Patents by Inventor Toshiyuki Kasuga

Toshiyuki Kasuga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plating apparatus and plating method
    Patent number: 8721863
    Abstract: A method for plating a belt substrate including conveying a belt substrate through a plating tank, contacting an immersed cathode power-supply device and/or an auxiliary cathode power-supply device with the belt substrate conveyed into the interior of the plating tank such that the belt substrate becomes a cathode, and electrically plating a surface of the belt substrate in the interior of the plating tank while the immersed cathode power-supply device and/or the auxiliary cathode power-supply device maintains cathode power-supply to the belt substrate conveyed into the interior portion of the plating tank. The immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned in the interior portion of the plating tank and are electrically connected by a short circuit wiring.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: May 13, 2014
    Assignee: Ibiden Co., Ltd.
    Inventors: Yasuaki Tachi, Shigeki Sawa, Toshiyuki Kasuga
  • PLATING APPARATUS AND PLATING METHOD
    Publication number: 20120073977
    Abstract: A method for plating a belt substrate including conveying a belt substrate through a plating tank, contacting an immersed cathode power-supply device and/or an auxiliary cathode power-supply device with the belt substrate conveyed into the interior of the plating tank such that the belt substrate becomes a cathode, and electrically plating a surface of the belt substrate in the interior of the plating tank while the immersed cathode power-supply device and/or the auxiliary cathode power-supply device maintains cathode power-supply to the belt substrate conveyed into the interior portion of the plating tank. The immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned in the interior portion of the plating tank and are electrically connected by a short circuit wiring.
    Type: Application
    Filed: November 30, 2011
    Publication date: March 29, 2012
    Applicant: IBIDEN CO., LTD
    Inventors: Yasuaki TACHI, Shigeki Sawa, Toshiyuki Kasuga
  • Plating apparatus and plating method
    Patent number: 8128790
    Abstract: An apparatus that performs an electrolytic plating on a plating surface of a belt substrate is provided. The apparatus includes a plating tank, a conveyor device configured to carry a belt substrate through an interior of the plating tank, an immersed cathode power-supply section provided within the interior of the plating tank, an auxiliary cathode power-supply section provided within the interior of the plating tank, and short-circuit wiring configured to short-circuit the immersed cathode power-supply section to the auxiliary cathode power-supply section. A plating method for performing electrolytic plating on a plating surface of a belt substrate is provided.
    Type: Grant
    Filed: July 30, 2008
    Date of Patent: March 6, 2012
    Assignee: Ibiden Co., Ltd.
    Inventors: Yasuaki Tachi, Shigeki Sawa, Toshiyuki Kasuga
  • PLATING APPARATUS AND PLATING METHOD
    Publication number: 20090032404
    Abstract: An apparatus that performs an electrolytic plating on a plating surface of a belt substrate is provided. The apparatus includes a plating tank, a conveyor device configured to carry a belt substrate through an interior of the plating tank, an immersed cathode power-supply section provided within the interior of the plating tank, an auxiliary cathode power-supply section provided within the interior of the plating tank, and short-circuit wiring configured to short-circuit the immersed cathode power-supply section to the auxiliary cathode power-supply section. A plating method for performing electrolytic plating on a plating surface of a belt substrate is provided.
    Type: Application
    Filed: July 30, 2008
    Publication date: February 5, 2009
    Applicant: IBIDEN CO., LTD.
    Inventors: Yasuaki Tachi, Shigeki Sawa, Toshiyuki Kasuga