Patents by Inventor Toshiyuki Kai
Toshiyuki Kai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240072203Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.Type: ApplicationFiled: November 6, 2023Publication date: February 29, 2024Applicants: SemiLEDs Corporation, SHIN-ETSU CHEMICAL CO., LTD.Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
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Patent number: 8809476Abstract: A polymer includes a repeating unit shown by a following general formula (1). R1 represents a hydrogen atom, a methyl group, a fluorine atom, or a trifluoromethyl group. R2 represents a substituted or unsubstituted aryl group having 6 to 22 carbon atoms. Y represents a carbon atom. X represents an atomic group that forms an alicyclic hydrocarbon group together with Y.Type: GrantFiled: October 24, 2012Date of Patent: August 19, 2014Assignee: JSR CorporationInventors: Ken Maruyama, Toshiyuki Kai
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Patent number: 8771923Abstract: A radiation-sensitive composition includes a low-molecular-weight compound, a solvent and a radiation-sensitive acid-generator other than the low-molecular-weight compound. The low-molecular-weight compound has one or more acid-dissociable groups which decompose by an action of an acid to enhance solubility in an alkaline developing solution and one or more radiation-sensitive acid-generating groups which generate an acid upon application of an active ray or radiation per molecule. The low-molecular-weight compound has a polystyrene-reduced number-average molecular weight (Mn) measured by gel permeation chromatography (GPC) of 500 to 4,000. The low-molecular-weight compound is not obtained from chain growth polymerization of a monomer with an unsaturated bond. A content of the low-molecular-weight compound is 80 mass % or more of 100 mass % of a total solid component of the radiation-sensitive composition. The low-molecular-weight compound is a compound shown by a following formula (1).Type: GrantFiled: December 19, 2012Date of Patent: July 8, 2014Assignee: JSR CorporationInventors: Nobuji Matsumura, Daisuke Shimizu, Toshiyuki Kai
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Patent number: 8470513Abstract: A radiation-sensitive resin composition includes a polymer that includes at least one repeating unit (i) selected from a repeating unit shown by a formula (1), (2), and (3); and a repeating unit (ii) shown by a formula (4). R1 represents a hydrogen atom or a methyl group. Each R2 independently represents one of a linear or branched alkyl group having 1 to 12 carbon atoms, a linear or branched alkoxy group having 1 to 12 carbon atoms, and an alicyclic hydrocarbon group having 3 to 25 carbon atoms. p is an integer from 0 to 3, and q is an integer from 1 to 3, and p+q?5. A chemically-amplified positive-tone resist film that is sensitive to extreme ultraviolet rays (EUV) can be formed using the radiation-sensitive resin composition.Type: GrantFiled: September 23, 2011Date of Patent: June 25, 2013Assignee: JSR CorporationInventors: Kota Nishino, Ken Maruyama, Daisuke Shimizu, Toshiyuki Kai
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Patent number: 8450045Abstract: A pattern forming method includes providing and curing a under-layer film containing a radiation-sensitive acid generator which generates an acid upon exposure to radiation on a substrate. The under-layer film is irradiated with radiation through a mask to cause an acid to be selectively generated in an exposed area of the under-layer film. An upper-layer film which does not contain a radiation-sensitive acid generator and which contains a composition capable of polymerizing or crosslinking by an action of an acid is provided. A cured film is provided by polymerization or crosslinking selectively in an area of the upper-layer film corresponding to the exposed area of the under-layer film in which the acid has been generated. An area of the upper-layer film corresponding to an area of the under-layer film in which the acid has not been generated is removed.Type: GrantFiled: January 18, 2012Date of Patent: May 28, 2013Assignee: JSR CorporationInventors: Hikaru Sugita, Nobuji Matsumura, Daisuke Shimizu, Toshiyuki Kai, Tsutomu Shimokawa
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Patent number: 8377627Abstract: A compound shown by the following formula (1).Type: GrantFiled: July 30, 2008Date of Patent: February 19, 2013Assignee: JSR CorporationInventors: Daisuke Shimizu, Ken Maruyama, Toshiyuki Kai, Tsutomu Shimokawa
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Patent number: 8361691Abstract: A radiation-sensitive composition contains (A) a low-molecular-weight compound having one or more acid-dissociable groups which decompose by the action of an acid to enhance solubility in an alkaline developing solution and one or more radiation-sensitive acid-generating groups which generate an acid upon application of an active ray or radiation per molecule, and having a polystyrene-reduced number-average molecular weight (Mn) measured by gel permeation chromatography (GPC) of 500 to 4,000, and (B) a solvent.Type: GrantFiled: August 28, 2007Date of Patent: January 29, 2013Assignee: JSR CorporationInventors: Nobuji Matsumura, Daisuke Shimizu, Toshiyuki Kai
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Patent number: 8334087Abstract: A radiation-sensitive composition includes (A) an acid-dissociable group-containing polymer, and (B) a radiation-sensitive acid generator. The acid-dissociable group-containing polymer (A) includes a polymer that includes a repeating unit shown by a general formula (1) in which R1 represents a hydrogen atom, a methyl group, a fluorine atom, or a trifluoromethyl group, R2 represents a substituted or unsubstituted aryl group having 6 to 22 carbon atoms, Y represents a carbon atom, and X represents an atomic group that forms an alicyclic hydrocarbon group together with Y.Type: GrantFiled: July 12, 2010Date of Patent: December 18, 2012Assignee: JSR CorporationInventors: Ken Maruyama, Toshiyuki Kai
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Publication number: 20120122036Abstract: A pattern forming method includes providing and curing a under-layer film containing a radiation-sensitive acid generator which generates an acid upon exposure to radiation on a substrate. The under-layer film is irradiated with radiation through a mask to cause an acid to be selectively generated in an exposed area of the under-layer film. An upper-layer film which does not contain a radiation-sensitive acid generator and which contains a composition capable of polymerizing or crosslinking by an action of an acid is provided. A cured film is provided by polymerization or crosslinking selectively in an area of the upper-layer film corresponding to the exposed area of the under-layer film in which the acid has been generated. An area of the upper-layer film corresponding to an area of the under-layer film in which the acid has not been generated is removed.Type: ApplicationFiled: January 18, 2012Publication date: May 17, 2012Applicant: JSR CorporationInventors: Hikaru SUGITA, Nobuji MATSUMURA, Daisuke SHIMIZU, Toshiyuki KAI, Tsutomu SHIMOKAWA
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Patent number: 8173351Abstract: A compound shown by the following formula (1) can be used as a material for a radiation-sensitive composition capable of forming a resist film which effectively responds to electron beams or the like, exhibits low roughness, and can form a high precision minute pattern in a stable manner.Type: GrantFiled: January 8, 2008Date of Patent: May 8, 2012Assignee: JSR CorporationInventors: Daisuke Shimizu, Ken Maruyama, Toshiyuki Kai, Tsutomu Shimokawa
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Patent number: 8173348Abstract: A method for forming a pattern contains (1) a step of forming an underlayer film containing (A) a radiation-sensitive acid generator capable of generating an acid upon exposure to radiation rays or (B) a radiation-sensitive base generator capable of generating a base upon exposure to radiation rays on a substrate; (2) a step of irradiating the underlayer film with radiation rays through a mask with a predetermined pattern to obtain an exposed underlayer film portion having been selectively exposed through the predetermined pattern; (3) a step of forming (C) an organic thin film on the underlayer film so as to attain chemical bonding of the exposed underlayer film portion with the organic thin-film formed on the exposed underlayer film portion; and (4) a step of removing the organic thin film formed on areas of the underlayer film other than the exposed underlayer film portion.Type: GrantFiled: June 21, 2007Date of Patent: May 8, 2012Assignee: JSR CorporationInventors: Daisuke Shimizu, Hikaru Sugita, Nobuji Matsumura, Toshiyuki Kai, Tsutomu Shimokawa
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Publication number: 20120058429Abstract: A radiation-sensitive resin composition includes a polymer that includes at least one repeating unit (i) selected from a repeating unit shown by a formula (1), (2), and (3); and a repeating unit (ii) shown by a formula (4). R1 represents a hydrogen atom or a methyl group. Each R2 independently represents one of a linear or branched alkyl group having 1 to 12 carbon atoms, a linear or branched alkoxy group having 1 to 12 carbon atoms, and an alicyclic hydrocarbon group having 3 to 25 carbon atoms. p is an integer from 0 to 3, and q is an integer from 1 to 3, and p+q?5. A chemically-amplified positive-tone resist film that is sensitive to extreme ultraviolet rays (EUV) can be formed using the radiation-sensitive resin composition.Type: ApplicationFiled: September 23, 2011Publication date: March 8, 2012Applicant: JSR CORPORATIONInventors: Kota Nishino, Ken Maruyama, Daisuke Shimizu, Toshiyuki Kai
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Patent number: 8119324Abstract: A pattern formation method suitable for forming micro-patterns using electron beams (EB), X-rays, or extreme ultraviolet radiation (EUV) is provided.Type: GrantFiled: July 27, 2007Date of Patent: February 21, 2012Assignee: JSR CorporationInventors: Hikaru Sugita, Nobuji Matsumura, Daisuke Shimizu, Toshiyuki Kai, Tsutomu Shimokawa
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Patent number: 8067034Abstract: Disclosed are agents for phase-adjusting or enhancing the amplitude of an endogenous melatonin secretion rhythm and for improving a circadian rhythm, as well as functional food containing such an agent, which may prevent or ameliorate various symptoms, such as sleep disorder or prolonged sleep latency. The agent contains whey as the active component.Type: GrantFiled: December 7, 2007Date of Patent: November 29, 2011Assignee: CALPIS Co., LtdInventors: Yoshinori Moriyama, Seiji Tsuboi, Akihiro Masuyama, Toshiaki Takano, Keita Ueno, Toshiyuki Kai
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Publication number: 20110117489Abstract: A compound shown by the following formula (1).Type: ApplicationFiled: July 30, 2008Publication date: May 19, 2011Applicant: JSR CorporationInventors: Daisuke Shimizu, Ken Maruyama, Toshiyuki Kai, Tsutomu Shimokawa
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Publication number: 20100310987Abstract: A radiation-sensitive composition includes (A) an acid-dissociable group-containing polymer, and (B) a radiation-sensitive acid generator. The acid-dissociable group-containing polymer (A) includes a polymer that includes a repeating unit shown by a general formula (1) in which R1 represents a hydrogen atom, a methyl group, a fluorine atom, or a trifluoromethyl group, R2 represents a substituted or unsubstituted aryl group having 6 to 22 carbon atoms, Y represents a carbon atom, and X represents an atomic group that forms an alicyclic hydrocarbon group together with Y.Type: ApplicationFiled: July 12, 2010Publication date: December 9, 2010Applicant: JSR CorporationInventors: Ken MARUYAMA, Toshiyuki Kai
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Publication number: 20100233635Abstract: A method for forming a pattern contains (1) a step of forming an underlayer film containing (A) a radiation-sensitive acid generator capable of generating an acid upon exposure to radiation rays or (B) a radiation-sensitive base generator capable of generating a base upon exposure to radiation rays on a substrate; (2) a step of irradiating the underlayer film with radiation rays through a mask with a predetermined pattern to obtain an exposed underlayer film portion having been selectively exposed through the predetermined pattern; (3) a step of forming (C) an organic thin film on the underlayer film so as to attain chemical bonding of the exposed underlayer film portion with the organic thin-film formed on the exposed underlayer film portion; and (4) a step of removing the organic thin film formed on areas of the underlayer film other than the exposed underlayer film portion.Type: ApplicationFiled: June 21, 2007Publication date: September 16, 2010Applicant: JSR CorporationInventors: Daisuke Shimizu, Hikaru Sugita, Nobuji Matsumura, Toshiyuki Kai, Tsutomu Shimokawa
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Publication number: 20090311622Abstract: A pattern formation method suitable for forming micro-patterns using electron beams (EB), X-rays, or extreme ultraviolet radiation (EUV) is provided.Type: ApplicationFiled: July 27, 2007Publication date: December 17, 2009Applicant: JSR CORPORATIONInventors: Hikaru Sugita, Nobuji Matsumura, Daisuke Shimizu, Toshiyuki Kai, Tsutomu Shimokawa
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Publication number: 20090280433Abstract: A radiation-sensitive composition contains (A) a low-molecular-weight compound having one or more acid-dissociable groups which decompose by the action of an acid to enhance solubility in an alkaline developing solution and one or more radiation-sensitive acid-generating groups which generate an acid upon application of an active ray or radiation per molecule, and having a polystyrene-reduced number-average molecular weight (Mn) measured by gel permeation chromatography (GPC) of 500 to 4,000, and (B) a solvent.Type: ApplicationFiled: August 28, 2007Publication date: November 12, 2009Applicant: JSR CorporationInventors: Nobuji Matsumura, Daisuke Shimizu, Toshiyuki Kai
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Publication number: 20090274977Abstract: A compound shown by the following formula (1) can be used as a material for a radiation-sensitive composition capable of forming a resist film which effectively responds to electron beams or the like, exhibits low roughness, and can form a high precision minute pattern in a stable manner.Type: ApplicationFiled: January 8, 2008Publication date: November 5, 2009Inventors: Daisuke Shimizu, Ken Maruyama, Toshiyuki Kai, Tsutomu Shimokawa