicant: JSR Corporation
    Inventors: Nobuji Matsumura, Daisuke Shimizu, Toshiyuki Kai
  • Publication number: 20090274977
    Abstract: A compound shown by the following formula (1) can be used as a material for a radiation-sensitive composition capable of forming a resist film which effectively responds to electron beams or the like, exhibits low roughness, and can form a high precision minute pattern in a stable manner.
    Type: Application
    Filed: January 8, 2008
    Publication date: November 5, 2009
    Inventors: Daisuke Shimizu, Ken Maruyama, Toshiyuki Kai, Tsutomu Shimokawa