Patents by Inventor Toshiyuki Kawaguchi

Toshiyuki Kawaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240091126
    Abstract: Base coat as an example of a resin composition for a cosmetic is a resin composition for a cosmetic used in a cosmetic to be adhered to nail as a part of living body. The resin composition for a cosmetic includes a stimulus-responsive material that undergoes a volume change by external stimuli, the external stimuli excluding both an external stimulus due to contact with a solvent and an external stimulus due to contact with a solution, and a solidified matter of the resin composition for a cosmetic has a surface with a water contact angle between 30° and 110° (inclusive). The solidified matter of the resin composition for a cosmetic undergoes the volume change by application of the external stimuli to reduce strength of adhesion to the part of living body.
    Type: Application
    Filed: January 31, 2022
    Publication date: March 21, 2024
    Inventors: Tomoko KAWASHIMA, Taiki UMEMOTO, Keitaro AMARI, Yuko TANIIKE, Haruka KUSUKAME, Shinsuke KAWAGUCHI, Toshiyuki KOMATSU
  • Patent number: 11926064
    Abstract: A remote control manipulator system includes: a manipulator being controlled by an operator remotely to handle an object; a stereoscopic display device that displays a right-eye image and a left-eye image so as to be stereoscopically viewed; a model image generator that generates a model image being an image of an integrated three-dimensional model viewed from a viewpoint designated by the operator, the integrated three-dimensional model being a three-dimensional model obtained by integrating the manipulator model and a surrounding environment model being generated by performing image processing on the right-eye image and the left-eye image and being a three-dimensional model of the object and a surrounding environment thereof; and a model image display device that displays the model image and is configured to be able to be viewed by the operator switching between the stereoscopic display device and the model image display device through moving the head of the operator.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: March 12, 2024
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shota Narasaki, Noboru Kawaguchi, Masaki Hirano, Muneharu Kuwata, Masashige Suwa, Toshiyuki Ando, Hitomi Ono, Akihiro Fujie, Yoshitaka Koda, Toru Sato
  • Patent number: 9609793
    Abstract: A electromagnetic shielding film includes a conductive supporting substrate which includes a cured material of a thermosetting resin including a conductive filler; a metal thin film layer which covers one surface of the conductive supporting substrate; a thermosetting adhesive layer which covers a surface of the metal thin film layer; and a peeling substrate which covers the other surface of the conductive supporting substrate.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: March 28, 2017
    Assignee: SHIN-ETSU POLYMER CO., LTD.
    Inventor: Toshiyuki Kawaguchi
  • Patent number: 9493870
    Abstract: Disclosed are a low-cost radio wave-transmitting decorative film which has excellent stretch moldability, radio wave transmissibility, and mirror-like metallic gloss that does not easily disappear, and a decorative member employing the radio wave-transmitting decorative film. Specifically disclosed are a decorative film which includes a first polymer film, a second polymer film, and a light-reflecting layer which is arranged between the polymer films and formed by the physical vapor deposition of an alloy of silicon and a metal, and a decorative member in which the decorative film is provided on the surface of a base.
    Type: Grant
    Filed: March 15, 2010
    Date of Patent: November 15, 2016
    Assignee: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga
  • Patent number: 9187820
    Abstract: There is provided a radio wave transmitting decorative member which has radio wave transmitting properties as well as mirror-surface like metallic luster, the radio wave transmitting decorative member which hardly loses its metallic luster and which can be produced at a low cost. More specifically, disclosed is a radio wave transmitting decorative member including a substrate, and a light reflecting layer provided on top of the substrate and formed of an alloy composed of either silicon or germanium and a metal, wherein the light reflecting layer is preferably a deposition film formed by a physical vapor deposition of an alloy composed of either silicon or germanium and a metal.
    Type: Grant
    Filed: September 18, 2008
    Date of Patent: November 17, 2015
    Assignee: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga
  • Patent number: 9184747
    Abstract: A member for an electrostatic capacitance-type sensor which suppresses a decrease in the variation amount of the electrostatic capacitance caused between an input body and the electrode through a proximate operation or a touch operation by the input body and has a metallic luster appearance which does not degrade with time, and is economical, and an electrostatic capacitance-type sensor using the same. The disclosed member includes a sheet member having an operation surface S on which a proximate operation or a touch operation by an input body is carried out and an electrode which is disposed on the opposite side of the operation surface of the sheet member, in which the sheet member includes a decorative layer having a metallic luster, and the decorative layer is a continuous film made of silicon or an alloy of silicon and a metal.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: November 10, 2015
    Assignee: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Toshiyuki Kawaguchi, Hiroto Komatsu
  • Patent number: 9144152
    Abstract: A cover lay film includes an electromagnetic wave shielding layer formed of a conductive material, a resistor layer having a greater surface resistance than the electromagnetic wave shielding layer, and an insulating resin layer provided between the electromagnetic wave shielding layer and the resistor layer, wherein a plurality of openings penetrating in a thickness direction of the electromagnetic wave shielding layer are provided in the electromagnetic wave shielding layer.
    Type: Grant
    Filed: October 1, 2013
    Date of Patent: September 22, 2015
    Assignee: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga, Minoru Kubota, Masashi Higuchi
  • Patent number: 9018533
    Abstract: Provided are: a cover-lay film which has an electromagnetic wave shielding function and excellent flexibility, enables a reduction in the thickness of a flexible printed wiring board, and eliminates the necessity of connecting a layer for shielding electromagnetic noise, to the ground circuit of the flexible printed wiring board; a method for manufacturing the same; and a flexible printed wiring board. Employed is a cover-lay film including: a base material film which has a roughened surface (textured surface) created on at least a part of one surface, and an unroughened surface (non-textured surface) excluding the roughened surface; and a deposition film made of a conductive material which is formed on a surface of the base material film on the side where the roughened surface has been created.
    Type: Grant
    Filed: March 4, 2010
    Date of Patent: April 28, 2015
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga
  • Patent number: 9006581
    Abstract: A printed wiring board, including a printed wiring member which respectively has object conductor that is subjected to electromagnetic wave shielding on at least one surface of an insulating layer; and an electromagnetic wave shielding member which has an electromagnetic wave shielding layer composed of a low-resistance section and a high-resistance section on at least one surface of a base film. The printed wiring member and the electromagnetic wave shielding member are bonded together with interposition of insulating adhesive layers, and with arrangement of the electromagnetic wave shielding layer separately and in opposition so that the object conductor is covered. The electromagnetic wave shielding layer and the object conductor are composed of the same type of conductive material, and the electromagnetic wave shielding layer is not exposed at the circumferential end faces of the printed wiring board.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: April 14, 2015
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga, Hiroyuki Yasuda
  • Publication number: 20150009637
    Abstract: A electromagnetic shielding film includes a conductive supporting substrate which includes a cured material of a thermosetting resin including a conductive filler; a metal thin film layer which covers one surface of the conductive supporting substrate; a thermosetting adhesive layer which covers a surface of the metal thin film layer; and a peeling substrate which covers the other surface of the conductive supporting substrate.
    Type: Application
    Filed: June 30, 2014
    Publication date: January 8, 2015
    Inventor: Toshiyuki KAWAGUCHI
  • Publication number: 20140314652
    Abstract: The present invention provides a process for continuously producing crystalline hexagonal boron nitride powder having a large particle size and high crystalline. The present invention relates to a process comprising: the first step of heating a boron-containing material and a nitrogen-containing material to obtain crude boron nitride powder having boron nitride content of 80% by weight or higher, and the second step of feeding the crude boron nitride powder and a boron-containing flux component in the content satisfying the following formula (1) with a heat-resistant container, and heating the container including the crude boron nitride powder and the boron-containing flux component at 1550 to 2400° C. in a continuous furnace under the atmosphere of nitrogen gas, to grow hexagonal boron nitride in the form of crystal: formula (1): boron content contained in boron-containing flux component/crude boron nitride content ?1.4 % by weight.
    Type: Application
    Filed: October 24, 2012
    Publication date: October 23, 2014
    Applicant: KANEKA CORPORATION
    Inventors: Kazuaki Matsumoto, Toshiyuki Kawaguchi, Masashi Sakaguchi
  • Patent number: 8816932
    Abstract: The radio wave transmitting decorative member and the method of producing thereof efficiently and stably of the present invention is provided with radio wave transmitting properties as well as mirror-surface like metallic luster, hardly loses its metallic luster, and can be produced at a low cost. The method of producing a radio wave transmitting decorative member, having a substrate, a transparent organic material layer, and a light reflecting layer formed of an alloy composed of either silicon or germanium and a metal provided between the substrate and the transparent organic material layer; wherein the light reflecting layer is formed from a target having an alloy composed of either silicon or germanium, and of a metal with the use of a DC magnetrons sputtering.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: August 26, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga
  • Publication number: 20140098501
    Abstract: A cover lay film includes an electromagnetic wave shielding layer formed of a conductive material, a resistor layer having a greater surface resistance than the electromagnetic wave shielding layer, and an insulating resin layer provided between the electromagnetic wave shielding layer and the resistor layer, wherein a plurality of openings penetrating in a thickness direction of the electromagnetic wave shielding layer are provided in the electromagnetic wave shielding layer.
    Type: Application
    Filed: October 1, 2013
    Publication date: April 10, 2014
    Applicant: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki KAWAGUCHI, Kazutoki TAHARA, Tsutomu SAGA, Minoru KUBOTA, Masashi HIGUCHI
  • Patent number: 8541686
    Abstract: A wiring member including: a copper foil; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness within the range of 5 to 200 nm; an organic polymer film; and an insulating adhesive layer, wherein the insulating adhesive layer is provided between the organic polymer film formed on the noise suppressing layer and the copper foil, or between the noise suppressing layer formed on the organic polymer film and the copper foil. Further, there is provided a method for producing the wiring member.
    Type: Grant
    Filed: April 8, 2009
    Date of Patent: September 24, 2013
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga, Mitsuaki Negishi
  • Patent number: 8507801
    Abstract: A printed wiring board is formed by adhering a coverlay film having a resistance layer formed on a surface of the coverlay film body to a printed wiring board body having a conductive layer formed on a surface of a substrate through an adhesive layer. The resistance layer is separated from and opposed to the conductive layer through the adhesive layer.
    Type: Grant
    Filed: August 18, 2009
    Date of Patent: August 13, 2013
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga
  • Publication number: 20130168142
    Abstract: A wiring member including: a copper foil; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness within the range of 5 to 200 nm; an organic polymer film; and an insulating adhesive layer, wherein the insulating adhesive layer is provided between the organic polymer film formed on the noise suppressing layer and the copper foil, or between the noise suppressing layer formed on the organic polymer film and the copper foil. Further, there is provided a method for producing the wiring member.
    Type: Application
    Filed: April 8, 2009
    Publication date: July 4, 2013
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga, Mitsuaki Negishi
  • Publication number: 20130153392
    Abstract: A member for an electrostatic capacitance-type sensor which suppresses a decrease in the variation amount of the electrostatic capacitance caused between an input body and the electrode through a proximate operation or a touch operation by the input body and has a metallic luster appearance which does not degrade with time, and is economical, and an electrostatic capacitance-type sensor using the same. The disclosed member includes a sheet member having an operation surface S on which a proximate operation or a touch operation by an input body is carried out and an electrode which is disposed on the opposite side of the operation surface of the sheet member, in which the sheet member includes a decorative layer having a metallic luster, and the decorative layer is a continuous film made of silicon or an alloy of silicon and a metal.
    Type: Application
    Filed: August 30, 2011
    Publication date: June 20, 2013
    Inventors: Toshiyuki Kawaguchi, Hiroto Komatsu
  • Publication number: 20130092428
    Abstract: A printed wiring board, including a printed wiring member which respectively has object conductor that is subjected to electromagnetic wave shielding on at least one surface of an insulating layer; and an electromagnetic wave shielding member which has an electromagnetic wave shielding layer composed of a low-resistance section and a high-resistance section on at least one surface of a base film. The printed wiring member and the electromagnetic wave shielding member are bonded together with interposition of insulating adhesive layers, and with arrangement of the electromagnetic wave shielding layer separately and in opposition so that the object conductor is covered. The electromagnetic wave shielding layer and the object conductor are composed of the same type of conductive material, and the electromagnetic wave shielding layer is not exposed at the circumferential end faces of the printed wiring board.
    Type: Application
    Filed: April 11, 2011
    Publication date: April 18, 2013
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga, Hiroyuki Yasuda
  • Patent number: 8416029
    Abstract: The invention provides a transmission noise suppressing structure and a wiring board capable of suppressing a transmission noise transferred through a power supply line, stabilizing a power supply voltage, and reducing signal transmission line cross talk transmitted through the power supply line or a ground layer without being affected by a resistive layer. A transmission noise suppressing structure includes a power supply line and a signal transmission line arranged apart from each other on the same surface; a ground layer arranged apart from the power supply line and the signal transmission line; and a resistive layer arranged apart from the power supply line and the ground layer. The resistive layer has an area (I) which faces the power supply line and an area (II) which does not face the power supply line. The resistive layer and the signal transmission line are apart from each other.
    Type: Grant
    Filed: August 1, 2008
    Date of Patent: April 9, 2013
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga
  • Patent number: 8380080
    Abstract: An optical transceiver of the present invention comprising an OSA, a circuit board, and a flexible substrate connecting these, in which the flexible substrate has high-speed signal lines and other lines other than the high speed signal lines provided separated from each other on the same surface, a ground layer placed apart and opposite these, and a resistive layer placed apart and opposite the high-speed signal lines, the other lines and the ground layer. High-speed signal and the resistive layer are opposite at least a part of the other lines.
    Type: Grant
    Filed: September 4, 2009
    Date of Patent: February 19, 2013
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga