Abstract: Disclosed is a method for electroless metal deposition, which comprises steps of: forming, on the surface of a non-conductive body to be plated, a coating of a resin composition for the electroless metal deposition containing therein a polymer (A) having a chemical structure of at least one compound selected from the group consisting of the below-listed (a), and at least one compound selected from the group of the below-listed (b)1 and (b)2; applying a negative electrostatic voltage to the film coating of the resin composition at a temperature level above the glass transition point of said resin composition; thereafter removing the applied voltage at a temperature lower than the glass transition temperature; and successively carrying out the metal deposition steps inclusive of the catalyst imparting step and the activating step:(a) a chemical structure, in which a part of hydrogen in the main chain of polymer is substituted with the halogen group or the nitrile group, and a chemical structure having a double

Abstract: A local electroless plating process for plastics comprising the steps of: coating the nonplating surface portion of a shaped plastic product with a pasty masking composition comprising a polymer and at least one compound selected from the group consisting of a sulfur compound, nitrogen compound and silicon compound; roughening the surface portion of the plastics product to be plated and applying a catalyst to the rough-surfaced portion; electrolessly plating the plastics product; and removing the polymer coating from the nonplating surface portion of the plastics product.

Abstract: This invention provides a method for forming metallic deposits on a nonconductor to provide a shield against electromagnetic radiation, the method comprising the steps of:(i) subjecting the surface of a nonconductor to pretreatment prior to electroless copper plating,(ii) electrolessly plating the pretreated surface of nonconductor with copper to form a copper layer about 0.5 to about 20 .mu.m in thickness on the surface, and(iii) immersing the copper-coated nonconductor in an electroless Ni plating solution and passing an electric current through the solution with the copper layer serving as the cathode, followed by cutting of current, to deposit as Ni layer 1.0 to about 20 .mu.m on the copper layer.

Abstract: A cooking vessel having an inner container for containing a cooking material and an outer container for receiving the inner container with a circumferential space therebetween. The inner container is provided, on its bottom and side circumference with a large number of holes for connecting the inside areas of the inner and outer containers. The inner container also has openings for ejecting into the inner container foams produced when the cooking material is boiled.