Patents by Inventor Toshiyuki Kajihara

Toshiyuki Kajihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of surface treatment of copper foil or a copper clad laminate for internal layer
    Patent number: 4981560
    Abstract: The surface of copper foil or a copper clad laminate for an internal layer is subjected to electrolysis in an aqueous solution containing diethylenetriamine pentacetic acid and copper ion by using the copper foil or a copper clad laminate for the internal layer as the cathode.
    Type: Grant
    Filed: March 23, 1989
    Date of Patent: January 1, 1991
    Assignee: Fukuda Metal Foil & Powder Industrial Co., Ltd.
    Inventors: Toshiyuki Kajihara, Katsuhito Fukuda, Masato Takami