Patents by Inventor Toshiyuki Karasawa

Toshiyuki Karasawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE MANUFACTURE METHOD PREVENTING DISHING AND EROSION DURING CHEMICAL MECHANICAL POLISHING
    Publication number: 20030228765
    Abstract: A first insulating film is formed on an underlying substrate, the first insulating film being made of a first insulating material. A second insulating film is formed on the first insulating film, the second insulating film being made of a second insulating material different from the first insulating material. A trench is formed through the second and first insulating film, the trench reaching at least an intermediate depth of the first insulating film. A wiring layer made of a conductive material is deposited on the second insulating film, the wiring layer burying the trench. The wiring layer is polished to leave the wiring layer in the trench. The wiring layer and second insulating film are polished until the first insulating film is exposed. Irregularity such as dishing and erosion can be suppressed from being formed.
    Type: Application
    Filed: December 23, 2002
    Publication date: December 11, 2003
    Applicant: Fujitsu Limited
    Inventors: Motoshu Miyajima, Toshiyuki Karasawa, Tsutomu Hosoda, Satoshi Otsuka